公开(公告)号：US20230003704A1

公开(公告)日：2023-01-05

申请号：US17365906

申请日：2021-07-01

申请人： Applied Materials, Inc.

发明人： Vivek B. Shah ,  Varoujan Chakarian ,  Upendra Ummethala

IPC分类号： G01N33/00 ,  C23C16/52 ,  G01N11/02 ,  G01F1/74

摘要： A concentration sensor assembly can include a vaporization chamber having a compound. The concentration sensor assembly may include a first flow path coupled to the vaporization chamber. The first flow path may direct a first gas to the vaporization chamber. A second flow path can direct a second gas out of the vaporization chamber. The second gas can include the compound and the first gas. A first sensor is disposed along the first flow path. The first sensor measures first data indicative of a first mass flow rate of the first gas. A second sensor is disposed along the second flow path. The second sensor measure second data indicative of a second mass flow rate of the second gas. A computing device may determine a concentration of the vaporizable substance within the second gas based on the first data and the second data.

公开(公告)号：US11209398B2

公开(公告)日：2021-12-28

申请号：US16597615

申请日：2019-10-09

申请人： APPLIED MATERIALS, INC.

发明人： Chuang-Chia Lin ,  Surajit Kumar ,  Upendra Ummethala

IPC分类号： G01N29/12 ,  H03H9/02 ,  H01L21/66 ,  H01L21/67

摘要： Embodiments disclosed herein include diagnostic substrates and methods of using such substrates. In an embodiment, a diagnostic substrate comprises a substrate, and a device layer over the substrate. In an embodiment, the diagnostic substrate further comprises a resonator in the device layer. In an embodiment, the resonator comprises a cavity, a cover layer over the cavity, and electrodes within the cavity for driving and sensing resonance of the cover layer. In an embodiment, the diagnostic substrate further comprises a reflector surrounding a perimeter of the resonator.

公开(公告)号：US20190265288A1

公开(公告)日：2019-08-29

申请号：US16283371

申请日：2019-02-22

申请人： APPLIED MATERIALS, INC.

发明人： Chuang-Chia Lin ,  Upendra Ummethala ,  Andrew Choe

IPC分类号： G01R29/08 ,  H01Q1/38 ,  H01L21/66

摘要： Embodiments include systems and methods for determining a processing parameter of a processing operation utilizing micro resonator sensors. Some embodiments include a diagnostic substrate comprising a substrate, a circuit layer over the substrate, a cavity in the circuit layer, a capping layer over the circuit layer, a resonating body in or over the cavity, one or more electrodes in the cavity, and circuitry for driving and sensing the resonant frequency of the resonating body. In an embodiment, the circuitry comprises a biasing circuitry block configured to provide a bias voltage to the one or more electrodes, a frequency generator circuitry block configured to provide a signal with a varying frequency to the one or more electrodes, and a sensing circuitry block configured to detect a value correlated to oscillation of the resonating body.

公开(公告)号：US20230367288A1

公开(公告)日：2023-11-16

申请号：US17745730

申请日：2022-05-16

申请人： Applied Materials, Inc.

发明人： Jeong Jin Hong ,  Mi Hyun Jang ,  Sidharth Bhatia ,  Sejune Cheon ,  Joshua Maher ,  Upendra Ummethala

IPC分类号： G05B19/4099

CPC分类号： G05B19/4099 ,  G05B2219/45031

摘要： Embodiments disclosed herein include a method for use with a semiconductor processing tool. In an embodiment, the method comprises configuring the semiconductor processing tool, running a benchmark test on the semiconductor processing tool, providing hardware operating window (HOW) analytics, generating a design of experiment (DoE) using the HOW analytics, implementing process optimization, and releasing an iteration of the process recipe. In an embodiment, the method further comprises margin testing the iteration of the process recipe.

公开(公告)号：US20230345137A1

公开(公告)日：2023-10-26

申请号：US18214417

申请日：2023-06-26

申请人： Applied Materials, Inc.

发明人： Upendra Ummethala ,  Philip Kraus ,  Keith Berding ,  Blake Erickson ,  Patrick Tae ,  Devendra Channappa Holeyannavar ,  Shivaraj Manjunath Nara ,  Anandakumar Parameshwarappa ,  Sivasankar Nagarajan ,  Dhirendra Kumar

IPC分类号： H01L21/67 ,  H04N23/90 ,  H04N23/56

CPC分类号： H04N23/90 ,  H01L21/67276 ,  H04N23/56 ,  H04N23/555

摘要： Embodiments disclosed herein include a diagnostic substrate, comprising a baseplate, and a first plurality of image sensors on the baseplate, where the first plurality of image sensors are oriented horizontal to the baseplate. In an embodiment, the diagnostic substrate further comprises a second plurality of image sensors on the baseplate, where the second plurality of image sensors are oriented at a non-orthogonal angle to the baseplate. In an embodiment, the diagnostic substrate further comprises a printed circuit board (PCB) on the baseplate, and a controller on the baseplate, where the controller is communicatively coupled to the first plurality of image sensors and the second plurality of image sensors by the PCB. In an embodiment, the diagnostic substrate further comprises a diffuser lid over the baseplate, the PCB, and the controller.

公开(公告)号：US11736818B2

公开(公告)日：2023-08-22

申请号：US17668363

申请日：2022-02-09

申请人： Applied Materials, Inc.

发明人： Upendra Ummethala ,  Philip Kraus ,  Keith Berding ,  Blake Erickson ,  Patrick Tae ,  Devendra Channappa Holeyannavar ,  Shivaraj Manjunath Nara ,  Anandakumar Parameshwarappa ,  Sivasankar Nagarajan ,  Dhirendra Kumar

IPC分类号： H04N23/90 ,  H01L21/67 ,  H04N23/56 ,  H04N23/50

CPC分类号： H04N23/90 ,  H01L21/67276 ,  H04N23/56 ,  H04N23/555

摘要： Embodiments disclosed herein include a diagnostic substrate, comprising a baseplate, and a first plurality of image sensors on the baseplate, where the first plurality of image sensors are oriented horizontal to the baseplate. In an embodiment, the diagnostic substrate further comprises a second plurality of image sensors on the baseplate, where the second plurality of image sensors are oriented at a non-orthogonal angle to the baseplate. In an embodiment, the diagnostic substrate further comprises a printed circuit board (PCB) on the baseplate, and a controller on the baseplate, where the controller is communicatively coupled to the first plurality of image sensors and the second plurality of image sensors by the PCB. In an embodiment, the diagnostic substrate further comprises a diffuser lid over the baseplate, the PCB, and the controller.

公开(公告)号：US11499869B2

公开(公告)日：2022-11-15

申请号：US16682616

申请日：2019-11-13

申请人： Applied Materials, Inc.

发明人： Chuang-Chia Lin ,  Upendra Ummethala

IPC分类号： G01J3/443 ,  H01J37/32 ,  G01N21/31 ,  H01L21/66

摘要： Embodiments disclosed herein include an optical sensor system for use in plasma processing tools. In an embodiment, the optical sensor system, comprises an optically clear body with a first surface and a second surface facing away from the first surface. In an embodiment, the optically clear body further comprises a third surface that is recessed from the second surface. In an embodiment, the optical sensor system further comprises a target over the third surface and a first reflector to optically couple the first surface to the target.

公开(公告)号：US20220272278A1

公开(公告)日：2022-08-25

申请号：US17668363

申请日：2022-02-09

申请人： Applied Materials, Inc.

发明人： Upendra Ummethala ,  Philip Kraus ,  Keith Berding ,  Blake Erickson ,  Patrick Tae ,  Devendra Channappa Holeyannavar ,  Shivaral Manjunath Nara ,  Anandakumar Parameshwarappa ,  Sivasankar Nagarajan ,  Dhirendra Kumar

IPC分类号： H04N5/247 ,  H01L21/67 ,  H04N5/225

摘要： Embodiments disclosed herein include a diagnostic substrate, comprising a baseplate, and a first plurality of image sensors on the baseplate, where the first plurality of image sensors are oriented horizontal to the baseplate. In an embodiment, the diagnostic substrate further comprises a second plurality of image sensors on the baseplate, where the second plurality of image sensors are oriented at a non-orthogonal angle to the baseplate. In an embodiment, the diagnostic substrate further comprises a printed circuit board (PCB) on the baseplate, and a controller on the baseplate, where the controller is communicatively coupled to the first plurality of image sensors and the second plurality of image sensors by the PCB. In an embodiment, the diagnostic substrate further comprises a diffuser lid over the baseplate, the PCB, and the controller.

公开(公告)号：US10901021B2

公开(公告)日：2021-01-26

申请号：US16283369

申请日：2019-02-22

申请人： APPLIED MATERIALS, INC.

发明人： Chuang-Chia Lin ,  Upendra Ummethala

IPC分类号： G01R29/08 ,  H01L21/66 ,  H01Q1/38

摘要： Embodiments include systems and methods for determining a processing parameter of a processing operation. Some embodiments include a diagnostic substrate that comprises a substrate, a circuit layer over the substrate, a capping layer over the circuit layer, and a sensing region across the capping layer. In an embodiment, the sensing region comprises, an array of first micro resonators and a second micro resonator. In an embodiment, the array of first micro resonators surround the second micro resonator.

公开(公告)号：US20190265286A1

公开(公告)日：2019-08-29

申请号：US16283364

申请日：2019-02-22

申请人： APPLIED MATERIALS, INC.

发明人： Chuang-Chia Lin ,  Upendra Ummethala

IPC分类号： G01R29/08 ,  H01L21/66 ,  H01Q1/38

摘要： Embodiments include systems and methods for determining a processing parameter of a processing operation. Embodiments include a diagnostic substrate for determining processing parameters of a processing operation. In an embodiment, the diagnostic substrate comprises a substrate, a circuit layer over the substrate, and a capping layer over the circuit layer. In an embodiment, a micro resonator sensor is in the circuit layer and the capping layer. In an embodiment, the micro resonator sensor comprises, a resonating body and one or more electrodes for inducing resonance in the resonating body.