Abstract:
An integrated circuit package includes a lead frame having a first surface, a second opposing surface, at least one die attach portion configured to support at least one die, and a plurality of leads, wherein at least one of the leads has a raised feature extending along a portion of a length of the lead.
Abstract:
A magnetic field sensor includes a lead frame, a semiconductor die having a first surface in which a magnetic field sensing element is disposed and a second surface attached to the lead frame, and a non-conductive mold material enclosing the die and at least a portion of the lead frame. The sensor may include a ferromagnetic mold material secured to a portion of the non-conductive mold material. Features include a multi-sloped taper to an inner surface of a non-contiguous central region of the ferromagnetic mold material, a separately formed element disposed in the non-contiguous central region, one or more slots in the lead frame, a molded ferromagnetic suppression device spaced from the non-conductive mold material and enclosing a portion of a lead, a passive device spaced from the non-conductive mold material and coupled to a plurality of leads, and a ferromagnetic bead coupled to a lead. Also described is a coil secured to the non-conductive mold material and a lead having at least two separated portions with a passive component coupled across the two portions.
Abstract:
In an embodiment, a magnetic field sensor comprises a substrate and a first magnetoresistive element supported by the substrate. The magnetic field sensor also includes a second magnetoresistive element supported by the substrate and coupled in series with the first magnetoresistive element to form a voltage node between the first and second magnetoresistive elements, and at which an output voltage is provided that changes in response to an external magnetic field. The magnetic field sensor also includes a magnetic source that produces a local magnetic field having a strength sufficient to bias the first magnetoresistive element to a resistive value that is substantially resistant to changing in response to the external magnetic field. In embodiments, additional magnetoresistive elements are included to form an H-bridge circuit.
Abstract:
A magnetic field sensor has a plurality of magnetic field sensing elements and operates as a motion detector for sensing a rotation or other movement of a target object.
Abstract:
A magnet includes a magnetic body having a length and width. The body has a first notch in one side and extending along at least a portion of the length of the body, and a second notch in an opposite side of the body extending along at least a portion of the length of the body. A magnetic field produced by the body has a substantially uniform magnetic flux along at least a portion of the length of the body. A system for detecting a target includes one or more magnetic field sensing elements positioned within the portion of the magnetic field having substantially uniform flux.
Abstract:
Novel anisotropic magneto-resistive (AMR) sensor architectures and techniques for fabricating same are described. In some embodiments, AMR sensors having barber pole structures disposed below corresponding AMR sensing elements are provided. AMR sensors having segmented AMR sensing elements are also described. Fabrication techniques that can be used to fabricate such sensors are also described. Fabrication techniques are also described that can reduce the risk of contamination during AMR sensor fabrication.
Abstract:
An apparatus and a method provide an output signal indicative of a speed of rotation and a direction of rotation of a ferromagnetic object capable of rotating. A variety of signal formats of the output signal are described.
Abstract:
A sensor includes a lead frame having a first surface, a second opposing surface, and a plurality of leads and a semiconductor die having a first surface attached to the first surface of the lead frame and a second, opposing surface. The sensor further includes a non-conductive mold material enclosing the die and at least a portion of the lead frame, a conductive coil secured to the non-conductive mold material, a mold material secured to the non-conductive mold material and enclosing the conductive coil, wherein the mold material has a central region and an element disposed in the central region of the mold material.
Abstract:
A current sensor integrated circuit configured to sense a current through a current conductor includes a lead frame at least one signal lead, a fan out wafer level package (FOWLP), and a mold material enclosing the FOWLP and a portion of the lead frame. The FOWLP includes a semiconductor die configured to support at least one magnetic field sensing element to sense a magnetic field associated with the current, wherein the semiconductor die has a first surface on which at least one connection pad is accessible, a redistribution layer in contact with the at least one connection pad, and an insulating layer in contact with the redistribution layer, wherein the insulating layer is configured to extend beyond a periphery of the semiconductor die by a minimum distance. The die connection pad is configured to be electrically coupled to the at least one signal lead.
Abstract:
Methods and apparatus for a magnetic field sensor for measuring movement of a target including a substrate and a magnet. A first bridge structure has first and second pluralities of magnetic field sensing elements spaced from each other. An axis of sensitivity of the magnetic field sensing elements is rotated at a predetermined angle with respect to an axis of rotation of the target to generate an output signal corresponding to the position of the target and a change in a property of the magnetic field generated by the magnet.