公开(公告)号：US10224238B2

公开(公告)日：2019-03-05

申请号：US15268106

申请日：2016-09-16

Applicant: Apple Inc.

Inventor： Chang Ming Lu ,  Chia-Yu Chen ,  Chih Pang Chang ,  Ching-Sang Chuang ,  Hung-Che Ting ,  Jung Yen Huang ,  Sheng Hui Shen ,  Shih Chang Chang ,  Tsung-Hsiang Shih ,  Yu-Wen Liu ,  Yu Hung Chen ,  Kai-Chieh Wu ,  Lun Tsai ,  Takahide Ishii ,  Chung-Wang Lee ,  Hsing-Chuan Wang ,  Chin Wei Hsu ,  Fu-Yu Teng

IPC: H01L21/768 ,  H01L21/02 ,  H01L21/027 ,  H01L21/77

Abstract: A component such as a display may have a substrate and thin-film circuitry on the substrate. The thin-film circuitry may be used to form an array of pixels for a display or other circuit structures. Metal traces may be formed among dielectric layers in the thin-film circuitry. Metal traces may be provided with insulating protective sidewall structures. The protective sidewall structures may be formed by treating exposed edge surfaces of the metal traces. A metal trace may have multiple layers such as a core metal layer sandwiched between barrier metal layers. The core metal layer may be formed from a metal that is subject to corrosion. The protective sidewall structures may help prevent corrosion in the core metal layer. Surface treatments such as oxidation, nitridation, and other processes may be used in forming the protective sidewall structures.

公开(公告)号：US11922887B1

公开(公告)日：2024-03-05

申请号：US17368472

申请日：2021-07-06

Applicant: Apple Inc.

Inventor： Shinya Ono ,  Chin-Wei Lin ,  Chuan-Jung Lin ,  Gihoon Choo ,  Hassan Edrees ,  Hei Kam ,  Jung Yen Huang ,  Pei-En Chang ,  Rungrot Kitsomboonloha ,  Szu-Hsien Lee ,  Zino Lee

IPC: G09G3/3275 ,  H10K59/121 ,  H10K59/126 ,  H10K59/131

CPC classification number: G09G3/3275 ,  H10K59/1213 ,  H10K59/1216 ,  H10K59/126 ,  H10K59/131 ,  G09G2320/0214

Abstract: A display may include an array of pixels. Each pixel in the array includes an organic light-emitting diode coupled to associated thin-film transistors. The diode may be coupled to drive transistor circuitry, a data loading transistor, and emission transistors. The drive transistor circuitry may include at least two transistor portions connected in series. The data loading transistor has a drain region connected to a data line and a source region connected directly to the drive transistor circuitry. The data line may be connected to and overlap the drain region of the data loading transistor. The data line and the source region of the data loading transistor are non-overlapping to reduce row-to-row crosstalk.

公开(公告)号：US11910654B1

公开(公告)日：2024-02-20

申请号：US17395381

申请日：2021-08-05

Applicant: Apple Inc.

Inventor： Po-Chun Yeh ,  Jiun-Jye Chang ,  Doh-Hyoung Lee ,  Caleb Coburn ,  Niva A. Ran ,  Ching-Sang Chuang ,  Themistoklis Afentakis ,  Chuan-Jung Lin ,  Jung Yen Huang ,  Lei Yuan

IPC: H10K59/122 ,  G09G3/3291 ,  H10K59/35 ,  H10K71/00

CPC classification number: H10K59/122 ,  G09G3/3291 ,  H10K59/35 ,  H10K71/00 ,  H10K71/621 ,  G09G2320/0214

Abstract: An organic light-emitting diode (OLED) display may have an array of organic light-emitting diode pixels that each have OLED layers interposed between a cathode and an anode. Voltage may be applied to the anode of each pixel to control the magnitude of emitted light. The conductivity of the OLED layers may allow leakage current to pass between neighboring anodes in the display. To reduce leakage current and the accompanying cross-talk, the display may include active and/or passive leakage-mitigating structures. The passive leakage-mitigating structures may have an undercut that causes discontinuities in the overlying OLED layers. Active leakage-mitigating structures may include a conductive layer (e.g., a conductive ring) that drains leakage current to ground. Alternatively, the active leakage-mitigating structures may include a gate electrode modulator with a variable voltage that stops the current flow laterally.

公开(公告)号：US11462608B2

公开(公告)日：2022-10-04

申请号：US17143939

申请日：2021-01-07

Applicant: Apple Inc.

Inventor： Shinya Ono ,  Chin-Wei Lin ,  Akira Matsudaira ,  Jiun-Jye Chang ,  Jung Yen Huang ,  Pei-En Chang ,  Rungrot Kitsomboonloha ,  Szu-Hsien Lee

IPC: G09G3/3225 ,  G09G3/3266 ,  H01L27/32 ,  H01L29/786 ,  H01L27/12 ,  H01L29/49

Abstract: An electronic device may include a display with pixels formed using light-emitting diodes, thin-film silicon transistors, thin-film semiconducting-oxide transistors, and capacitors. The silicon transistors, semiconducting-transistors, and capacitors may have control terminals that are coupled to gate or routing lines that extend across the face of the display and that are formed in a low resistance source-drain metal routing layer. Forming routing/gate lines using the low resistance source-drain metal routing layer dramatically reduces the resistance of the gate lines, which enables better timing margins for large display panels operating at higher refresh rates.

公开(公告)号：US10546796B2

公开(公告)日：2020-01-28

申请号：US16077185

申请日：2017-02-10

Applicant: Apple Inc.

Inventor： Hsin-Hua Hu ,  Jaein Choi ,  James E. Pedder ,  Ion Bita ,  Hairong Tang ,  Chin Wei Hsu ,  Sandeep Chalasani ,  Chih-Lei Chen ,  Sunggu Kang ,  Shinya Ono ,  Jung Yen Huang ,  Lun Tsai

IPC: H01L23/48 ,  H01L23/31 ,  H01L23/00 ,  H01L25/075 ,  H01L25/16

Abstract: Micro LED and microdriver chip integration schemes are described. In an embodiment a microdriver chip includes a plurality of trenches formed in a bottom surface of the microdriver chip, with each trench surrounding a conductive stud extending below a bottom surface of the microdriver chip body. Integration schemes are additionally described for providing electrical connection to conductive terminal contacts and micro LEDs bonded to a display substrate and adjacent to a microdriver chip.

公开(公告)号：US20190115274A1

公开(公告)日：2019-04-18

申请号：US16077185

申请日：2017-02-10

Applicant: Apple Inc.

Inventor： Hsin-Hua Hu ,  Jaein Choi ,  James E. Pedder ,  Ion Bita ,  Hairong Tang ,  Chin Wei Hsu ,  Sandeep Chalasani ,  Chih-Lei Chen ,  Sunggu Kang ,  Shinya Ono ,  Jung Yen Huang ,  Lun Tsai

IPC: H01L23/31 ,  H01L23/00 ,  H01L25/075 ,  H01L25/16

Abstract: Micro LED and microdriver chip integration schemes are described. In an embodiment a microdriver chip includes a plurality of trenches formed in a bottom surface of the microdriver chip, with each trench surrounding a conductive stud extending below a bottom surface of the microdriver chip body. Integration schemes are additionally described for providing electrical connection to conductive terminal contacts and micro LEDs bonded to a display substrate and adjacent to a microdriver chip.