公开(公告)号：US20220317805A1

公开(公告)日：2022-10-06

申请号：US17709251

申请日：2022-03-30

Applicant: Apple Inc.

Inventor： Marcus C. Yip ,  Brian M. King ,  Jason S. Griesbach ,  Ehsan Khajeh ,  Aaron S. Tucker ,  Andrew W. Joyce ,  Giovanni Gozzini ,  Mohammad Yeke Yazdandoost ,  Gordon S. Franza

IPC: G06F3/043 ,  G06F3/041

Abstract: An acoustic imaging system coupled to an acoustic medium to define an imaging surface. The acoustic imaging system includes an array of piezoelectric acoustic transducers formed at least in part from a thin-film piezoelectric material, such as PVDF. The array is coupled to the acoustic medium opposite the imaging surface and formed using a thin-film manufacturing process over an application-specific integrated circuit that, in turn, is configured to leverage on or more beamforming scan operations to drive the array of piezoelectric actuators to generate an image of an object at least partially wetting to the imaging surface.

公开(公告)号：US20210296562A1

公开(公告)日：2021-09-23

申请号：US17210023

申请日：2021-03-23

Applicant: Apple Inc.

Inventor： Ehsan Khajeh ,  Aaron S. Tucker ,  Andrew W. Joyce ,  Brian M. King ,  Giovanni Gozzini ,  Jason S. Griesbach ,  Marcus C. Yip ,  Mohammad Yeke Yazdandoost ,  Gordon S. Franza ,  Henry H. Yang

IPC: H01L41/047 ,  H01L41/08 ,  H01L41/09

Abstract: An acoustic imaging system coupled to a sensing plate to define an imaging surface. The acoustic imaging system includes an array of piezoelectric acoustic transducers coupled to the sensing plate opposite the imaging surface and formed using a thin-film manufacturing process over an application-specific integrated circuit that, in turn, is configured to leverage the array of piezoelectric actuators to generate an image of an object at least partially wetting to the imaging surface.

公开(公告)号：US20250060851A1

公开(公告)日：2025-02-20

申请号：US18936372

申请日：2024-11-04

Applicant: Apple Inc.

Inventor： Andrew Deng ,  Timothy D. Koch ,  Hui-Shan Chang ,  Andrew W. Joyce ,  Henry H. Yang ,  Ran Xu ,  Patrick E. O'Brien ,  Yu Hsuan Chao ,  Dale Setlak ,  Giovanni Gozzini

IPC: G06F3/044 ,  G06F3/041

Abstract: A biometric input system for an electronic device is provided. The biometric input system may be a fingerprint sensing system. The biometric input system includes a biometric sensing component, which may be a capacitive sensing component. The biometric input system also includes a composite cover element, which may be a dielectric cap or coating, and the biometric sensing component is capable of receiving a biometric input from a user through the composite cover element. Electronic devices including the biometric input system are also provided.

公开(公告)号：US20240280676A1

公开(公告)日：2024-08-22

申请号：US18645177

申请日：2024-04-24

Applicant: Apple Inc.

Inventor： Gordon S. Franza ,  Gregory T. Minteer ,  Mohammad Yeke Yazdandoost ,  Dale Setlak ,  Marcus C. Yip ,  Ehsan Khajeh ,  Aaron S. Tucker ,  Andrew W. Joyce ,  Brian M. King ,  Giovanni Gozzini ,  Jason S. Griesbach

IPC: G01S7/52 ,  G01S15/89 ,  G10K11/34

CPC classification number: G01S7/52033 ,  G01S7/52025 ,  G01S7/52036 ,  G01S15/8925 ,  G10K11/346 ,  G01S15/892 ,  G01S15/8927

Abstract: An acoustic imaging system coupled to an acoustic imaging medium to define an imaging surface. The acoustic imaging system includes an array of piezoelectric acoustic transducers formed at least in part from a thin-film piezoelectric material, such as PVDF. The array is coupled to the acoustic imaging medium opposite the imaging surface and formed using a thin-film manufacturing process over an application-specific integrated circuit that, in turn, is configured to leverage the array of piezoelectric actuators to generate an image of an object at least partially wetting to the imaging surface.

公开(公告)号：US12039800B2

公开(公告)日：2024-07-16

申请号：US17709235

申请日：2022-03-30

Applicant: Apple Inc.

Inventor： Gordon S. Franza ,  Mohammad Yeke Yazdandoost ,  Dale Setlak ,  Marcus C. Yip ,  Ehsan Khajeh ,  Aaron S. Tucker ,  Andrew W. Joyce ,  Brian M. King ,  Giovanni Gozzini ,  Jason S. Griesbach ,  Henry H. Yang

IPC: G06V40/13 ,  B06B1/02 ,  B06B1/06 ,  G06F3/043

CPC classification number: G06V40/1306 ,  B06B1/0215 ,  B06B1/0692 ,  G06F3/0433 ,  G06F3/0436 ,  B06B2201/70

Abstract: An acoustic imaging system coupled to an acoustic medium to define an imaging surface. The acoustic imaging system includes an array of piezoelectric acoustic transducers formed at least in part from a thin-film piezoelectric material, such as PVDF. The array is coupled to the acoustic medium opposite the imaging surface and formed using a thin-film manufacturing process over an application-specific integrated circuit that, in turn, is configured to leverage the array of piezoelectric actuators to generate an image of an object at least partially wetting to the imaging surface.

公开(公告)号：US12000967B2

公开(公告)日：2024-06-04

申请号：US17709270

申请日：2022-03-30

Applicant: Apple Inc.

Inventor： Gordon S. Franza ,  Gregory T. Minteer ,  Mohammad Yeke Yazdandoost ,  Dale Setlak ,  Marcus C. Yip ,  Ehsan Khajeh ,  Aaron S. Tucker ,  Andrew W. Joyce ,  Brian M. King ,  Giovanni Gozzini ,  Jason S. Griesbach

IPC: G01S7/52 ,  G01S15/89 ,  G10K11/34

CPC classification number: G01S7/52033 ,  G01S7/52025 ,  G01S7/52036 ,  G01S15/8925 ,  G10K11/346 ,  G01S15/892 ,  G01S15/8927

Abstract: An acoustic imaging system coupled to an acoustic imaging medium to define an imaging surface. The acoustic imaging system includes an array of piezoelectric acoustic transducers formed at least in part from a thin-film piezoelectric material, such as PVDF. The array is coupled to the acoustic imaging medium opposite the imaging surface and formed using a thin-film manufacturing process over an application-specific integrated circuit that, in turn, is configured to leverage the array of piezoelectric actuators to generate an image of an object at least partially wetting to the imaging surface.

公开(公告)号：US11950512B2

公开(公告)日：2024-04-02

申请号：US17210023

申请日：2021-03-23

Applicant: Apple Inc.

Inventor： Ehsan Khajeh ,  Aaron S. Tucker ,  Andrew W. Joyce ,  Brian M. King ,  Giovanni Gozzini ,  Jason S. Griesbach ,  Marcus C. Yip ,  Mohammad Yeke Yazdandoost ,  Gordon S. Franza ,  Henry H. Yang

IPC: H10N30/87 ,  H10N30/00 ,  H10N30/20

CPC classification number: H10N30/878 ,  H10N30/10516 ,  H10N30/2047

Abstract: An acoustic imaging system coupled to a sensing plate to define an imaging surface. The acoustic imaging system includes an array of piezoelectric acoustic transducers coupled to the sensing plate opposite the imaging surface and formed using a thin-film manufacturing process over an application-specific integrated circuit that, in turn, is configured to leverage the array of piezoelectric actuators to generate an image of an object at least partially wetting to the imaging surface.

公开(公告)号：US11275475B2

公开(公告)日：2022-03-15

申请号：US17141658

申请日：2021-01-05

Applicant: Apple Inc.

Inventor： Daniel J. Bechstein ,  Collin R. Petty ,  Martin P. Grunthaner ,  Andrew W. Joyce ,  John R. Matthews ,  Pavan O. Gupta ,  Albert Lin

IPC: G06F3/044

Abstract: A compliant material, such as a conductive foam, is positioned in the dielectric or capacitive gap between drive and sense electrodes and/or other conductive elements of a capacitive and/or other force sensor, such as a TFT or other display element and a sensor assembly. The compliant material prevents damage by preventing and/or cushioning contact. The compliant material may be conductive. By being conductive and being positioned between the electrodes while still being separated from one or more of the electrodes, the compliant material also shortens the effective electrical distance between the electrodes. As a result, the force sensor may be more sensitive than would otherwise be possible while being less vulnerable to damage.

公开(公告)号：US20210312153A1

公开(公告)日：2021-10-07

申请号：US17020564

申请日：2020-09-14

Applicant: Apple Inc.

Inventor： Stephanie Y. Su ,  Brittany Judoprasetijo ,  Andrew Deng ,  Dale Setlak ,  Carli E. Oster ,  Melody L. Kuna ,  Andrew W. Joyce ,  Ran Xu

IPC: G06K9/00

Abstract: A portable electronic device can include a housing defining an aperture and a display positioned in the aperture. The display and the housing can define an internal volume and a speaker assembly can be positioned in the internal volume. The speaker assembly can include a speaker enclosure sealed to the housing within the internal volume, the speaker enclosure and the housing defining a speaker volume, and a speaker module in fluid communication with the speaker volume, the speaker module including a diaphragm positioned at an aperture defined by the speaker volume, the diaphragm defining multiple ridges.

公开(公告)号：US10921943B2

公开(公告)日：2021-02-16

申请号：US16399958

申请日：2019-04-30

Applicant: Apple Inc.

Inventor： Daniel J. Bechstein ,  Collin R. Petty ,  Martin P. Grunthaner ,  Andrew W. Joyce ,  John R. Matthews ,  Pavan O. Gupta ,  Albert Lin

IPC: G06F3/044

Abstract: A compliant material, such as a conductive foam, is positioned in the dielectric or capacitive gap between drive and sense electrodes and/or other conductive elements of a capacitive and/or other force sensor, such as a TFT or other display element and a sensor assembly. The compliant material prevents damage by preventing and/or cushioning contact. The compliant material may be conductive. By being conductive and being positioned between the electrodes while still being separated from one or more of the electrodes, the compliant material also shortens the effective electrical distance between the electrodes. As a result, the force sensor may be more sensitive than would otherwise be possible while being less vulnerable to damage.