公开(公告)号：US07682456B2

公开(公告)日：2010-03-23

申请号：US11272600

申请日：2005-11-11

申请人： Akio Hashizume

发明人： Akio Hashizume

IPC分类号： B08B3/12 ,  B08B6/00 ,  C25F1/00 ,  C25F3/30

CPC分类号： H01L21/67051

摘要： A substrate treatment method is disclosed, which can effectively reduce the amount of charges accumulated on a substrate due to treatment of the substrate with a water-containing liquid. The method comprises the steps of: supplying a water-containing liquid to a substrate held generally horizontally by a substrate holding/rotating mechanism while rotating the substrate at a first rotation speed; and removing charges from the substrate after the water supplying step by performing a puddle process for a predetermined period by retaining a liquid film of a predetermined liquid on a surface of the substrate held generally horizontally by the substrate holding/rotating mechanism with the substrate being rotated at a second rotation speed lower than the first rotation speed or kept in a non-rotating state without further supplying the predetermined liquid to the liquid film.

摘要翻译： 公开了一种基板处理方法，其可以有效地减少由于用含水液体处理基板而积累在基板上的电荷量。 该方法包括以下步骤：在基板保持/旋转机构基本水平地保持基板的同时以第一转速旋转基板; 并且在供水步骤之后通过在基板保持/旋转机构大致水平地保持基板旋转的基板的表面上保持预定液体的液体膜，通过在预定时间段内进行水泥处理来从基板上去除电荷 在低于第一转速的第二转速下或保持在非旋转状态，而不进一步向液膜供应预定液体。

公开(公告)号：US20070154636A1

公开(公告)日：2007-07-05

申请号：US11565698

申请日：2006-12-01

申请人： Akio Hashizume

发明人： Akio Hashizume

IPC分类号： B05D3/12 ,  B05C11/02 ,  B05B7/06

CPC分类号： H01L21/6708 ,  B05B7/066 ,  G03F7/423 ,  G03F7/427

摘要： According to the substrate processing method of the invention, a mixed fluid obtained by mixing an organic solvent and a gas is supplied to the surface of the substrate. Thereafter, a resist strip liquid to strip off the resist from the surface of the substrate is supplied to the surface of the substrate.

摘要翻译： 根据本发明的基板处理方法，将通过混合有机溶剂和气体得到的混合流体供给到基板的表面。 此后，将从基板表面剥离抗蚀剂的抗蚀剂条液供给到基板的表面。

公开(公告)号：US20080142051A1

公开(公告)日：2008-06-19

申请号：US11957024

申请日：2007-12-14

申请人： Akio Hashizume

发明人： Akio Hashizume

IPC分类号： B08B9/08 ,  B08B3/08 ,  B08B13/00

CPC分类号： H01L21/67051 ,  H01L21/67023 ,  H01L21/6708

摘要： An inventive recovery cup cleaning method is a method for cleaning a recovery cup having an interior wall partitioning a recovery space into which a chemical agent used for treating a substrate is introduced, the recovery cup being configured such that the chemical agent introduced into the recovery space is further introduced into a predetermined chemical agent recovery passage so as to be recovered. The method comprises the steps of: cleaning the interior wall of the recovery space with a cleaning liquid; cleaning the interior wall of the recovery space with a chemical cleaning agent after the step of cleaning with the cleaning liquid, the chemical cleaning agent being of the same type as the chemical agent to be recovered through the recovery space; and draining the cleaning liquid introduced into the recovery space in the step of cleaning with the cleaning liquid and the chemical cleaning agent introduced into the recovery space in the step of cleaning with the chemical cleaning agent through a drain passage which is different from the chemical agent recovery passage.

摘要翻译： 本发明的回收杯清洁方法是一种清洁回收杯的方法，该回收杯具有分隔出用于处理基材的化学试剂引入回收空间的内壁，回收杯被构造成使得引入回收空间的化学试剂 进一步引入到预定的化学试剂回收通道中以回收。 该方法包括以下步骤：用清洗液清洗回收空间的内壁; 在用清洗液清洗步骤之后，用化学清洗剂清洁回收空间的内壁，化学清洗剂与通过回收空间回收的化学试剂相同; 并且在与化学清洁剂不同的排水通道的化学清洗剂的清洗步骤中，在清洗液和引入到回收空间的化学清洗剂的清洗步骤中排出导入回收空间的清洗液。 恢复通道。

公开(公告)号：US20070277856A1

公开(公告)日：2007-12-06

申请号：US11758389

申请日：2007-06-05

申请人： Akio Hashizume

发明人： Akio Hashizume

IPC分类号： B08B3/00

CPC分类号： B08B3/08 ,  G03F7/422 ,  H01L21/31133 ,  H01L21/6708

摘要： A substrate processing method according to the present invention is to be applied for stripping and removing, from the surface of a substrate, a resist no longer required. According to the substrate processing method, a resist stripping liquid is supplied to the center portion of the surface of a substrate held by a substrate holding unit. An organic solvent liquid is supplied to the peripheral edge portion of the surface of the substrate held by the substrate holding unit.

摘要翻译： 根据本发明的基板处理方法应用于从基板的表面剥离和除去不再需要的抗蚀剂。 根据基板处理方法，将抗蚀剂剥离液体供给到由基板保持单元保持的基板的表面的中心部分。 将有机溶剂液体供给到由基板保持单元保持的基板的表面的周缘部。

公开(公告)号：US20070087456A1

公开(公告)日：2007-04-19

申请号：US11548855

申请日：2006-10-12

申请人： Akio Hashizume

发明人： Akio Hashizume

IPC分类号： H01L21/00 ,  B41J2/045

CPC分类号： H01L21/67051 ,  H01L21/6708

摘要： According to the substrate processing method of the invention, a jet of droplets generated from a gas and a heated processing liquid is supplied to the surface of a substrate. A resist stripping liquid to strip off the resist from the surface of the substrate is then supplied to the surface of the substrate.

摘要翻译： 根据本发明的基板处理方法，将从气体和加热处理液体产生的液滴射流供给到基板的表面。 然后将从基板表面剥离抗蚀剂的抗蚀剂剥离液供给到基板的表面。

公开(公告)号：US20050115596A1

公开(公告)日：2005-06-02

申请号：US11026246

申请日：2004-12-29

申请人： Kazuo Nakajima ,  Masanobu Sato ,  Hiroaki Sugimoto ,  Akio Hashizume ,  Hiroki Tsujikawa

发明人： Kazuo Nakajima ,  Masanobu Sato ,  Hiroaki Sugimoto ,  Akio Hashizume ,  Hiroki Tsujikawa

IPC分类号： G02F1/13 ,  B01F3/04 ,  B01F5/04 ,  B08B3/02 ,  B08B3/08 ,  H01L21/00 ,  H01L21/304 ,  H01L21/306

CPC分类号： H01L21/67051 ,  B01F3/04007 ,  B01F3/04985 ,  B01F5/0471 ,  B08B3/02 ,  Y10S134/902

摘要： A soft spray nozzle discharging a cleaning mist is vertically directed and fixed to an arm. A rinse nozzle discharging rinsing deionized water for suppressing obstruction is vertically fixed to the arm at a prescribed distance from the soft spray nozzle. During cleaning, it follows that both nozzles discharge detergents while keeping relative layout relation. Therefore, the discharged cleaning mist and rinsing deionized water do not interfere with each other before reaching the substrate but the used detergents are entirely horizontally splashed and recovered in a cup. Thus, the cleaning mist is prevented from scattering and adhering to the periphery.

摘要翻译： 排出清洁雾的柔软喷雾喷嘴垂直定向并固定在臂上。 将排出冲洗去离子水的冲洗喷嘴用于抑制阻塞物的冲洗喷嘴垂直地固定到距离软喷雾嘴规定距离的臂上。 在清洁过程中，两个喷嘴排出洗涤剂，同时保持相对的布局关系。 因此，排出的清洁雾和冲洗去离子水在到达基底之前不会相互干扰，但是所用的洗涤剂完全水平地溅在杯中并回收。 因此，防止清洁雾散射并附着在周边。