公开(公告)号：US10364496B2

公开(公告)日：2019-07-30

申请号：US13169951

申请日：2011-06-27

申请人： Takayuki Yamagishi

发明人： Takayuki Yamagishi

IPC分类号： C23C16/455 ,  B05C11/10 ,  G05D7/06

摘要： A dual section module with mass flow controllers, for processing wafers, includes: dual process sections integrated together; at least one mass flow controller (MFC) each shared by the dual process sections and provided in a gas line branching into two gas lines, at a branching point, connected to the respective interiors of the dual process sections and arranged symmetrically between the dual process sections; and at least one mass flow controller (MFC) each unshared by the dual process sections and provided in a gas line connected to the interior of each dual process section.

公开(公告)号：US06899507B2

公开(公告)日：2005-05-31

申请号：US10072620

申请日：2002-02-08

申请人： Takayuki Yamagishi ,  Masaei Suwada ,  Takeshi Watanabe

发明人： Takayuki Yamagishi ,  Masaei Suwada ,  Takeshi Watanabe

IPC分类号： C23C16/44 ,  B65G49/07 ,  H01L21/677

CPC分类号： H01L21/67742 ,  H01L21/67748 ,  Y10S414/139

摘要： Semiconductor processing equipment that has increased efficiency, throughput, and stability, as well as reduced operating cost, footprint, and faceprint is provided. Other than during deposition, the atmosphere of both the reaction chamber and the transfer chamber are evacuated using the transfer chamber exhaust port, which is located below the surface of the semiconductor wafer. This configuration prevents particles generated during wafer transfer or during deposition from adhering to the surface of the semiconductor wafer. Additionally, by introducing a purge gas into the transfer chamber during deposition, and by using an insulation separating plate 34, the atmospheres of the transfer and reaction chambers can be effectively isolated from each other, thereby preventing deposition on the walls and components of the transfer chamber. Finally, the configuration described herein permits a wafer buffer mechanism to be used with the semiconductor processing equipment, thereby further increasing throughput and efficiency.

摘要翻译： 提供了提高效率，吞吐量和稳定性以及降低运营成本，占地面积和面部印刷的半导体处理设备。 除了沉积之外，使用位于半导体晶片表面下方的转移室排气口将反应室和转移室的气氛抽真空。 这种构造防止在晶片转移期间或在沉积期间产生的颗粒粘附到半导体晶片的表面。 此外，通过在沉积期间将吹扫气体引入转移室，并且通过使用绝缘分隔板34，可以有效地将转移室和反应室的气氛彼此隔离，从而防止沉积在转移的壁和组分上 房间。 最后，本文描述的配置允许晶片缓冲机构与半导体处理设备一起使用，从而进一步提高吞吐量和效率。

公开(公告)号：US06743329B1

公开(公告)日：2004-06-01

申请号：US09650122

申请日：2000-08-29

申请人： Mitsusuke Kyogoku ,  Takayuki Yamagishi

发明人： Mitsusuke Kyogoku ,  Takayuki Yamagishi

IPC分类号： H01L2100

CPC分类号： H01L21/67757 ,  Y10S414/135 ,  Y10T74/18048

摘要： In a multi-chamber load-locking device which is placed between a loading station which places a wafer cassette which houses semiconductor wafers and a transfer chamber which conveys the semiconductor wafers and in which lock-loading device chamber space is divided into two by the vertical motion of a plate, a device which comprises: sealing means by which the chamber space is selectively divided into two by contacting the plate and a state of no airflow is caused; a cylindrical cam provided with the same axis as that of the chamber; and a rotary actuator dynamically connected with the cylindrical cam, wherein the turning moment of the rotary actuator is converted into the vertical thrust of the axis and the plate rises and descends.

摘要翻译： 在放置在容纳半导体晶片的晶片盒的装载站和传送半导体晶片的传送室之间的多室负载锁定装置中，锁定装置室的空间被垂直方向分成两部分 板的运动，一种装置，其包括：密封装置，通过使所述室空间通过接触所述板选择性地分成两部分，并且引起无气流的状态; 一个圆柱形凸轮，其具有与腔室相同的轴线; 以及与所述圆筒形凸轮动态连接的旋转执行器，其中所述旋转致动器的转动力矩被转换成所述轴的垂直推力并且所述板升高和下降。

公开(公告)号：US06630053B2

公开(公告)日：2003-10-07

申请号：US09932790

申请日：2001-08-17

申请人： Takayuki Yamagishi ,  Masaei Suwada ,  Takeshi Watanabe

发明人： Takayuki Yamagishi ,  Masaei Suwada ,  Takeshi Watanabe

IPC分类号： C23C1600

CPC分类号： H01L21/67745 ,  H01L21/67173 ,  H01L21/67201 ,  H01L21/67748 ,  H01L21/67781 ,  H01L21/68707

摘要： A compact single-wafer-processing semiconductor-manufacturing apparatus for processing semiconductor substrates is characterized in that at least two units, each of which comprises a reactor for growing a film on a semiconductor substrate and a load lock chamber for having the semiconductor substrate wait in a vacuum and which is directly connected with the reactor via a gate valve, are modularized and these modularized reactor units can be configured as a cluster through an atmospheric front end (AFE). Inside the load lock chamber, a substrate transfer mechanism comprising a thin link arm for transferring a semiconductor substrate into the reactor is provided.

公开(公告)号：US06305898B1

公开(公告)日：2001-10-23

申请号：US09354690

申请日：1999-07-16

申请人： Takayuki Yamagishi ,  Masaei Suwada ,  Kazunori Furukawara

发明人： Takayuki Yamagishi ,  Masaei Suwada ,  Kazunori Furukawara

IPC分类号： B25J1500

CPC分类号： H01L21/67766 ,  H01L21/67778 ,  H01L21/68 ,  H01L21/68707

摘要： A transfer mechanism is provided for placing a wafer at a prescribed position on an arm without any additional step. The transfer mechanism for transferring a workpiece into and from a storage section comprises an arm member for holding a workpiece having a projection which can be contacted with an edge of the workpiece at the tip end portion thereof, a movement mechanism for reciprocating the arm member between a retracted and an extended positions while holding the workpiece thereon to transfer the workpiece to and from the storage section, and a positioning member which is positioned in the vicinity of the arm member and can be contacted with the edge of the workpiece for positioning the held workpiece in a prescribed position on the arm member. When the arm member is moved to the retracted position by the movement mechanism, the positioning member comes into contact with the edge of the workpiece held on the arm member to block only the movement of workpiece, thereby placing it in a prescribed location on the arm member.

摘要翻译： 提供了一种传送机构，用于将晶片放置在手臂上的规定位置，而无需任何额外的步骤。 用于将工件传送到存储部分和从存储部分传送工件的传送机构包括用于保持工件的臂部件，该工件具有能够在其前端部处与工件的边缘接触的突起;移动机构，用于使臂部件在 缩回和延伸位置，同时将工件保持在其上以将工件传送到存储部分和从存储部分传送工件;以及定位部件，其定位在臂部件附近并且能够与工件的边缘接触以将所保持的 工件在臂构件上的规定位置。 当通过移动机构将臂构件移动到缩回位置时，定位构件与保持在臂构件上的工件的边缘接触，仅阻挡工件的移动，从而将其放置在臂上的规定位置 会员。

公开(公告)号：US20120325148A1

公开(公告)日：2012-12-27

申请号：US13166367

申请日：2011-06-22

申请人： Takayuki Yamagishi ,  Masaei Suwada ,  Hiroyuki Tanaka

发明人： Takayuki Yamagishi ,  Masaei Suwada ,  Hiroyuki Tanaka

IPC分类号： C23C16/50 ,  C23C16/458

CPC分类号： H01L21/681 ,  H01L21/68742

摘要： A method for positioning wafers in dual wafer transport, includes: simultaneously moving first and second wafers placed on first and second end-effectors to positions over lift pins protruding from first and second susceptors, respectively; and correcting the positions of the first and second wafers without moving any of the lift pins relative to the respective susceptors or without moving the lift pins relative to each other, wherein when the first and second wafers are moved to the respective positions, the distance between the first wafer and tips of the lift pins of the first susceptor is substantially smaller than the distance between the second wafer and tips of the lift pins of the second susceptor.

摘要翻译： 一种用于在双晶片传输中定位晶片的方法，包括：同时将放置在第一和第二端部执行器上的第一和第二晶片移动到分别从第一和第二感受器突出的提升销上的位置; 以及校正第一和第二晶片的位置，而不相对于各个基座移动任何升降销，或者不使提升销相对于彼此移动，其中当第一和第二晶片移动到相应位置时， 第一基座的第一晶片和提升销的尖端基本上小于第二晶片和第二基座的提升销的顶端之间的距离。

公开(公告)号：US20100147396A1

公开(公告)日：2010-06-17

申请号：US12335371

申请日：2008-12-15

申请人： Takayuki Yamagishi ,  Tamihiro Kobayashi

发明人： Takayuki Yamagishi ,  Tamihiro Kobayashi

IPC分类号： B08B9/00 ,  C23C16/54 ,  H01L21/306

CPC分类号： H01L21/67754 ,  C23C16/54 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67742 ,  Y10T137/0402

摘要： A multiple-substrate processing apparatus includes: a reaction chamber comprised of two discrete reaction stations aligned one behind the other for simultaneously processing two substrates; a transfer chamber disposed underneath the reaction chamber, for loading and unloading substrates to and from the reaction stations simultaneously; and a load lock chamber disposed next to the transfer chamber. The transfer arm includes one or more end-effectors for simultaneously supporting two substrates one behind the other as viewed in the substrate-loading/unloading direction.

摘要翻译： 多基板处理装置包括：由两个分立的反应台组成的反应室，所述反应台一个接一个排列，以同时处理两个基板; 设置在反应室下方的传送室，用于同时向反应站装载和卸载基板; 以及设置在传送室旁边的装载锁定室。 传送臂包括一个或多个端部执行器，用于在基板装载/卸载方向上观察时同时支撑两个基板一个在另一个之后。

公开(公告)号：US07690881B2

公开(公告)日：2010-04-06

申请号：US11512637

申请日：2006-08-30

申请人： Takayuki Yamagishi ,  Tamihiro Kobayashi ,  Akira Watanabe ,  Kunihiro Kaneuchi

发明人： Takayuki Yamagishi ,  Tamihiro Kobayashi ,  Akira Watanabe ,  Kunihiro Kaneuchi

IPC分类号： B65G49/07

CPC分类号： H01L21/67745 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/68707 ,  Y10S294/902 ,  Y10S414/141

摘要： A substrate transfer apparatus for loading and unloading substrates in a reaction chamber, includes: an arm having a distal end which is laterally movable in a straight line direction; and end-effectors for loading and unloading substrates in a reaction chamber, which include a lower end-effector and an upper end-effector. One of the lower end-effector or the upper end-effector is movably coupled to the arm at a distal end of the arm, and the other end-effector is fixed to the movably coupled end-effector. The fixed end-effector is fixed to the movably coupled end-effector.

摘要翻译： 一种用于在反应室中装载和卸载基板的基板传送装置，包括：臂，其具有可在直线方向上横向移动的远端; 以及用于在包括下端部执行器和上端部执行器的反应室中装载和卸载基板的端部执行器。 下端部执行器或上端部执行器中的一个在臂的远端可移动地联接到臂上，而另一端部执行器固定到可移动地连接的端部执行器。 固定的末端执行器被固定到可移动地联接的末端执行器。

公开(公告)号：US07467916B2

公开(公告)日：2008-12-23

申请号：US11074820

申请日：2005-03-08

申请人： Takayuki Yamagishi ,  Takeshi Watanabe

发明人： Takayuki Yamagishi ,  Takeshi Watanabe

IPC分类号： B65G49/07

CPC分类号： H01L21/67201 ,  H01L21/67017 ,  H01L21/67778

摘要： A wafer transfer apparatus includes: (A) a mini environment that connects to a wafer storage part and a load lock chamber and is equipped with a transfer robot inside, in order to transfer wafers between the wafer storage part and load lock chamber in the presence of air flows; and (B) a cooling stage that opens and connects to the mini environment from the outside of the mini environment in the vicinity of the connection port of the load lock chamber, in order to temporarily hold a wafer so that the wafer is cooled by the air taken in from the mini environment.

摘要翻译： 晶片传送装置包括：（A）微型环境，其连接到晶片存储部分和负载锁定室，并且在内部配备有传送机器人，以便在存在的情况下在晶片存储部分和装载锁定室之间传送晶片 的气流; 和（B）冷却台，其从负载锁定室的连接口附近的迷你环境的外部打开并连接到迷你环境，以便暂时保持晶片，以便晶片被 空气从迷你环境中吸取。

公开(公告)号：US20060204356A1

公开(公告)日：2006-09-14

申请号：US11074820

申请日：2005-03-08

申请人： Takayuki Yamagishi ,  Takeshi Watanabe

发明人： Takayuki Yamagishi ,  Takeshi Watanabe

IPC分类号： B65G1/133

CPC分类号： H01L21/67201 ,  H01L21/67017 ,  H01L21/67778

摘要： A wafer transfer apparatus includes: (A) a mini environment that connects to a wafer storage part and a load lock chamber and is equipped with a transfer robot inside, in order to transfer wafers between the wafer storage part and load lock chamber in the presence of air flows; and (B) a cooling stage that opens and connects to the mini environment from the outside of the mini environment in the vicinity of the connection port on the load lock chamber, in order to temporarily hold a wafer so that the wafer cooled by the air taken in from the mini environment.

摘要翻译： 晶片传送装置包括：（A）微型环境，其连接到晶片存储部分和负载锁定室，并且在内部配备有传送机器人，以便在存在的情况下在晶片存储部分和装载锁定室之间传送晶片 的气流; 和（B）在负载锁定室的连接口附近从迷你环境的外部开口并连接到迷你环境的冷却台，以暂时保持晶片，使得由空气冷却的晶片 从迷你环境中吸取。