公开(公告)号：US20240307035A1

公开(公告)日：2024-09-19

申请号：US18668668

申请日：2024-05-20

申请人： Exo Imaging, Inc.

发明人： Sandeep AKKARAJU ,  Haesung KWON ,  Yusuf HAQUE ,  Janusz BRYZEK

IPC分类号： A61B8/00 ,  A61B8/08 ,  A61B8/14 ,  B06B1/02 ,  B06B1/06 ,  G01S7/52 ,  G01S7/521 ,  G01S15/89 ,  H10N30/20 ,  H10N30/88

CPC分类号： A61B8/4494 ,  A61B8/0883 ,  A61B8/145 ,  A61B8/4483 ,  A61B8/4488 ,  A61B8/461 ,  A61B8/488 ,  A61B8/5207 ,  A61B8/546 ,  B06B1/0215 ,  B06B1/0238 ,  B06B1/0629 ,  B06B1/0662 ,  B06B1/0692 ,  G01S7/52046 ,  G01S7/52079 ,  G01S7/521 ,  G01S15/8925 ,  H10N30/2047 ,  H10N30/2048 ,  H10N30/704 ,  H10N30/88 ,  A61B8/4427 ,  A61B8/4472 ,  B06B2201/76

摘要： An imaging system includes: a transceiver cell for generating a pressure wave and converting an external pressure wave into an electrical signal; and a control unit for controlling an operation of the transceiver cell. The transceiver cell includes: a substrate; at least one membrane suspending from the substrate; and a plurality of transducer elements mounted on the at least one membrane. Each of the plurality of transducer elements has a bottom electrode, a piezoelectric layer on bottom electrode, and at least one top electrode on the piezoelectric layer. Each of the plurality of transducer element generates a bending moment in response to applying an electrical potential across the bottom electrode and the at least one top electrode and develops an electrical charge in response to a bending moment due to the external pressure wave.

公开(公告)号：US20240023932A1

公开(公告)日：2024-01-25

申请号：US18477995

申请日：2023-09-29

申请人： FUJIFILM Corporation

发明人： Takatoshi HASE

IPC分类号： A61B8/00 ,  B06B1/06

CPC分类号： A61B8/4444 ,  B06B1/0692

摘要： An ultrasound includes: an acoustic matching portion disposed on a plurality of piezoelectric elements; and a conductive member disposed on the plurality of piezoelectric elements and adjacent to the acoustic matching portion, in which the conductive member includes a conductor layer having a multi-layer structure, which is disposed on at least one end side of the acoustic matching portion in a second direction intersecting the first direction, the conductor layer having a multi-layer structure includes a plurality of first conductor layers respectively bonded to the second conductive portions of the piezoelectric elements, and a second conductor layer laminated on the plurality of first conductor layers and electrically connects the plurality of first conductor layers, and a ratio of a thickness to a width, which is a length in the first direction, of the first conductor layer is 1.6 or less.

公开(公告)号：US11833543B2

公开(公告)日：2023-12-05

申请号：US16512429

申请日：2019-07-16

申请人： Murata Manufacturing Co., Ltd.

发明人： Motoyasu Nakao ,  Kosuke Watanabe

IPC分类号： B06B1/02 ,  B06B1/06

CPC分类号： B06B1/0215 ,  B06B1/0692 ,  B06B2201/40

摘要： An ultrasonic apparatus includes a transmitting circuit, an ultrasonic transducer, a receiving circuit, and a capacitance measuring circuit. The ultrasonic transducer is a three-terminal ultrasonic transducer that includes a transmitting electrode, a receiving electrode, and a common electrode. The transmitting circuit outputs a driving signal to the transmitting electrode to cause the ultrasonic transducer to transmit ultrasonic waves. The receiving circuit receives a receive signal from the receiving electrode. The capacitance measuring circuit is electrically connected to the receiving electrode to measure the electrostatic capacitance of the ultrasonic transducer.

公开(公告)号：US20180161816A1

公开(公告)日：2018-06-14

申请号：US15834531

申请日：2017-12-07

申请人： Seiko Epson Corporation

发明人： Chikara KOJIMA

IPC分类号： B06B1/06 ,  H01L41/053 ,  A61B8/14 ,  A61B8/00

CPC分类号： B06B1/0629 ,  A61B8/04 ,  A61B8/085 ,  A61B8/14 ,  A61B8/145 ,  A61B8/4281 ,  A61B8/4422 ,  A61B8/4427 ,  A61B8/4488 ,  A61B8/4494 ,  A61B8/54 ,  B06B1/0622 ,  B06B1/0692 ,  H01L41/0533

摘要： An ultrasonic device includes: a substrate including a first groove portion and a second groove portion in a first surface; a vibration film provided on the first surface and closing the first groove portion and the second groove portion; a first piezoelectric element provided on the vibration film and overlapping the first groove portion in a plan view as viewed in a thickness direction of the substrate; and a second piezoelectric element provided on the vibration film and overlapping the second groove portion in the plan view. The substrate is provided with a third groove portion coupling the first groove portion to the second groove portion. The substrate is provided with a fourth groove portion extending in a direction away from the first piezoelectric element and the second piezoelectric element in the plan view and coupled to the third groove portion. A hole portion coupling a second surface of the substrate that is opposed to the first surface to the fourth groove portion is provided.

公开(公告)号：US20180153512A1

公开(公告)日：2018-06-07

申请号：US15820319

申请日：2017-11-21

申请人： EXO IMAGING INC.

发明人： Sandeep Akkaraju ,  Haesung Kwon ,  Yusuf Haque ,  Janusz Bryzek

IPC分类号： A61B8/00 ,  B06B1/06 ,  B06B1/02 ,  G01S7/52 ,  A61B8/08 ,  A61B8/14

CPC分类号： A61B8/4494 ,  A61B8/0883 ,  A61B8/145 ,  A61B8/4427 ,  A61B8/4472 ,  A61B8/4483 ,  A61B8/4488 ,  A61B8/461 ,  A61B8/488 ,  A61B8/5207 ,  A61B8/546 ,  B06B1/0215 ,  B06B1/0238 ,  B06B1/0629 ,  B06B1/0662 ,  B06B1/0692 ,  B06B2201/76 ,  G01S7/52046 ,  G01S7/52079 ,  G01S7/521 ,  G01S15/8925 ,  H01L41/053 ,  H01L41/0805 ,  H01L41/0973 ,  H01L41/098

摘要： An imaging system includes: a transceiver cell for generating a pressure wave and converting an external pressure wave into an electrical signal; and a control unit for controlling an operation of the transceiver cell. The transceiver cell includes: a substrate; at least one membrane suspending from the substrate; and a plurality of transducer elements mounted on the at least one membrane. Each of the plurality of transducer elements has a bottom electrode, a piezoelectric layer on bottom electrode, and at least one top electrode on the piezoelectric layer. Each of the plurality of transducer element generates a bending moment in response to applying an electrical potential across the bottom electrode and the at least one top electrode and develops an electrical charge in response to a bending moment due to the external pressure wave.

公开(公告)号：US20180078970A1

公开(公告)日：2018-03-22

申请号：US15437963

申请日：2017-02-21

申请人： Kabushiki Kaisha Toshiba

发明人： Tomio ONO ,  Kazuhiro ITSUMI ,  Kazuhiko HIGUCHI

IPC分类号： B06B1/06 ,  H01L41/053 ,  H01L41/047 ,  A61B8/00

CPC分类号： B06B1/0629 ,  A61B8/4272 ,  A61B8/4483 ,  A61B8/54 ,  B06B1/0603 ,  B06B1/0692 ,  H01L41/0475 ,  H01L41/0533 ,  H01L41/0973 ,  H01L41/313

摘要： A piezoelectric device according to an embodiment comprises a piezoelectric thin film, a first electrode disposed on a first surface of the piezoelectric thin film, a substrate provided with an electrode pad, a plurality of pillar-shaped first supporting members provided between a second surface on an opposite side of the first surface of the piezoelectric thin film and the electrode pad of the substrate so as to fix the piezoelectric thin film onto the substrate, and a plurality of second electrodes electrically connected to the electrode pad from a part of the second surface of the piezoelectric thin film via a lateral surface of the first supporting member. The piezoelectric thin film, the first electrode, and the second electrodes compose a plurality of diaphragms each of which is a transducer element. The first supporting members are provided at locations at which the respective diaphragms are sectioned. The first electrode is provided in common to the diaphragms.

公开(公告)号：US20050264133A1

公开(公告)日：2005-12-01

申请号：US11136223

申请日：2005-05-24

申请人： Jeffrey Ketterling ,  Frederic Lizzi

发明人： Jeffrey Ketterling ,  Frederic Lizzi

IPC分类号： B06B1/06 ,  H01L41/08

CPC分类号： B06B1/0692 ,  Y10S310/80 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/53109

摘要： Techniques for fabricating high frequency ultrasound transducers are provided herein. In one embodiment, the fabrication includes depositing a copperclad polyimide film, a layer of epoxy on the copperclad polyimide film, and a polyvinylidene fluoride film on the epoxy. The assembly of materials are then pressed to bond the polyvinylidene fluoride film to the copperclad polyimide film and to form an assembly. The polyvinylidene fluoride film being one surface and the copperclad polyimide film being the other surface. The area behind the copperclad polyimide film surface is filled with a second epoxy, and then cured to form an epoxy plug.

摘要翻译： 本文提供了制造高频超声换能器的技术。 在一个实施例中，制造包括在铜包覆聚酰亚胺膜上沉积铜包覆聚酰亚胺膜，环氧树脂层和环氧树脂上的聚偏二氟乙烯膜。 然后压制材料的组合以将聚偏二氟乙烯膜粘合到铜包覆聚酰亚胺膜上并形成组件。 聚偏二氟乙烯膜是一个表面，铜包覆聚酰亚胺膜是另一个表面。 铜层聚酰亚胺膜表面后面的区域填充有第二环氧树脂，然后固化形成环氧树脂塞。

公开(公告)号：US20050194865A1

公开(公告)日：2005-09-08

申请号：US11074990

申请日：2005-03-08

申请人： Bjorn Angelsen ,  Tonni Johansen ,  Helge Kristiansen

发明人： Bjorn Angelsen ,  Tonni Johansen ,  Helge Kristiansen

IPC分类号： B06B1/06 ,  H02N2/00

CPC分类号： B06B1/0692 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00014

摘要： A design and a manufacturing method of ultrasound transducers based on films of ferro-electric ceramic material is presented, the transducers being particularly useful for operating at frequencies above 10 MHz. The manufacturing technique can involve tape-casting of the ceramic films, deposition of the ceramic films onto a substrate with thick film printing, sol-gel, or other deposition techniques, where manufacturing methods for load matching layers and composite ceramic layers are described. The designs also involve acoustic load matching layers that provide particularly wide bandwidth of the transducers, and also multi-band operation of the transducers. The basic designs can be used for elements in a transducer array, that provides the frequency characteristics of the single element transducers, for array steering of the focus and possibly also direction of a pulsed ultrasound beam at high frequencies and multi-band frequencies.

摘要翻译： 提出了一种基于铁电陶瓷材料薄膜的超声换能器的设计和制造方法，该换能器对于在10MHz以上的频率下工作特别有用。 制造技术可以涉及陶瓷膜的流延，用厚膜印刷，溶胶 - 凝胶或其他沉积技术将陶瓷膜沉积到基底上，其中描述了负载匹配层和复合陶瓷层的制造方法。 这些设计还涉及提供特别宽的传感器带宽的声学负载匹配层，以及换能器的多频带操作。 基本设计可用于传感器阵列中的元件，其提供单个元件换能器的频率特性，用于在高频和多频带频率下的聚焦的阵列转向以及可能的脉冲超声波束的方向。

公开(公告)号：US06700075B2

公开(公告)日：2004-03-02

申请号：US09757095

申请日：2001-01-10

申请人： James H. Gordon

发明人： James H. Gordon

IPC分类号： H05K706

CPC分类号： B06B1/0629 ,  B06B1/0692 ,  G10K11/34 ,  H05K1/0218 ,  Y10S439/941

摘要： A reduced noise ultrasound piezo film array on a printed circuit board. A printed circuit board carries a piezo array on one end and a standard coupling at the other end. The board is made in four layers with the two external layers being ground planes to prevent noise pickup. The two internal layers carry printed circuit lines between various elements of the array and terminals of the connector. The various arrays are sequentially scanned. All of the lines except the one selected are connected to ground to prevent crosstalk and noise pickup.

摘要翻译： 印刷电路板上的降噪噪声超声波压电膜阵列。 印刷电路板在一端承载压电阵列，另一端承载标准耦合。 该板由四层制成，两层是接地层，以防止噪声拾取。 两个内部层在阵列的各种元件和连接器的端子之间承载印刷电路线。 依次扫描各种阵列。 所选择的所有线路都连接到地，以防止串扰和噪声拾取。

公开(公告)号：US20030114760A1

公开(公告)日：2003-06-19

申请号：US10036281

申请日：2001-12-19

发明人： Andrew L. Robinson

IPC分类号： A61B008/14

CPC分类号： G10K11/002 ,  B06B1/0685 ,  B06B1/0692 ,  B06B2201/76 ,  Y10T29/42

摘要： The invention is directed towards improved structures for use with micro-machined ultrasonic transducers (MUTs), and methods for fabricating the improved structures. In one embodiment, a MUT on a substrate includes an acoustic cavity formed within the substrate at a location below the MUT. The cavity is filled with an acoustic attenuation material to absorb acoustic waves in the substrate, and to reduce parasitic capacitance. In another embodiment, the cavity is formed below a plurality of MUTs, and filled with an attenuation material. In still another embodiment, an attenuation material substantially encapsulates a plurality of MUTs on a dielectric layer. In yet other embodiments, at least one monolithic semiconductor circuit is formed in the substrate that may be operatively coupled to the MUTs to perform signal processing and/or control operations.