公开(公告)号：US20170156002A1

公开(公告)日：2017-06-01

申请号：US15005908

申请日：2016-01-25

Applicant: Apple Inc.

Inventor： Caleb C. Han ,  Jun Zhai ,  Tongbi T. Jiang

IPC: H04R1/14 ,  H04R31/00 ,  H04R1/10 ,  H04R19/00 ,  H04R19/04

CPC classification number: H04R1/14 ,  H04R1/04 ,  H04R1/1041 ,  H04R1/46 ,  H04R19/005 ,  H04R19/04 ,  H04R31/006 ,  H04R2201/107

Abstract: MEMS microphone and vibration sensor dies and packages are described. In an embodiment, a MEMS microphone and vibration sensor die includes a die substrate, a MEMS microphone on the die substrate and a MEMS vibration sensor on the die substrate. The MEMS vibration sensor may include a plurality of beams with different proof masses corresponding to different resonant frequencies, wherein the different proof masses comprise a same material as the die substrate.

公开(公告)号：US09661411B1

公开(公告)日：2017-05-23

申请号：US15005908

申请日：2016-01-25

Applicant: Apple Inc.

Inventor： Caleb C. Han ,  Jun Zhai ,  Tongbi T. Jiang

IPC: H04R1/14 ,  H04R19/00 ,  H04R19/04 ,  H04R1/10 ,  H04R31/00

CPC classification number: H04R1/14 ,  H04R1/04 ,  H04R1/1041 ,  H04R1/46 ,  H04R19/005 ,  H04R19/04 ,  H04R31/006 ,  H04R2201/107

Abstract: MEMS microphone and vibration sensor dies and packages are described. In an embodiment, a MEMS microphone and vibration sensor die includes a die substrate, a MEMS microphone on the die substrate and a MEMS vibration sensor on the die substrate. The MEMS vibration sensor may include a plurality of beams with different proof masses corresponding to different resonant frequencies, wherein the different proof masses comprise a same material as the die substrate.

公开(公告)号：US20160061677A1

公开(公告)日：2016-03-03

申请号：US14517387

申请日：2014-10-17

Applicant: Apple Inc.

Inventor： Caleb C. Han ,  Tongbi Jiang ,  Jun Zhai

IPC: G01L7/08

CPC classification number: G01L7/08 ,  B81B7/0048 ,  B81B2201/025 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81B2207/012 ,  B81B2207/07 ,  B81B2207/094 ,  B81C1/0023 ,  B81C2203/0792 ,  G01L9/0045 ,  G01L9/0048 ,  G01L19/0618 ,  G01L19/146 ,  G01L19/148 ,  H01L41/094 ,  H01L41/1136 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48095 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/94 ,  H01L2924/1461 ,  H01L2924/16151 ,  H01L2924/16195

Abstract: Sensor packages and manners of formation are described. In an embodiment, a sensor package includes a supporting die characterized by a recess area and a support anchor protruding above the recess area. A sensor die is bonded to the support anchor such that an air gap exists between the sensor die and the recess area. The sensor die includes a sensor positioned directly above the air gap.

Abstract translation: 描述传感器封装和形成方式。 在一个实施例中，传感器封装包括支撑模具，其特征在于凹部区域和在凹部区域上方突出的支撑锚固件。 传感器模具结合到支撑锚定件，使得在传感器模具和凹部区域之间存在气隙。 传感器模具包括位于空气间隙正上方的传感器。