Abstract:
Methods and apparatus for a sensor having non-ratiometric fault trip level setting. In embodiments, a sensor has a sensing element with a fixed gain. A signal processing module receives the fault trip level setting and maintains the fault trip level setting constant during changes in the supply voltage.
Abstract:
An apparatus comprises one or more substrates and one or more coils. At least one of the coils is configured to produce a first magnetic field that induces eddy currents in a conductive target, which generates a reflected magnetic field. One or more magnetic field sensing elements supported by the one or more substrates detect the reflected magnetic field. A conductive support structure supports the one or more substrates. The support structure includes a gap in an area adjacent to the one or more coils so that the support structure does not generate a reflected magnetic field in response to the first magnetic field.
Abstract:
In one aspect, a magnetic field sensor includes a chopper stabilized amplifier and a plurality of Hall-type elements in parallel and connected to the chopper stabilized amplifier. In another aspect, a magnetic field sensor includes a chopper stabilized amplifier and a plurality of Hall quad elements in parallel and connected to the chopper stabilized amplifier. In a further aspect, a current sensor has a bandwidth of 1 MHz and includes a chopper stabilized amplifier and a plurality of Hall quad elements, fabricated in silicon, in parallel and connected to the chopper stabilized amplifier.
Abstract:
The concepts, systems, circuits and techniques described herein are directed toward sensing a voltage transient within a magnetic field sensor integrated circuit, such as a current sensor. A magnetic field sensor integrated circuit includes a substrate having a first surface and a second opposing surface, at least one magnetic field sensing element supported by a first surface of the substrate, an electromagnetic shield layer disposed on a shielded region of the first surface of the substrate adjacent to an unshielded region of the first surface of the substrate and an electrode disposed in the unshielded region of the first surface of the substrate and configured to permit detection of the voltage transient. In some embodiments, the shielded region and/or the electrode can be omitted.
Abstract:
Methods and apparatus for a signal isolator having first and second dies separated by a voltage barrier region, wherein transmit and receive paths of the first and second dies provide bi-directional transfer of feedback and/or diagnostic signals between the first and second die. In embodiments, transmitter refresh signals and receiver refresh signals are exchanged to detect fault conditions.
Abstract:
The linear position of an object is estimated using multiple magnetic field sensors and a magnet. The multiple magnetic field sensors are held in fixed relation to one another and in moving relation with respect to the magnet. Readings of the first and second magnetic field sensors and the fixed distance between the first and second magnetic field sensors may be used to estimate the linear position. In some embodiments, an estimated frequency of an approximately sinusoidal field versus position characteristic is also used as part of the estimation.
Abstract:
The linear position of an object is estimated using multiple magnetic field sensors and a magnet. The multiple magnetic field sensors are held in fixed relation to one another and in moving relation with respect to the magnet. Readings of the first and second magnetic field sensors and the fixed distance between the first and second magnetic field sensors may be used to estimate the linear position. In some embodiments, an estimated frequency of an approximately sinusoidal field versus position characteristic is also used as part of the estimation.
Abstract:
Methods and apparatus for a magnetic field sensor IC package having groups of arrays of TMR elements each having a pinning direction. An on-chip coil is routed under the TMR elements to conduct current for generating a magnetic field to stimulate the TMR elements. The device may be configured to sense changes in an applied magnetic field.
Abstract:
A current sensor IC includes a lead frame having a die attach pad and elongated leads extending in a single direction with respect to the die attach pad, a semiconductor die having a first surface attached to the die attach pad and a second, opposing surface supporting magnetic field sensing elements, and a non-conductive mold material. A first portion of the mold material encloses the semiconductor die and the die attach pad, a second portion of the mold material encloses a portion of the elongated leads, and the mold material further includes a wing structure between the first portion and the second portion. In assembly, the first portion of the mold material extends into a cutout through a current conductor and the wing structure abuts a surface of the conductor. The current sensor can implement differential sensing based on signals from at least two magnetic field sensing elements.
Abstract:
A system is provided comprising: a first target including a plurality of first teeth; and a second target that is coupled to the first target via a mechanical link, the second target including a plurality of second teeth, the second target being disposed above or below the first target, the plurality of first teeth including a different number of teeth than the plurality of second teeth, wherein the first target and the second target are configured to generate respective magnetic fields in response to one or more excitation magnetic fields, the respective magnetic fields being usable to measure a twisting force that is incident on the mechanical link that couples the first target to the second target.