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公开(公告)号：US11948393B2
公开(公告)日：2024-04-02
申请号：US17908429
申请日：2021-11-15
Applicant: BOE Technology Group Co., Ltd.
Inventor： Hao Liu , Mei Li , Jiuzhen Wang , Zunqing Song , Qiuhua Meng , Caiyu Qu , Ming Liu
CPC classification number: G06V40/1306 , H10K59/65
Abstract: A display substrate and a display apparatus are provided. The display substrate includes: a base substrate; a plurality of sub-pixels arranged on the base substrate, wherein the sub-pixels each include a sub-pixel driving circuit; a plurality of fingerprint recognition structures arranged on the base substrate, wherein the fingerprint recognition structures each include a control circuit and a fingerprint recognition electrode, the fingerprint recognition electrode is located on a side of the control circuit facing away from the base substrate, the control circuit is coupled to the fingerprint recognition electrode, and the control circuit is used for outputting a sensing signal from the fingerprint recognition electrode; wherein the control circuit and the sub-pixel driving circuit are arranged in a direction parallel to the base substrate.
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公开(公告)号：US12089476B2
公开(公告)日：2024-09-10
申请号：US17676388
申请日：2022-02-21
Applicant: BOE Technology Group Co., Ltd.
Inventor： Ming Liu
IPC: H10K59/65 , H01L27/146 , H04N25/00 , H10K59/121 , H01L29/786
CPC classification number: H10K59/65 , H01L27/14603 , H01L27/1461 , H01L27/14616 , H01L27/14643 , H01L27/14689 , H04N25/00 , H10K59/1213 , H01L29/78675
Abstract: The present disclosure provides an image sensor, a manufacturing method thereof and a display device. The image sensor includes: a substrate; a first photodiode and a second photodiode located on the substrate, the first photodiode including a first electrode, a second electrode, and a first semiconductor structure located between the first electrode and the second electrode, the second photodiode including a third electrode, a fourth electrode, and a second semiconductor structure located between the third electrode and the fourth electrode, the first electrode being connected to the third electrode, the second electrode being connected to the fourth electrode; a switching thin film transistor, a source or a drain of the switching thin film transistor being connected to the second electrode or the first electrode; a capacitor connected in parallel with the first photodiode and the second photodiode for storing electrical signals when the image sensor receives light.
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公开(公告)号：US11974493B2
公开(公告)日：2024-04-30
申请号：US17281420
申请日：2020-06-04
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Hongwei Tian , Yanan Niu , Dong Li , Ming Liu , Zheng Liu
IPC: H10K77/10 , G09F9/30 , H10K59/131 , H10K102/00
CPC classification number: H10K77/111 , G09F9/301 , H10K59/131 , H10K2102/311
Abstract: A flexible substrate has at least one bendable region. The flexible substrate includes a flexible base, a first electrode layer disposed on the base, a first insulating layer disposed on a side of the first electrode layer away from the base, and a second electrode layer disposed on a side of the first insulating layer away from the base. The first electrode layer includes at least one first detection electrode, and the second electrode layer includes at least one second detection electrode. An orthogonal projection of a first detection electrode on the base overlaps at least partially with an orthogonal projection of a second detection electrode on the base. A region where orthogonal projections of the first detection electrode and the second detection electrode on the base are located overlaps with a bendable region.
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14.发明公开公开(公告)号：US20240090267A1
公开(公告)日：2024-03-14
申请号：US18512114
申请日：2023-11-17
Applicant: BOE Technology Group Co., Ltd.
Inventor： Jing Wang , Hongwei Tian , Ming Liu , Jia Zhao , Qiuhua Meng , Ziang Han
IPC: H10K59/121 , H10K59/122 , H10K59/124 , H10K71/00
CPC classification number: H10K59/1213 , H10K59/122 , H10K59/124 , H10K71/00 , H01L21/02565
Abstract: The present disclosure provides a displaying backplane and a displaying device, and relates to the technical field of displaying. The displaying backplane includes: a substrate base plate; a first active layer and a second active layer that are provided on the substrate base plate, wherein the material of the first active layer and the second active layer is an oxide semiconductor, the first active layer has a first channel region and first no-channel regions, and the second active layer has a second channel region and second no-channel regions; a first grid insulating layer covering the first active layer and the second active layer; and a first grid and a second grid that are provided on the first grid insulating layer; wherein the oxygen-vacancy concentration of the first channel region is greater than the oxygen-vacancy concentrations of the first no-channel regions, the second no-channel regions and the second channel region.
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15.发明授权公开(公告)号：US11670106B2
公开(公告)日：2023-06-06
申请号：US17504372
申请日：2021-10-18
Applicant: BOE Technology Group Co., Ltd.
Inventor： Jing Wang , Ming Liu , Zheng Liu , Hongwei Tian , Yibing Fan , Jia Zhao
IPC: G09G3/3208 , G06V40/13
CPC classification number: G06V40/1318 , G09G3/3208 , H10K50/813 , H10K50/822 , H10K59/122 , H10K59/40 , H10K71/00
Abstract: An optical fingerprint sensor is provided. The optical fingerprint sensor includes a backplate structure layer, a pixel defining layer, and an organic photoelectric sensing layer, wherein the pixel defining layer is disposed on a side of the backplate structure layer; and a non-pixel region of the pixel defining layer is provided with a first non-pixel hole, and the organic photoelectric sensing layer is disposed in the first non-pixel hole.
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Patent Agency Ranking
公开(公告)号：US11581507B2
公开(公告)日：2023-02-14
申请号：US16768146
申请日：2019-12-20
Applicant: BOE Technology Group Co., Ltd.
Inventor： Xiaolong Li , Ming Liu , Zheng Liu , Dawei Wang , Yanliu Sun
Abstract: A display panel is provided, which includes a base substrate, and a light-emitting device and an encapsulation structure sequentially arranged on the base substrate. The encapsulation structure includes at least one first encapsulation film layer, the first encapsulation film layer includes at least two inorganic layers arranged in a stack, and refractive indexes of the at least two inorganic layers sequentially increase in a direction close to the light-emitting device. The first encapsulation film layer is configured to adjust an angle of an ambient light incident on the light-emitting device to reduce the ambient light reflected from the display panel.
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公开(公告)号：US20220254852A1
公开(公告)日：2022-08-11
申请号：US17485764
申请日：2021-09-27
Applicant: BOE Technology Group Co., Ltd.
Inventor： Jing Wang , Hongwei Tian , Ming Liu , Jia Zhao , Qiuhua Meng , Ziang Han
Abstract: The present disclosure provides a method for fabricating a displaying backplane, a displaying backplane and a displaying device, and relates to the technical field of displaying. The method includes forming a first active layer and a second active layer on a substrate base plate; forming a first grid insulating layer covering the first active layer and the second active layer; forming a first grid on the first grid insulating layer; performing ion implantation to the first no-channel regions, the second no-channel regions and the second channel region, to reduce oxygen-vacancy concentrations of the first no-channel regions, the second no-channel regions and the second channel region; and forming a second grid on the first grid insulating layer.
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公开(公告)号：US11335883B2
公开(公告)日：2022-05-17
申请号：US16770916
申请日：2019-12-04
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Hongwei Tian , Yanan Niu , Chunyan Xie , Chunyang Wang , Dong Li , Zheng Liu , Ming Liu
Abstract: The present disclosure provides an organic light-emitting diode display substrate and a manufacturing method thereof. The manufacturing method includes: sequentially forming a first electrode, a light-emitting layer and a second electrode on a base substrate; forming a protection layer having a first opening on a side of the second electrode distal to the base substrate; and forming a second opening in the second electrode, the second opening being located below the first opening. In the present disclosure, with the protection layer, only a portion of the second electrode below the first opening is removed, so that other portions of the second electrode are prevented from being damaged, thereby eliminating a poor display of the display device.
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公开(公告)号：US20220102677A1
公开(公告)日：2022-03-31
申请号：US17228791
申请日：2021-04-13
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Ming Liu
IPC: H01L51/52
Abstract: Provided is a packaging structure, including an inorganic packaging layer and an organic packaging layer that are laminated on a substrate, wherein the organic packaging layer includes a microstructure layer and a planarization layer, a refractive index of the planarization layer being lower than that of the microstructure layer; wherein the microstructure layer includes a base structure on the inorganic packaging layer and a plurality of protrusion structures spaced apart on a surface of the base structure away from the inorganic packaging layer; and the planarization layer fills at least gaps between adjacent protrusion structures, and a side of the planarization layer away from the inorganic packaging layer is of a planar structure.
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公开(公告)号：US12063845B2
公开(公告)日：2024-08-13
申请号：US17358327
申请日：2021-06-25
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Ming Liu
IPC: H10K65/00 , H10K59/124 , H10K59/12
CPC classification number: H10K65/00 , H10K59/124 , H10K59/1201
Abstract: The present disclosure relates to a display device, a display panel and a method of manufacturing the same, and relates to display technology. The display panel of the present disclosure includes a driving backplane, a first planarization layer, a second planarization layer, light-emitting devices and photoelectric sensing devices. The first planarization layer is provided on one side of the driving backplane. The second planarization layer is provided on a surface of the first planarization layer distal to the driving backplane, and the second planarization layer is provided with sensing holes. The light-emitting devices are provided on a surface of the second planarization layer distal to the driving backplane and are located outside the sensing holes. The photoelectric sensing devices are provided on a surface of the second planarization layer distal to the driving backplane, and each of the photoelectric sensing devices is at least partially located inside the sensing hole.
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