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    Electronic devices having circuitry in housing attachment structures
    12.
    发明授权
    Electronic devices having circuitry in housing attachment structures 有权

    公开(公告)号：US11626898B2

    公开(公告)日：2023-04-11

    申请号：US17326214

    申请日：2021-05-20

    Applicant: Apple Inc.

    Inventor： James G. Horiuchi ,  Tyler S. Bushnell ,  Brad G. Boozer ,  Mario Martinis ,  YoungHoon Kim

    IPC: H04B1/3827 ,  H01Q1/24 ,  G06F3/044 ,  H01Q1/27

    Abstract: An electronic device housing may be formed from housing members. A first housing member may form a display cover layer that overlaps pixels. During operation, the pixels may display an image that is viewable through the display cover layer. The second housing member may have a rear wall portion and a sidewall. A band may be coupled to the sidewall or other portion of the second housing member. The first and second housing members may be attached together using a housing member attachment structure. The housing member attachment structure may have layers of adhesive and printed circuit structures. The printed circuit structures may include metal traces that form an antenna and that form capacitive force sensor electrodes on opposing sides of a compressible member.

    Packaged Devices with Antennas
    15.
    发明申请
    Packaged Devices with Antennas 审中-公开

    公开(公告)号：US20170207524A1

    公开(公告)日：2017-07-20

    申请号：US15002236

    申请日：2016-01-20

    Applicant: Apple Inc.

    Inventor： Steven P. Cardinali ,  James G. Horiuchi

    IPC: H01Q1/38 ,  H05K1/18 ,  H01Q1/24

    CPC classification number: H01Q1/243 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2924/15192 ,  H01Q9/42 ,  H05K1/186 ,  H05K3/185 ,  H05K3/284 ,  H05K2201/10098 ,  H05K2203/1316 ,  H05K2203/1322 ,  H05K2203/1469

    Abstract: A packaged device may include electrical components such as integrated circuits that are mounted to a substrate such as a printed circuit substrate. Plastic may be molded to the printed circuit substrate over the integrated circuits. The molded plastic may include one or more shots of plastic and may include laser-sensitizable plastic material. Antenna structures may be supported by molded plastic such as molded plastic in a packaged device. The antenna structures may be formed from metal foil, flexible printed circuit substrate material with metal antenna traces, and metal traces that are formed on exposed surfaces of the plastic. The metal traces may be electroplated metal traces that are formed on regions of a laser-sensitizable plastic material that have been exposed to laser light. A package may have a protrusion that supports an antenna structure.

    ELECTRONIC DEVICE HAVING SEALED BUTTON BIOMETRIC SENSING SYSTEM
    16.
    发明申请
    ELECTRONIC DEVICE HAVING SEALED BUTTON BIOMETRIC SENSING SYSTEM 有权

    公开(公告)号：US20250068213A1

    公开(公告)日：2025-02-27

    申请号：US18940238

    申请日：2024-11-07

    Applicant: Apple Inc.

    Inventor： Tyler S. Bushnell ,  James G. Horiuchi ,  Michael K. McCord ,  Trevor J. Ness

    IPC: G06F1/16 ,  G04B3/00 ,  G04G21/08 ,  G06F3/02 ,  G06F3/0354 ,  G06F3/044 ,  G06V40/12 ,  G06V40/13

    Abstract: A biometric button assembly may be disposed in an opening of an enclosure of an electronic device. The biometric button assembly may include an input member that forms an exterior surface of the button housing and is configured to receive inputs, for example from a user of the electronic device. The biometric button assembly may further include a biometric sensor for detecting the received inputs and transmitting a signal to a processor of the electronic device. The signal may correspond to a biometric characteristic, such as a fingerprint. A flexible conduit may transmit the signal to the processor. A portion of the flexible conduit and a seal may be positioned between the button assembly and the enclosure that prevents contaminants from entering the button housing and the enclosure.

    Electronic device having sealed button biometric sensing system
    17.
    发明授权
    Electronic device having sealed button biometric sensing system 有权

    公开(公告)号：US12181927B2

    公开(公告)日：2024-12-31

    申请号：US18468579

    申请日：2023-09-15

    Applicant: Apple Inc.

    Inventor： Tyler S. Bushnell ,  James G. Horiuchi ,  Michael K. McCord ,  Trevor J. Ness

    IPC: G06F1/16 ,  G04B3/00 ,  G04G21/08 ,  G06F3/02 ,  G06F3/0354 ,  G06F3/044 ,  G06V40/12 ,  G06V40/13

    Abstract: A biometric button assembly may be disposed in an opening of an enclosure of an electronic device. The biometric button assembly may include an input member that forms an exterior surface of the button housing and is configured to receive inputs, for example from a user of the electronic device. The biometric button assembly may further include a biometric sensor for detecting the received inputs and transmitting a signal to a processor of the electronic device. The signal may correspond to a biometric characteristic, such as a fingerprint. A flexible conduit may transmit the signal to the processor. A portion of the flexible conduit and a seal may be positioned between the button assembly and the enclosure that prevents contaminants from entering the button housing and the enclosure.

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