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公开(公告)号：US09849650B2
公开(公告)日：2017-12-26
申请号：US14161493
申请日：2014-01-22
Applicant: Apple Inc.
Inventor： Douglas Weber , Christopher Prest , David Pakula , Stephen Paul Zadesky
CPC classification number: B32B15/04 , B05D5/06 , B05D5/068 , B05D7/52 , C23C14/024 , C23C14/042 , Y10T428/265 , Y10T428/31645 , Y10T428/31678 , Y10T428/31681 , Y10T428/31692 , Y10T428/31855
Abstract: Techniques, processes and structures are disclosed for providing markings on products, such as electronic devices. For example, the markings can be formed using physical vapor deposition (PVD) processes to deposit a layer of material. The markings or labels may be textual and/or graphic. The markings are deposited on a compliant layer that is disposed on a surface to be marked. The compliant layer is arranged to isolate the surface to be marked from the layer of material deposited using the PVD process.
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公开(公告)号：US20250103103A1
公开(公告)日：2025-03-27
申请号：US18974378
申请日：2024-12-09
Applicant: Apple Inc.
Inventor： Scott Myers , Richard Heley , Matthew Theobald , Adam Stagnaro , Tang Tan , Richard Dinh , David Pakula
Abstract: This is directed to providing a cosmetic finish on a component constructed by connecting several elements. A single manufacturing process, such as machining or grinding, can be applied to the connected elements to remove material from some or all of the elements and to form a smooth and continuous surface across interfaces between the individual elements of the component. In some cases, settings of the material removal process can be adjusted based on the material of the component elements. For example, the settings can be adjusted based on the manufacturing or mechanical properties of each element material.
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公开(公告)号：US12174673B2
公开(公告)日：2024-12-24
申请号：US17403206
申请日：2021-08-16
Applicant: Apple Inc.
Inventor： Scott Myers , Richard Heley , Matthew Theobald , Adam Stagnaro , Tang Tan , Richard Dinh , David Pakula
Abstract: This is directed to providing a cosmetic finish on a component constructed by connecting several elements. A single manufacturing process, such as machining or grinding, can be applied to the connected elements to remove material from some or all of the elements and to form a smooth and continuous surface across interfaces between the individual elements of the component. In some cases, settings of the material removal process can be adjusted based on the material of the component elements. For example, the settings can be adjusted based on the manufacturing or mechanical properties of each element material.
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公开(公告)号：US20230288965A1
公开(公告)日：2023-09-14
申请号：US18199499
申请日：2023-05-19
Applicant: Apple Inc.
Inventor： Scott Myers , Matthew Theobald , Richard Heley , Adam Stagnaro , Richard Hung Minh Dinh , David Pakula , Tang Yew Tan
CPC classification number: G06F1/1656 , G06F1/1626 , G06F1/1658 , G06F1/1698 , H04M1/0249 , H05K5/03 , H05K5/02 , H04M1/026 , H05K5/0208 , G06F1/1684 , H01Q1/2258 , H01Q1/241 , H04M1/0274 , H01Q1/42 , H05K5/0247 , Y10T29/49002 , Y10T29/49169
Abstract: This is directed to an electronic device enclosure. The enclosure includes an outer periphery member forming an outer surface of a device, and to which an internal platform is connected. Electronic device components can be assembled to one or both surfaces of the internal platform. The enclosure can include front and back cover assemblies assembled to the opposite surfaces of the outer periphery member to retain electronic device components. One or both of the cover assemblies can include a window through which display circuitry can provide content to a user of the device.
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公开(公告)号：US20230007799A1
公开(公告)日：2023-01-05
申请号：US17899353
申请日：2022-08-30
Applicant: Apple Inc.
Inventor： David Pakula , Richard Hung Minh Dinh , Scott Myers , Tang Yew Tan
Abstract: Housings for electronic devices are disclosed. According to one aspect, adjoining surfaces of electronic device housings can be mounted or arranged such that adjoining surfaces are flush to a high degree of precision. The electronic devices can be portable and in some cases handheld.
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Patent Agency Ranking
公开(公告)号：US20220418138A1
公开(公告)日：2022-12-29
申请号：US17899410
申请日：2022-08-30
Applicant: Apple Inc.
Inventor： David Pakula , Richard Hung Minh Dinh , Scott Myers , Tang Yew Tan
Abstract: Housings for electronic devices are disclosed. According to one aspect, adjoining surfaces of electronic device housings can be mounted or arranged such that adjoining surfaces are flush to a high degree of precision. The electronic devices can be portable and in some cases handheld.
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公开(公告)号：US11464126B2
公开(公告)日：2022-10-04
申请号：US17033117
申请日：2020-09-25
Applicant: Apple Inc.
Inventor： David Pakula , Richard Hung Minh Dinh , Scott Myers , Tang Yew Tan
IPC: G06F1/16 , H05K7/14 , H04M1/02 , H05K5/03 , G02B7/02 , H05K5/00 , G02B13/00 , B29L31/34 , H04N5/225
Abstract: Housings for electronic devices are disclosed. According to one aspect, adjoining surfaces of electronic device housings can be mounted or arranged such that adjoining surfaces are flush to a high degree of precision. The electronic devices can be portable and in some cases handheld.
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公开(公告)号：US20220075422A1
公开(公告)日：2022-03-10
申请号：US17525614
申请日：2021-11-12
Applicant: Apple Inc.
Inventor： Scott Myers , Matthew Theobald , Richard Heley , Adam Stagnaro , Richard Hung Minh Dinh , David Pakula , Tang Yew Tan
Abstract: This is directed to an electronic device enclosure. The enclosure includes an outer periphery member forming an outer surface of a device, and to which an internal platform is connected. Electronic device components can be assembled to one or both surfaces of the internal platform. The enclosure can include front and back cover assemblies assembled to the opposite surfaces of the outer periphery member to retain electronic device components. One or both of the cover assemblies can include a window through which display circuitry can provide content to a user of the device.
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19.发明授权公开(公告)号：US11194362B2
公开(公告)日：2021-12-07
申请号：US16994299
申请日：2020-08-14
Applicant: Apple Inc.
Inventor： Scott Myers , Matthew Theobald , Richard Heley , Adam Stagnaro , Richard Hung Minh Dinh , David Pakula , Tang Yew Tan
Abstract: This is directed to an electronic device enclosure. The enclosure includes an outer periphery member forming an outer surface of a device, and to which an internal platform is connected. Electronic device components can be assembled to one or both surfaces of the internal platform. The enclosure can include front and back cover assemblies assembled to the opposite surfaces of the outer periphery member to retain electronic device components. One or both of the cover assemblies can include a window through which display circuitry can provide content to a user of the device.
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公开(公告)号：US20210274671A1
公开(公告)日：2021-09-02
申请号：US17325639
申请日：2021-05-20
Applicant: Apple Inc.
Inventor： David Pakula , Stephen Brian Lynch , Richard Hung Minh Dinh , Tang Yew Tan , Lee Hua Tan
Abstract: An electronic device having an enclosure formed from at least one glass cover and a peripheral structure formed adjacent the periphery of the glass cover is disclosed. The peripheral structure can be secured adjacent to the glass cover with an adhesive. The peripheral structure can be molded adjacent the glass cover so that a gapless interface is formed between the peripheral structure and the periphery of the glass cover. In one embodiment, the peripheral structure includes at least an inner peripheral structure and an outer peripheral structure.
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