摘要:
A photodiode includes a substrate having a first semiconductor type surface region on at least a portion thereof, and a second semiconductor type surface layer formed in a portion of the surface region. A multi-layer anti-reflective coating (ARC) is on the second semiconductor type surface layer, wherein the multi-layer ARC comprises at least two different dielectric layers. A layer resistant to oxide etch is above a peripheral portion the multi-layer ARC. Further layers are above the layer resistant to oxide etch, and thereby above the peripheral portion the multi-layer ARC. A window extends down to the multi-layer ARC. A photodiode region is formed by a pn-junction of the first semiconductor type surface region and the second semiconductor type surface layer.
摘要:
A method of operating a memory device can include accessing at least one memory cell of a memory cell pair formed in opposing vertical sides of an opening by driving at least a first word line common to the memory cell pair to an access voltage to enable a channel conductance in both memory cells of the memory cell pair, driving a selector line, that is vertically aligned with the first word line within the opening, to a selection voltage to enable separate conductive source lines in the opposing vertical sides, and coupling one of the source lines to a source bias voltage and coupling the other of the source lines to a high impedance.
摘要:
A memory device may include a plurality of cell pairs each including insulator regions interposed between opposing sides of at least one common word line gate and first and second vertical sides formed by a spacing within at least one semiconductor material; and at least one selector gate vertically aligned with the word line gate within the spacing configured to enable first and second source regions in the first and second vertical sides, respectively; wherein when the selector gate is enabled, the first and second source regions are connected to different source diffusion regions.
摘要:
A novel lateral super junction device compatible with standard CMOS processing techniques using shallow trench isolation is provided for low- and medium-voltage power management applications. The concept is similar to other lateral super junction devices having N- and P-type implants to deplete laterally to sustain the voltage. However, the use of shallow trench structures provides the additional advantage of reducing the Rdson without the loss of the super junction concept and, in addition, increasing the effective channel width of the device to form a “FINFET” type structure, in which the conducting channel is wrapped around a thin silicon “fin” that forms the body of the device. The device is manufactured using standard CMOS processing techniques with the addition of super junction implantation steps, and the addition of polysilicon within the shallow trench structures to form fin structures.
摘要:
In one aspect, the present invention provides a method for erasing a semiconductor device that comprises applying a voltage pulse at the source of the semiconductor device and a multiple step voltage pulse of the opposite polarity at the gate of the semiconductor device. The multiple step voltage pulse comprises at least a first voltage pulse and a second voltage pulse at the gate of the semiconductor device. The second voltage pulse is usually greater in magnitude than the first voltage pulse. In another aspect, the present invention provides a method for erasing a semiconductor device that comprises applying a substantially constant positive voltage pulse for a first time interval, t1, at the source of the semiconductor device. A first and then a second negative voltage pulse are also applied at the gate of the semiconductor device for a second and third time interval, t2 and t3, respectively. The second negative voltage pulse is greater in magnitude than the first negative voltage pulse. The negative and positive voltage pulses are substantially coincident in time.
摘要:
A novel lateral super junction device compatible with standard CMOS processing techniques using shallow trench isolation is provided for low- and medium-voltage power management applications. The concept is similar to other lateral super junction devices having N- and P-type implants to deplete laterally to sustain the voltage. However, the use of shallow trench structures provides the additional advantage of reducing the Rdson without the loss of the super junction concept and, in addition, increasing the effective channel width of the device to form a “FINFET” type structure, in which the conducting channel is wrapped around a thin silicon “fin” that forms the body of the device. The device is manufactured using standard CMOS processing techniques with the addition of super junction implantation steps, and the addition of polysilicon within the shallow trench structures to form fin structures.
摘要:
A photodiode includes a substrate having a first semiconductor type surface region on at least a portion thereof, and a second semiconductor type surface layer formed in a portion of the surface region. A multi-layer anti-reflective coating (ARC) is on the second semiconductor type surface layer, wherein the multi-layer ARC comprises at least two different dielectric layers. A layer resistant to oxide etch is above a peripheral portion the multi-layer ARC. Further layers are above the layer resistant to oxide etch, and thereby above the peripheral portion the multi-layer ARC. A window extends down to the multi-layer ARC. A photodiode region is formed by a pn-junction of the first semiconductor type surface region and the second semiconductor type surface layer.
摘要:
Techniques for improved erasing of an EPROM are described. As a method, a a drain potential of a first polarity is applied to the drain node of a selected memory cell having a first polarity concurrently with applying a gate potential of a second polarity to the gate of the selected memory cell having a second polarity. The drain and the gate polarities are then maintained until the charge has been removed from the floating gate structure of the selected memory cell as determined by a verification protocol.
摘要:
A flash EPROM cell (10) is disclosed having increased capacitive coupling between a floating gate (28) and a control gate (32). Vertical structural elements (34a and 34b) are formed on field oxide regions (20) on opposing sides of the flash EPROM cell channel 20, in the channel width direction. The structural elements (34a and 34b) include relatively vertical faces. The floating gate (28) conformally cover the channel 20 and the vertical faces of the structural elements (34a and 34b). The control gate (32) conformally covers the floating gate (28). The vertical displacement introduced by the structural elements (34a and 34b) increases the overlap area between the floating gate (28) and the control gate (32) without increasing the overlap area of the floating gate (28) and the channel 20, resulting in increased capacitive coupling between the control gate (32) and the floating gate (28). A process is disclosed which enables the formation of the above structural elements (34a and 34b) with dimensions that are smaller than those normally achievable by the minimum resolution of lithography equipment.
摘要:
An improved, walled-emitter, bipolar transistor and a method for fabricating such a transistor is disclosed. The method includes the step of separately doping the edges of the active base that are adjacent to the isolation oxide in order to increase the doping level at the edges and thus counteract base narrowing that would otherwise be present.