公开(公告)号：US20230260955A1

公开(公告)日：2023-08-17

申请号：US17670039

申请日：2022-02-11

Applicant: Applied Materials, Inc.

Inventor： Ying WANG ,  Guan Huei SEE

IPC: H01L23/00 ,  H01L21/66

CPC classification number: H01L24/80 ,  H01L22/22 ,  H01L2224/80004 ,  H01L2224/80896 ,  H01L2224/80801 ,  H01L2224/80011 ,  H01L2224/80048 ,  H01L2224/80986

Abstract: Methods of bonding one or more dies to a substrate are provided herein. In some embodiments, a method of bonding one or more dies to a substrate includes: applying a material coating on the one or more dies or the substrate; placing the one or more dies on the substrate so that the one or more dies temporarily adhere to the substrate via surface tension or tackiness of the material coating; inspecting each of the one or more dies that are placed on the substrate for defects; and removing any of the one or more dies that are found to have defects.

公开(公告)号：US20230215722A1

公开(公告)日：2023-07-06

申请号：US17569629

申请日：2022-01-06

Applicant: Applied Materials, Inc.

Inventor： Ying WANG ,  Guan Huei SEE ,  Gregory J. WILSON

IPC: H01L21/02 ,  H01L21/683 ,  H01L21/67 ,  B08B3/02

CPC classification number: H01L21/02076 ,  H01L21/6836 ,  H01L21/67051 ,  B08B3/02

Abstract: Methods, systems, and apparatus for cleaning and drying a tape-frame substrate are provided. In embodiments, an apparatus for supporting a tape-frame substrate includes a chuck having a first side and a second side opposite the first side, the first side having a convex surface configured to support the tape-frame substrate; and a plurality of channels extending through the chuck and having outlets along the first side, wherein the plurality of channels are configured to dispense fluid from the outlets along the convex surface of the first side. In embodiments, a support system includes the chuck and a holder configured to mount a tape-frame substrate to the chuck. The plurality of channels are configured to dispense fluid from the outlets and between the tape-frame substrate and the convex surface of the chuck when the tape-frame substrate is mounted to the chuck.