公开(公告)号：US20230009737A1

公开(公告)日：2023-01-12

申请号：US17857999

申请日：2022-07-05

Applicant: Applied Materials, Inc.

Inventor： Nicholas A. Wiswell ,  Benjamin Cherian ,  Thomas H. Osterheld ,  Jason Garcheung Fung

IPC: B24B37/20

Abstract: A polishing pad includes a polishing layer, a backing layer, and an acoustic window of solid material having an acoustic impedance less than that of the backing layer and extending through the backing layer to contact the bottom surface of the polishing layer.

公开(公告)号：US20230009048A1

公开(公告)日：2023-01-12

申请号：US17855520

申请日：2022-06-30

Applicant: Applied Materials, Inc.

Inventor： Nicholas A. Wiswell ,  Erik S. Rondum ,  Benjamin Cherian ,  Sohrab Pourmand ,  Thomas H. Osterheld ,  Jay Gurusamy ,  Shou-Sung Chang

IPC: B24B37/013 ,  B24B37/20

Abstract: A chemical mechanical polishing apparatus includes a platen to support a polishing pad, a carrier head to hold a surface of a substrate against the polishing pad, a motor to generate relative motion between the platen and the carrier head so as to polish an overlying layer on the substrate, an in-situ acoustic monitoring system comprising an acoustic window having a top surface to contact the substrate, and a controller configured to detect a polishing endpoint based on received acoustic signals from the in-situ acoustic monitoring system.

公开(公告)号：US20220281057A1

公开(公告)日：2022-09-08

申请号：US17674768

申请日：2022-02-17

Applicant: Applied Materials, Inc.

Inventor： Nicholas A. Wiswell ,  Sohrab Pourmand ,  Dominic J. Benvegnu ,  Thomas H. Osterheld ,  Boguslaw A. Swedek

IPC: B24B37/013

Abstract: A chemical mechanical polishing apparatus includes a platen to support a polishing pad, a carrier head to a surface of a substrate against the polishing pad, a motor to generate relative motion between the platen and the carrier head so as to polish an overlying layer on the substrate, an in-situ acoustic monitoring system, and a controller. The controller is configured to detect exposure of an underlying layer due to the polishing of the substrate based on measurements from the in-situ acoustic monitoring system. The in-situ acoustic monitoring system may detect exposure of an underlying layer based on comparison of the signal to prior measurements of acoustic signals generated by stress energy of test substrates.

公开(公告)号：US12233505B2

公开(公告)日：2025-02-25

申请号：US18315467

申请日：2023-05-10

Applicant: Applied Materials, Inc.

Inventor： Nicholas A. Wiswell ,  Chih Chung Chou ,  Dominic J. Benvegnu

IPC: B24B49/12 ,  B24B37/013 ,  B24B37/04

Abstract: A polishing pad includes a sensor assembly surrounded by a lower portion of the polishing pad, and an upper portion including a pad portion disposed on the assembly and at least a portion of a polishing layer disposed on the lower portion. The sensor assembly includes a lower body having a first pair of electrodes formed thereon, a polymer body having a second pair of electrodes formed thereon and aligned with the first pair of electrodes, and a pair of gaps between the first pair of electrodes and the second pair of electrodes.

公开(公告)号：US20250062163A1

公开(公告)日：2025-02-20

申请号：US18452426

申请日：2023-08-18

Applicant: Applied Materials, Inc.

Inventor： Nicholas A. Wiswell ,  Benjamin Cherian ,  Haoquan Fang ,  Jun Qian ,  Thomas H. Osterheld ,  Sohrab Pourmand

IPC: H01L21/66 ,  B24B37/005

Abstract: Disclosed herein is a chemical mechanical polishing apparatus, comprising a platen to support a polishing pad; a carrier head to hold a surface of a substrate against the polishing pad; a motor to generate relative motion between the platen and the carrier head so as to polish an overlying layer on the substrate; an in-situ acoustic monitoring system including an acoustic sensor that receives acoustic energy from the substrate and the polishing pad; and a controller configured to detect an abnormal acoustic event based on measurements from the in-situ acoustic monitoring system, and determine a type of anomaly based on signals measured by the in-situ acoustic monitoring system during the abnormal acoustic event.

公开(公告)号：US20230390886A1

公开(公告)日：2023-12-07

申请号：US18205262

申请日：2023-06-02

Applicant: Applied Materials, Inc.

Inventor： Upendra Ummethala ,  Nicholas A. Wiswell ,  David Masayuki Ishikawa ,  Sohrab Pourmand ,  Benjamin Cherian ,  Thomas H. Osterheld ,  Jeonghoon Oh ,  Jianshe Tang

IPC: B24B37/013 ,  H01L21/66

CPC classification number: B24B37/013 ,  H01L22/26

Abstract: A chemical mechanical polishing apparatus, including a platen supporting a polishing pad; a carrier head to hold a surface of a substrate against the polishing pad; a motor to generate relative motion between the platen and the carrier head so as to polish an overlying layer on the substrate; an array of acoustic sensors arranged within the carrier head to receive acoustic signals from the surface of the substrate; and a controller configured to detect a position of an acoustic event on the surface of the substrate based on received acoustic signals from the array of acoustic sensors.

公开(公告)号：US20230278164A1

公开(公告)日：2023-09-07

申请号：US18315467

申请日：2023-05-10

Applicant: Applied Materials, Inc.

Inventor： Nicholas A. Wiswell ,  Chih Chung Chou ,  Dominic J. Benvegnu

IPC: B24B49/12 ,  B24B37/04 ,  B24B37/013

CPC classification number: B24B49/12 ,  B24B37/042 ,  B24B37/013

Abstract: A polishing pad includes a sensor assembly surrounded by a lower portion of the polishing pad, and an upper portion including a pad portion disposed on the assembly and at least a portion of a polishing layer disposed on the lower portion. The sensor assembly includes a lower body having a first pair of electrodes formed thereon, a polymer body having a second pair of electrodes formed thereon and aligned with the first pair of electrodes, and a pair of gaps between the first pair of electrodes and the second pair of electrodes.

公开(公告)号：US20230182258A1

公开(公告)日：2023-06-15

申请号：US18163835

申请日：2023-02-02

Applicant: Applied Materials, Inc.

Inventor： Benjamin Cherian ,  Jun Qian ,  Nicholas A. Wiswell ,  Dominic J. Benvegnu ,  Boguslaw A. Swedek ,  Thomas H. Osterheld

IPC: B24B37/013 ,  G06N3/084

CPC classification number: B24B37/013 ,  G06N3/084

Abstract: During chemical mechanical polishing of a substrate, a signal value that depends on a thickness of a layer in a measurement spot on a substrate undergoing polishing is determined by a first in-situ monitoring system. An image of at least the measurement spot of the substrate is generated by a second in-situ imaging system. Machine vision processing, e.g., a convolutional neural network, is used to determine a characterizing value for the measurement spot based on the image. Then a measurement value is calculated based on both the characterizing value and the signal value.

公开(公告)号：US20230010025A1

公开(公告)日：2023-01-12

申请号：US17855524

申请日：2022-06-30

Applicant: Applied Materials, Inc.

Inventor： Thomas H. Osterheld ,  Jun Qian ,  Benjamin Cherian ,  Nicholas A. Wiswell

IPC: B24B49/00 ,  B24B49/04 ,  B24B57/02 ,  B24B51/00

Abstract: A chemical mechanical polishing apparatus includes a platen, a polishing pad supported on the platen, a carrier head to hold a surface of a substrate against the polishing pad, a motor to generate relative motion between the platen and the carrier head so as to polish an overlying layer on the substrate, an in-situ acoustic monitoring system comprising an acoustic sensor that receives acoustic signals from the surface of the substrate, and a controller configured to detect planarization of topology on the substrate based on a signal from the in-situ acoustic monitoring system.