ACTIVE ACOUSTIC MONITORING FOR CHEMICAL MECHANICAL POLISHING

    公开(公告)号:US20220281058A1

    公开(公告)日:2022-09-08

    申请号:US17674772

    申请日:2022-02-17

    Abstract: A chemical mechanical polishing apparatus includes a platen to support a polishing pad, a carrier head to a surface of a substrate against the polishing pad, a motor to generate relative motion between the platen and the carrier head so as to polish an overlying layer on the substrate, an in-situ acoustic monitoring system, and a controller. The in-situ acoustic monitoring system includes an acoustic signal generator to emit acoustic signals and an acoustic signal sensor that receives acoustic signals reflected from the surface of the substrate. The controller is configured to detect exposure of an underlying layer due to the polishing of the substrate based on measurements from the in-situ acoustic monitoring system.

    DETERMINING SUBSTRATE PRECESSION WITH ACOUSTIC SIGNALS

    公开(公告)号:US20230390885A1

    公开(公告)日:2023-12-07

    申请号:US17963143

    申请日:2022-10-10

    CPC classification number: B24B37/005 G01H11/08

    Abstract: A chemical mechanical polishing apparatus includes a platen to support a polishing pad, a carrier head to hold a surface of a substrate against the polishing pad, a motor to generate relative motion between the platen and the carrier head so as to polish an overlying layer on the substrate, an in-situ acoustic monitoring system comprising an acoustic sensor that receives acoustic signals from the surface of the substrate, and a controller configured to determine an angular orientation of the substrate based on received acoustic signals from the in-situ acoustic monitoring system.

    ACOUSTIC WINDOW WITH LIQUID-FILLED PORES FOR CHEMICAL MECHANICAL POLISHING AND METHODS OF FORMING PADS

    公开(公告)号:US20230011626A1

    公开(公告)日:2023-01-12

    申请号:US17858006

    申请日:2022-07-05

    Abstract: A chemical mechanical polishing apparatus includes a platen, a polishing pad supported on the platen, a carrier head to hold a surface of a substrate against a polishing surface of the polishing pad, and a motor to generate relative motion between the platen and the carrier head so as to polish an overlying layer of the substrate. The polishing pad includes a polishing layer of a solid matrix material with liquid-filled pores, and a backing layer. An in-situ acoustic monitoring system includes an acoustic sensor coupled to the backing layer to receive acoustic signals from the substrate, and a controller is configured to detect a polishing transition point based on received acoustic signals from the in-situ acoustic monitoring system.

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