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公开(公告)号：US20220302570A1
公开(公告)日：2022-09-22
申请号：US17353595
申请日：2021-06-21
Applicant: Aptiv Technologies Limited
Abstract: This document describes a single-layer air waveguide antenna integrated on a circuit board. The waveguide guides electromagnetic energy through channels filled with air. It is formed from a single layer of material, such as a sheet of metal, metal-coated plastic, or other material with conductive surfaces that is attached to a circuit board. A portion of a surface of the circuit board is configured as a floor of the channels filled with air. This floor is an electrical interface between the circuit board and the channels filled with air. The single layer of material is positioned atop this electrical interface to define walls and a ceiling of the channels filled with air. The single layer of material can be secured to the circuit board in various ways. The cost of integrating an air waveguide antenna on to a circuit board this way may be less expensive than other waveguide-manufacturing techniques.
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公开(公告)号：US20220248525A1
公开(公告)日：2022-08-04
申请号：US17217511
申请日：2021-03-30
Applicant: APTIV TECHNOLOGIES LIMITED
Inventor： Scott D. Brandenburg , David W. Zimmerman , Navneet Gupta
IPC: H05K1/02 , H01L23/552 , H01L23/367 , H05K1/18 , H05K3/30 , H05K9/00 , H05K7/20 , G01S7/02 , G01S13/931
Abstract: An electromagnetic interference (EMI) shielding and thermal management system, method, and automotive radar system for an integrated circuit of a product circuit board (PCB) of a radar sensor includes a shield member disposed above the integrated circuit and extending to unpopulated areas of the PCB and configured to shield the integrated circuit from EMI and transfer heat energy generated by the integrated circuit away from the integrated circuit, and a set of pin members configured to be inserted through respective apertures defined by the shield member and the PCB and configured to transfer the heat energy from the shield member to an environment external to the PCB.
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公开(公告)号：US20220109247A1
公开(公告)日：2022-04-07
申请号：US17061675
申请日：2020-10-02
Applicant: Aptiv Technologies Limited
Inventor： Scott D. Brandenburg , Mark W. Hudson , David W. Zimmerman
Abstract: This document describes techniques and apparatuses for a plastic air-waveguide antenna with conductive particles. The described antenna includes an antenna body made from a resin embedded with conductive particles, a surface of the antenna body that includes a resin layer with no or fewer conductive particles, and a waveguide structure. The waveguide structure can be made from a portion of the surface on which the embedded conductive particles are exposed. The waveguide structure can be molded as part of the antenna body or cut into the antenna body using a laser, which also exposes the conductive particles. If the waveguide is molded as part of the antenna body, the conductive particles can be exposed by an etching process or by using the laser. In this way, the described apparatuses and techniques can reduce weight, improve gain and phase control, improve high-temperature performance, and avoid at least some vapor-deposition plating operations.
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公开(公告)号：US11509035B2
公开(公告)日：2022-11-22
申请号：US17375145
申请日：2021-07-14
Applicant: Aptiv Technologies Limited
Inventor： Scott D. Brandenburg , David W. Zimmerman , Shawn Shi
Abstract: An illustrative example embodiment of an antenna device includes a substrate, a plurality of antenna elements supported on the substrate, an integrated circuit supported on one side of the substrate, and a metallic waveguide antenna situated against the substrate. The metallic waveguide antenna includes a heat dissipation portion in a thermally conductive relationship with the integrated circuit. The heat dissipation portion is configured to reduce a temperature of the integrated circuit.
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公开(公告)号：US20220352640A1
公开(公告)日：2022-11-03
申请号：US17323877
申请日：2021-05-18
Applicant: Aptiv Technologies Limited
Inventor： Scott D. Brandenburg , David Wayne Zimmerman , Mark William Hudson
Abstract: This document describes techniques, apparatuses, and systems for a multi-layer air waveguide with layer-to-layer connections. Each pre-formed layer of the air waveguide is attached to at least one other pre-formed layer by a mechanical interface. The mechanical interface may be a stud-based interface, a snap fastener-based interface, a ball-and-socket based interface, or a pressure contact interface utilizing irregular roughed surfaces of each pre-formed layer. The mechanical interfaces of the pre-formed layers structurally hold the air waveguide together and electrically couple all of the pre-formed layers. In this manner, the cost of manufacturing the air waveguide antennas may be less expensive than previous manufacturing processes.
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Patent Agency Ranking
公开(公告)号：US20220271437A1
公开(公告)日：2022-08-25
申请号：US17663163
申请日：2022-05-12
Applicant: Aptiv Technologies Limited
Inventor： Scott D. Brandenburg , Mark W. Hudson , David W. Zimmerman
Abstract: This document describes techniques and apparatuses for a plastic air-waveguide antenna with conductive particles. The described antenna includes an antenna body made from a resin embedded with conductive particles, a surface of the antenna body that includes a resin layer with no or fewer conductive particles, and a waveguide structure. The waveguide structure can be made from a portion of the surface on which the embedded conductive particles are exposed. The waveguide structure can be molded as part of the antenna body or cut into the antenna body using a laser, which also exposes the conductive particles. If the waveguide is molded as part of the antenna body, the conductive particles can be exposed by an etching process or by using the laser. In this way, the described apparatuses and techniques can reduce weight, improve gain and phase control, improve high-temperature performance, and avoid at least some vapor-deposition plating operations.
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公开(公告)号：US20210375718A1
公开(公告)日：2021-12-02
申请号：US17403632
申请日：2021-08-16
Applicant: Aptiv Technologies Limited
Inventor： Scott D. Brandenburg , David W. Zimmerman
IPC: H01L23/427 , H01L23/373 , H01L23/42 , H01L23/04 , H01L23/29 , H01L23/473 , H01L21/48 , H05K1/02 , H05K1/18 , H01L23/498
Abstract: An electronic device includes a printed circuit board (PCB) that supports an integrated circuit (IC) chip. The device also includes a lid over the IC chip. A thermal interface material (TIM) is configured to transfer thermal energy from the IC chip to the lid. A heat spreader forms a cavity in communication with the lid. The heat spreader is at least partially filled with a liquid that is configured to change phases during operation of the IC chip.
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公开(公告)号：US20210074605A1
公开(公告)日：2021-03-11
申请号：US16566068
申请日：2019-09-10
Applicant: Aptiv Technologies Limited
Inventor： Scott D. Brandenburg , Mark W. Hudson
IPC: H01L23/367 , H01L23/373
Abstract: An electronics heat exchanger including a fluid flow body having a first panel, a second panel, and at least one fluid flow guide connecting the first panel and the second panel, a plurality of pedestals extending from the second panel, the plurality of pedestals including at least a first pedestal having a first height and a second pedestal having a second height, distinct from the first height, and wherein each of the pedestals is integral with the second panel.
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公开(公告)号：US10679770B1
公开(公告)日：2020-06-09
申请号：US16599688
申请日：2019-10-11
Applicant: APTIV TECHNOLOGIES LIMITED
Inventor： Scott D. Brandenburg
Abstract: An interface layer includes an electrically conductive compressible mesh that has wires that are interwoven and pores between the wires. A sinter paste is immobilized in the pores. The sinter paste includes electrically conductive particles.
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公开(公告)号：US12137515B2
公开(公告)日：2024-11-05
申请号：US17217511
申请日：2021-03-30
Applicant: APTIV TECHNOLOGIES LIMITED
Inventor： Scott D. Brandenburg , David W. Zimmerman , Navneet Gupta
IPC: H05K1/02 , G01S7/02 , G01S13/931 , H01L23/367 , H01L23/552 , H05K1/18 , H05K3/30 , H05K7/20 , H05K9/00
Abstract: An electromagnetic interference (EMI) shielding and thermal management system, method, and automotive radar system for an integrated circuit of a product circuit board (PCB) of a radar sensor includes a shield member disposed above the integrated circuit and extending to unpopulated areas of the PCB and configured to shield the integrated circuit from EMI and transfer heat energy generated by the integrated circuit away from the integrated circuit, and a set of pin members configured to be inserted through respective apertures defined by the shield member and the PCB and configured to transfer the heat energy from the shield member to an environment external to the PCB.
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