摘要:
A photodiode includes a substrate having a first semiconductor type surface region on at least a portion thereof, and a second semiconductor type surface layer formed in a portion of the surface region. A multi-layer anti-reflective coating (ARC) is on the second semiconductor type surface layer, wherein the multi-layer ARC comprises at least two different dielectric layers. A layer resistant to oxide etch is above a peripheral portion the multi-layer ARC. Further layers are above the layer resistant to oxide etch, and thereby above the peripheral portion the multi-layer ARC. A window extends down to the multi-layer ARC. A photodiode region is formed by a pn-junction of the first semiconductor type surface region and the second semiconductor type surface layer.
摘要:
A CMOS light detector configured to detect specific wavelengths of light includes a first sensor and a second sensor. The first sensor includes CMOS photocells that are covered by a colored filter layer of a first color that has a first transmittance that allows both light of the specific wavelengths and light of other wavelengths to pass. The second sensor including further CMOS photocells, at least some of which are covered by both a colored filter layer of the first color and a colored filter layer of a second color, stacked one above the other in either order, where the colored filter layer of the second color has a second transmittance that allows light of the other wavelengths to pass. The first sensor produces a first photocurrent, and the second sensor produces a second photocurrent, when light including both the specific and other wavelengths is incident upon the detector. A differential photocurrent, produced by determining a difference between the first and second photocurrents, has a spectral response with at least part of the light of other wavelengths cancelled.
摘要:
A photodetector includes one or more first photodiode regions that are covered by an optical filter configured to reject infrared (IR) light and that produce a first current (I1). The photodetector also includes one or more second photodiode regions that are covered by a light blocking material configured to reject visible and infrared light and that produce a second current (I2). The photodetector also includes one or more third photodiode regions that are not covered by the optical filter and are not covered by the light blocking material and that produce a third current (I3). Additionally, the photodetector includes circuitry configured to produce an output indicative of the first current (I1) or a scaled version of the first current (I1), minus the second current (I2) or a scaled version of the second current (I2), minus the third current (I3) or a scaled version of the third current (I3). The optical filter configured to reject IR light can be, e.g., a dielectric reflective optical coating filter, an IR absorption optical coating filter, or a combination thereof.
摘要:
A photodetector includes one or more first photodiode regions that are covered by an optical filter configured to reject infrared (IR) light and that produce a first current (I1). The photodetector also includes one or more second photodiode regions that are covered by a light blocking material configured to reject visible and infrared light and that produce a second current (I2). The photodetector also includes one or more third photodiode regions that are not covered by the optical filter and are not covered by the light blocking material and that produce a third current (I3). Additionally, the photodetector includes circuitry configured to produce an output indicative of the first current (I1) or a scaled version of the first current (I1), minus the second current (I2) or a scaled version of the second current (I2), minus the third current (I3) or a scaled version of the third current (I3). The optical filter configured to reject IR light can be, e.g., a dielectric reflective optical coating filter, an IR absorption optical coating filter, or a combination thereof.
摘要:
A method of a fabricating a multiple wavelength adapted photodiode and resulting photodiode includes the steps of providing a substrate having a first semiconductor type surface region on at least a portion thereof, implanting and forming a second semiconductor type shallow surface layer into the surface region, and forming a multi-layer anti-reflective coating (ARC) on the shallow surface layer. The forming step includes depositing or forming a thin oxide layer on the shallow surface layer and depositing a second dielectric layer different from the thin oxide layer on the thin oxide layer. An etch stop is formed on the second dielectric, wherein the etch stop includes at least one layer resistant to oxide etch. At least one oxide including layer (e.g. ILD) is then deposited on the etch stop. The oxide including layer and etch stop are then removed to expose at least a portion of the ARC to the ambient.
摘要:
A CMOS light detector configured to detect specific wavelengths of light includes a first sensor and a second sensor. The first sensor includes CMOS photocells that are covered by a colored filter layer of a first color that has a first transmittance that allows both light of the specific wavelengths and light of other wavelengths to pass. The second sensor including further CMOS photocells, at least some of which are covered by both a colored filter layer of the first color and a colored filter layer of a second color, stacked one above the other in either order, where the colored filter layer of the second color has a second transmittance that allows light of the other wavelengths to pass. The first sensor produces a first photocurrent, and the second sensor produces a second photocurrent, when light including both the specific and other wavelengths is incident upon the detector. A differential photocurrent, produced by determining a difference between the first and second photocurrents, has a spectral response with at least part of the light of other wavelengths cancelled.
摘要:
A photodiode includes an opening over an active photodiode region so that a top passivation layer and interlayer dielectric layers (ILDs) do not affect the spectral response of the photodiode. A dielectric reflective optical coating filter, which includes a plurality of dielectric layers, fills at least a portion of the opening and thereby covers the active photodiode region, to shape a spectral response of the photodiode. Alternatively, the dielectric reflective optical coating filter is formed prior to the opening, and the opening is formed by removing a top passivation coating and ILDs to expose the dielectric reflective optical coating filter.