公开(公告)号：US20210094229A1

公开(公告)日：2021-04-01

申请号：US16684519

申请日：2019-11-14

Applicant: Applied Materials, Inc.

Inventor： Dakshalkumar Patel ,  Girish Kumar Chaturvedi ,  Bahubali S. Upadhye ,  Sumedh Acharya ,  Mahendran Chidambaram ,  Nilesh Chimanrao Bagul

IPC: B29C64/205 ,  B29C64/264 ,  B29C64/245 ,  B29C64/241 ,  B29C64/255

Abstract: An additive manufacturing apparatus includes an environmentally sealed first chamber, a second chamber separated from the first chamber by a first valve, a platform positionable in the first chamber, a dispenser configured to deliver a plurality of successive layers of feed material onto the platform in the first chamber, at least one energy source to selectively fuse feed material in a layer on the platform in the first chamber, and an air knife assembly to direct a laminar flow of air across a layer of feed material on the platform in the first chamber. The air knife assembly includes an inlet module and an exhaust module that are movable through the first valve between the first chamber and the second chamber.

公开(公告)号：US09982364B2

公开(公告)日：2018-05-29

申请号：US15092875

申请日：2016-04-07

Applicant: APPLIED MATERIALS, INC.

Inventor： David Masayuki Ishikawa ,  Paul J. Steffas ,  Sumedh Acharya ,  Brian H. Burrows

IPC: C30B25/10 ,  C30B25/22 ,  H01L31/18 ,  H01L21/67 ,  H01L21/687 ,  C30B25/12 ,  C30B25/14 ,  C30B29/06 ,  C23C16/455 ,  C23C16/46 ,  H01L21/02

CPC classification number: C30B25/22 ,  C23C16/45502 ,  C23C16/45512 ,  C23C16/4557 ,  C23C16/46 ,  C30B25/10 ,  C30B25/12 ,  C30B25/14 ,  C30B29/06 ,  H01L21/02532 ,  H01L21/0262 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/6719 ,  H01L21/68771 ,  H01L31/1804 ,  Y02E10/547 ,  Y02P70/521

Abstract: In some embodiments, an substrate processing system may include a chamber body, a heater assembly disposed within the chamber body, wherein the heater assembly includes a plurality of resistive heater elements coupled together to form an isothermal heated enclosure, and a process kit disposed within the isothermal heated enclosure and having an inner processing volume that includes a plurality of substrate supports to support substrates when disposed thereon, wherein the process kit includes a first processing gas inlet to provide processing gases to the inner processing volume, a first carrier gas inlet to provide a carrier gas to the inner processing volume, and a first exhaust outlet, and a first gas heater coupled via a first conduit to the first carrier gas inlet to heat the carrier gas prior to flowing into the inner processing volume.