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公开(公告)号：US20240339347A1
公开(公告)日：2024-10-10
申请号：US18747417
申请日：2024-06-18
Applicant: Applied Materials, Inc.
Inventor： Patricia Schulze , Gregory John Freeman , Michael Kutney , Arunkumar Ramachandraiah , Chih Chung Chou , Zhaozhao Zhu , Ozkan Celik
IPC: H01L21/68 , G01B11/24 , H01L21/683 , H01L21/687
CPC classification number: H01L21/681 , G01B11/24 , H01L21/6831 , H01L21/68721 , G01B2210/56
Abstract: An optical measurement device comprises a substrate holder to secure a substrate, a plurality of actuators to move the substrate holder relative to a plurality of axes, a first sensor to generate one or more first measurements or images of a first plurality of target positions on the substrate, and a second sensor to generate one or more second measurements of a second plurality of target positions on the substrate. The optical measurement device further comprises a plate, wherein the substrate holder, the plurality of actuators, the first sensor and the second sensor are each mounted to the plate, and wherein the plate provides vibration isolation from a factory interface to which the optical measurement device mounts. The optical measurement device further comprises a processing device that executes instructions to control the plurality of actuators and process the first measurements or images and the second measurements.
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公开(公告)号：US20220028713A1
公开(公告)日：2022-01-27
申请号：US17379653
申请日：2021-07-19
Applicant: APPLIED MATERIALS, INC.
Inventor： Upendra V. Ummethala , Blake Erickson , Prashanth Kumar , Michael Kutney , Steven Trey Tindel , Zhaozhao Zhu
Abstract: A method for determining whether to modify a manufacturing process recipe is provided. A substrate to be processed at a manufacturing system according to the first process recipe is identified. An instruction to transfer the substrate to a substrate measurement subsystem to obtain a first set of measurements for the substrate is generated. The first set of measurements for the substrate is received from the substrate measurement subsystem. An instruction to transfer the substrate from the substrate measurement subsystem to a processing chamber is generated. A second set of measurements for the substrate is received from one or more sensors of the processing chamber. A first mapping between the first set of measurements and the second set of measurements for the substrate is generated. The first set of measurements mapped to the second set of measurements for the substrate is stored. A determination is made based on the first set of measurements mapped to the second set of measurements for the substrate of whether to modify the first process recipe or a second process recipe for the substrate.
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公开(公告)号：US12148647B2
公开(公告)日：2024-11-19
申请号：US17584322
申请日：2022-01-25
Applicant: Applied Materials, Inc.
Inventor： Patricia Schulze , Gregory John Freeman , Michael Kutney , Arunkumar Ramachandraiah , Chih Chung Chou , Zhaozhao Zhu , Ozkan Celik
IPC: H01L21/68 , G01B11/24 , H01L21/683 , H01L21/687
Abstract: An apparatus includes a substrate holder, a first actuator to rotate the substrate holder, a second actuator to move the substrate holder linearly, a first sensor to generate one or more first measurements or images of the substrate, a second sensor to generate one or more second measurements of target positions on the substrate, and a processing device. The processing device estimates a position of the substrate on the substrate holder and causes the first actuator to rotate the substrate holder about a first axis. The rotation causes an offset between a field of view of the second sensor and a target position on the substrate due to the substrate not being centered on the substrate holder. The processing device causes the second actuator to move the substrate holder linearly along a second axis to correct the offset. The processing device determines a profile across a surface of the substrate based on the one or more second measurements of the target positions.
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公开(公告)号：US20240128100A1
公开(公告)日：2024-04-18
申请号：US18485009
申请日：2023-10-11
Applicant: Applied Materials, Inc.
Inventor： Hsinyi Tsai , Thomas Li , Zhaozhao Zhu , Michael Kutney , Upendra V. Ummethala
CPC classification number: H01L21/67253 , H01L21/67294 , H01L22/26
Abstract: Spectral data associated with one or more regions of a surface of a substrate is identified. The substrate has been processed according to one or more first operations of a process recipe that is unknown to a system controller for the manufacturing system. The spectral data is provided as input to a machine learning model that is trained to predict, based on given spectral data, a respective process recipe associated with the substrate and one or more operations of the respective process recipe that have already been performed. A determination is made, based on one or more outputs of the machine learning model, that the substrate is associated with the process recipe and that one or more second operations are yet to be performed. The substrate is caused to be processed according to the one or more second operations of the process recipe.
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公开(公告)号：US11927543B2
公开(公告)日：2024-03-12
申请号：US18101869
申请日：2023-01-26
Applicant: Applied Materials, Inc.
Inventor： Blake Erickson , Keith Berding , Michael Kutney , Soumendra Barman , Zhaozhao Zhu , Michelle SanPedro , Suresh Polali Narayana Rao
CPC classification number: G01N21/9501 , G01B11/0616 , G01N21/211
Abstract: A system includes a memory, and at least one processing device, operatively coupled to the memory, to facilitate an etch recipe development process by performing operations including obtaining, from an optical detector, first material thickness data for a first material and second material thickness data for a second material resulting from an iteration of an etch process using an etch recipe. The first material is located at a first reflectometry measurement point and the second material is located at a second reflectometry measurement point different from the first reflectometry measurement point. The operations further include determining one or more etch parameters based on at least the first material thickness data and the second material thickness data.
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Patent Agency Ranking
公开(公告)号：US20230326773A1
公开(公告)日：2023-10-12
申请号：US18335899
申请日：2023-06-15
Applicant: APPLIED MATERIALS, INC.
Inventor： Upendra V. Ummethala , Blake Erickson , Prashanth Kumar , Michael Kutney , Steven Trey Tindel , Zhaozhao Zhu
CPC classification number: H01L21/67253 , H01L22/20 , H01L21/67288 , H01L21/67063 , H01L21/67167
Abstract: A process recipe associated with a substrate at a manufacturing system is identified. A first set of measurements for the substrate is obtained from a substrate measurement subsystem. A second set of measurements for the substrate is obtained from one or more sensors of a chamber of the manufacturing system. A determination is made based on the obtained first set of measurements and the obtained second set of measurements of whether to modify the process recipe by at least one of modifying an operation of the process recipe or generating an instruction to prevent completion of execution of one or more operations of the process recipe.
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公开(公告)号：US20230236583A1
公开(公告)日：2023-07-27
申请号：US17584318
申请日：2022-01-25
Applicant: Applied Materials, Inc.
Inventor： Chunlei Zhang , Zhaozhao Zhu , Michael Kutney
IPC: G05B19/418 , H01L21/66 , H01L21/67
CPC classification number: G05B19/41835 , H01L22/26 , G05B19/4183 , H01L21/67276 , G05B2219/45031
Abstract: A substrate processing system includes a process chamber, one or more robot, a substrate measurement system, and a computing device. The process chamber may process a substrate that will comprise a film and/or feature after the processing. The one or more robot, to move the substrate from the process chamber to a substrate measurement system. The substrate measurement system may measure the film and/or feature on the substrate and generate a profile map of the film and/or feature. The computing device may process data from the profile map using a first trained machine learning model, wherein the first trained machine learning model outputs a first chamber component condition estimation for a first chamber component of the process chamber. The computing device may then determine whether to perform maintenance on the first chamber component of the process chamber based at least in part on the first chamber component condition estimation.
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公开(公告)号：US20230236569A1
公开(公告)日：2023-07-27
申请号：US17882393
申请日：2022-08-05
Applicant: Applied Materials, Inc.
Inventor： Chunlei Zhang , Zhaozhao Zhu , Michael Kutney
IPC: G05B19/4099 , H01L21/67 , G05B19/418
CPC classification number: G05B19/4099 , H01L21/67253 , G05B19/41875 , H01L21/67259 , H01L21/681
Abstract: A method includes processing a substrate in a process chamber according to a recipe, wherein the substrate comprises at least one of a film or a feature after the processing. The method further includes generating a profile map of the first substrate. The method further includes processing data from the profile map using a first model, wherein the first model outputs at least one of an estimated mesa condition of a substrate support for the process chamber, an estimated lift pin location condition of the substrate support an estimated seal band condition of the substrate support, or an estimated process kit ring condition for a process kit ring for the process chamber. The method further includes outputting a notice as a result of the processing.
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公开(公告)号：US11688616B2
公开(公告)日：2023-06-27
申请号：US17379653
申请日：2021-07-19
Applicant: APPLIED MATERIALS, INC.
Inventor： Upendra V. Ummethala , Blake Erickson , Prashanth Kumar , Michael Kutney , Steven Trey Tindel , Zhaozhao Zhu
CPC classification number: H01L21/67253 , H01L21/67288 , H01L22/20 , H01L21/67063 , H01L21/67167
Abstract: A method for determining whether to modify a manufacturing process recipe is provided. A substrate to be processed at a manufacturing system according to the first process recipe is identified. An instruction to transfer the substrate to a substrate measurement subsystem to obtain a first set of measurements for the substrate is generated. The first set of measurements for the substrate is received from the substrate measurement subsystem. An instruction to transfer the substrate from the substrate measurement subsystem to a processing chamber is generated. A second set of measurements for the substrate is received from one or more sensors of the processing chamber. A first mapping between the first set of measurements and the second set of measurements for the substrate is generated. The first set of measurements mapped to the second set of measurements for the substrate is stored. A determination is made based on the first set of measurements mapped to the second set of measurements for the substrate of whether to modify the first process recipe or a second process recipe for the substrate.
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公开(公告)号：US11619594B2
公开(公告)日：2023-04-04
申请号：US17242569
申请日：2021-04-28
Applicant: Applied Materials, Inc.
Inventor： Blake Erickson , Keith Berding , Michael Kutney , Soumendra Barman , Zhaozhao Zhu , Michelle SanPedro , Suresh Polali Narayana Rao
Abstract: A system includes a memory and at least one processing device operatively coupled to the memory to facilitate an etch recipe development process by performing a number of operations. The operations include receiving a request to initiate an iteration of an etch process using an etch recipe to etch a plurality of materials each located at a respective one of a plurality of reflectometry measurement points, obtaining material thickness data for each of the plurality of materials resulting from the iteration of the etch process, and determining one or more etch parameters based on the material thickness data.
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