公开(公告)号：US11519946B1

公开(公告)日：2022-12-06

申请号：US17409011

申请日：2021-08-23

Applicant: Allegro MicroSystems, LLC

Inventor： Simon E. Rock ,  Alexander Latham ,  Robert A. Briano ,  Shixi Louis Liu

IPC: G01R19/165 ,  G01R33/07

Abstract: A packaged current sensor integrated circuit includes a primary conductor having an input portion and an output portion configured to carry a current to be measured by a magnetic sensing element supported by a semiconductor die adjacent to the primary conductor. Each of the input portion and output portion of the primary conductor is exposed from orthogonal sides of the package body. A fault signal may be provided to indicate an overcurrent condition in the integrated current sensor package. The primary current path may be made of a thick lead frame material to reduce the primary current path resistance.

公开(公告)号：US20220342007A1

公开(公告)日：2022-10-27

申请号：US17810461

申请日：2022-07-01

Applicant: Allegro MicroSystems, LLC ,  Commissariat à l'énergie atomique et aux énergies alternatives

Inventor： Alexander Latham ,  Claude Fermon ,  Jason Boudreau ,  Myriam Pannetier-Lecoeur ,  Bryan Cadugan ,  Hernán D. Romero

IPC: G01R33/00 ,  G01B7/00 ,  G01D5/14 ,  G01R33/09 ,  G01R33/07

Abstract: A magnetic field sensor includes at least one coil responsive to an AC coil drive signal; at least one magnetic field sensing element responsive to a sensing element drive signal and configured to detect a directly coupled magnetic field generated by the at least one coil and to generate a magnetic field signal in response to the directly coupled magnetic field; a processor responsive to the magnetic field signal to compute a sensitivity value associated with detection of the directly coupled magnetic field and substantially independent of a reflected magnetic field reflected by a conductive target disposed proximate to the at least one magnetic field sensing element; and an output signal generator configured to generate an output signal of the magnetic field sensor indicative of the reflected magnetic field.

公开(公告)号：US11115084B2

公开(公告)日：2021-09-07

申请号：US16200799

申请日：2018-11-27

Applicant: Allegro MicroSystems, LLC ,  Commissariat à l'énergie atomique et aux énergies alternatives

Inventor： Alexander Latham ,  Claude Fermon ,  Myriam Pannetier-Lecoeur

IPC: H04B5/00

Abstract: Methods and apparatus for providing data transfer with a drive coil to transmit information, a receive coil magnetically coupled to the drive coil, and a first magnetoresistive sensor proximate the receive coil to detect information from the receive coil. In embodiments, the drive and receive coils are separated by an isolation material. In embodiments, a signal isolator IC packages includes transmit and receive coils and a magnetic field sensing element coupled to the receive coil.

公开(公告)号：US20210223292A1

公开(公告)日：2021-07-22

申请号：US16884311

申请日：2020-05-27

Applicant: Allegro MicroSystems, LLC

Inventor： Shixi Louis Liu ,  Paul A. David ,  Shaun D. Milano ,  Rishikesh Nikam ,  Alexander Latham ,  Wade Bussing ,  Natasha Healey ,  Georges El Bacha

IPC: G01R15/08 ,  H01L43/06 ,  H01L43/04

Abstract: A current sensor integrated circuit (IC) includes a unitary lead frame having at least one first lead having a terminal end, at least one second lead having a terminal end, and a paddle having a first surface and a second opposing surface. A semiconductor die is supported by the first surface of the paddle, wherein the at least one first lead is electrically coupled to the semiconductor die and the at least one second lead is electrically isolated from the semiconductor die. The current sensor IC further includes a first mold material configured to enclose the semiconductor die and the paddle and a second mold material configured to enclose at least a portion of the first mold material, wherein the terminal end of the at least one first lead and the terminal end of the at least one second lead are external to the second mold material.

公开(公告)号：US10914765B1

公开(公告)日：2021-02-09

申请号：US16527636

申请日：2019-07-31

Applicant: Allegro MicroSystems, LLC

Inventor： Wade Bussing ,  Alexander Latham

IPC: G01R15/20 ,  H01L43/02 ,  H01L43/08 ,  H01L43/06

Abstract: A current sensor can include a lead frame. The lead frame can include a first lead and a second lead, wherein the first and second leads are coupled together at a first junction region of the lead frame, wherein the current sensor is operable to sense a magnetic field generated by a first current passing through the first junction region. The current sensor can further include a first die disposed proximate to the lead frame. The first die can include a first magnetic field sensing element disposed on a surface of the first die, a first circuit coupled to the first magnetic field sensing element for generating a first signal indicative of a first current, and a first node coupled to the first signal. The current sensor can further include a second die disposed proximate to the lead frame. The second die can include a second magnetic field sensing element disposed on a surface of the second die, a second circuit coupled to the second magnetic field sensing element for generating a second signal indicative of the first current passing through the first junction region or indicative of a second current passing through the lead frame and a second node coupled to the second signal.

公开(公告)号：US20210018576A1

公开(公告)日：2021-01-21

申请号：US16512680

申请日：2019-07-16

Applicant: Allegro MicroSystems, LLC

Inventor： Alexander Latham ,  Evan Shorman

IPC: G01R33/07 ,  G01R33/00 ,  H05K9/00

Abstract: A magnetic field sensor includes a substrate, a first channel comprising a first magnetic field sensing element supported by the substrate and configured to generate a first magnetic field signal indicative of a first magnetic field experienced by the first magnetic field sensing element, a second channel comprising a second magnetic field sensing element supported by the substrate and configured to generate a second magnetic field signal indicative of a second magnetic field experienced by the second magnetic field sensing element, and at least one shield configured to reduce a bandwidth of the first magnetic field by a first amount and to reduce a bandwidth of the second magnetic field by a second amount. The shield is able to act as a magnetic anti-aliasing filter for the magnetic field sensing elements, which can then be chopped or sampled.

公开(公告)号：US20200241084A1

公开(公告)日：2020-07-30

申请号：US16851473

申请日：2020-04-17

Applicant: Allegro MicroSystems, LLC

Inventor： Alexander Latham ,  Michael C. Doogue ,  Jason Boudreau

IPC: G01R33/00 ,  G01R33/025 ,  G01R33/032 ,  G01R33/12 ,  G01N27/90 ,  H01F5/00

Abstract: An apparatus comprises a first substrate and two coils supported by the first substrate and arranged next to each other, the coils configured to each generate a magnetic field which produces eddy currents in and a reflected magnetic field from a conductive target, the two coils arranged so their respectively generated magnetic fields substantially cancel each other in an area between the coils. One or more magnetic field sensing elements are positioned in the area between the coils and configured to detect the reflected magnetic field.

公开(公告)号：US20190285667A1

公开(公告)日：2019-09-19

申请号：US16421982

申请日：2019-05-24

Applicant: Allegro MicroSystems, LLC

Inventor： Shaun D. Milano ,  Bryan Cadugan ,  Michael C. Doogue ,  Alexander Latham ,  William P. Taylor ,  Harianto Wong ,  Sundar Chetlur

IPC: G01R15/14 ,  G01R15/20 ,  G01R19/00

Abstract: Systems and methods described herein are directed towards integrating a shield layer into a current sensor to shield a magnetic field sensing element and associated circuitry in the current sensor from electrical, voltage, or electrical transient noise. In an embodiment, a shield layer may be disposed along at least one surface of a die supporting a magnetic field sensing element. The shield layer may be disposed in various arrangements to shunt noise caused by a parasitic coupling between the magnetic field sensing element and the current carrying conductor away from the magnetic field sensing element.

公开(公告)号：US20190265018A1

公开(公告)日：2019-08-29

申请号：US16282539

申请日：2019-02-22

Applicant: Allegro MicroSystems, LLC

Inventor： Alexander Latham ,  Maxim Klebanov

IPC: G01B7/30 ,  G01R33/00 ,  G01R33/028 ,  G01R33/06

Abstract: Methods and apparatus for a sensor with a main coil to direct a magnetic field at a rotating target for inducing eddy currents in an end of the target and a sensing element to detect a magnetic field reflected from the target, wherein the target end comprises a conductive surface. The reflected magnetic field can be processed to determine an angular position of the target.

公开(公告)号：US10310028B2

公开(公告)日：2019-06-04

申请号：US15606362

申请日：2017-05-26

Applicant: Allegro MicroSystems, LLC ,  COMMISSARIAT À L'ÉNERGIE ATOMIQUE ET AUX ÉNERGIES ALTERNATIVES

Inventor： Alexander Latham ,  Michael C. Doogue ,  Claude Fermon ,  Xavier Du Hamel De Milly ,  Myriam Pannetier-Lecoeur

IPC: G01R33/07 ,  G01R33/00 ,  G01R33/09 ,  G01R33/30 ,  G01L9/00 ,  G01L13/02

Abstract: A pressure sensor includes a chamber comprising a conductive portion and a deformable portion coupled to the conductive portion and susceptible to deformation in response to a pressure differential between an interior of the chamber and an exterior of the chamber; at least one coil responsive to an AC coil drive signal; at least one magnetic field sensing element disposed proximate to the at least one coil and to the conductive portion of the chamber and configured to generate a magnetic field signal in response to a reflected magnetic field generated by the at least one coil and reflected by the conductive portion; and a circuit coupled to the at least one magnetic field sensing element to generate an output signal of the pressure sensor indicative of the pressure differential between the interior of the chamber and the exterior of the chamber in response to the magnetic field signal.