INTEGRATED CIRCUIT CHIP EXTRACTOR AND METHOD FOR OPERATING THE SAME
    14.
    发明申请
    INTEGRATED CIRCUIT CHIP EXTRACTOR AND METHOD FOR OPERATING THE SAME 审中-公开
    集成电路芯片提取器及其操作方法

    公开(公告)号:US20160353623A1

    公开(公告)日:2016-12-01

    申请号:US15139185

    申请日:2016-04-26

    CPC classification number: H05K13/0486 G02F1/1309 G02F1/13454 Y10T29/53274

    Abstract: The present disclosure relates to an IC chip extractor for removing an IC chip from a panel. The IC chip extractor includes a base plate and a heating head arranged on the base plate. The heating head includes a protrusion protruded from an end of the heating head and a hook arranged at an end of the protrusion, the hook is capable of being in contact with a bottom of a portion the IC chip adjacent to a center of the panel.

    Abstract translation: 本公开涉及一种用于从面板上去除IC芯片的IC芯片提取器。 IC芯片提取器包括基板和布置在基板上的加热头。 加热头包括从加热头的端部突出的突起和布置在突起的端部处的钩,钩能够与IC的与芯片的中心相邻的部分的底部接触。

    DISPLAY MODULE AND DISPLAY APPARATUS
    15.
    发明公开

    公开(公告)号:US20240272348A1

    公开(公告)日:2024-08-15

    申请号:US18017987

    申请日:2022-04-20

    CPC classification number: G02B6/0073 G02B6/0083 G09G3/32

    Abstract: The present disclosure provides a display module and a display apparatus. The display module includes a display panel, a backlight assembly, an intermediate frame and a backplane; the backplane includes a backplane body on a side of the backlight assembly away from the display panel; the backplane body includes a contact structure recessed in a direction from a side away from the light guide assembly toward a side close to the light guide assembly. The contact structure is in contact with the light guide assembly; a receiving space is between the backplane body and the light guide assembly and on a side of the contact structure close to a lateral backlight source; an elastic contact member is in a receiving space and is in contact with the backplane body and is adjacent to the light guide assembly; the intermediate frame includes an intermediate frame body surrounding the backlight assembly.

    CURVED BACKLIGHT MODULE AND DISPLAY DEVICE

    公开(公告)号:US20220365395A1

    公开(公告)日:2022-11-17

    申请号:US17761514

    申请日:2021-05-12

    Abstract: Disclosed are a curved backlight module and a display device. The curved backlight module includes: an optical film and a lamp board which are oppositely provided, the distance between the optical film and the lamp board being referred to as an optical cavity height; the lamp board is provided with a plurality of lamp bars which extend in a first direction and are arranged in a second direction, a plurality of lamp beads distributed in an array are provided on each of the lamp bars, and the distribution parameters of the lamp beads on each of the lamp bars are the same; and on each of the lamp bars, there is a first distance between two adjacent lamp beads in the first direction, and there is a second distance between two adjacent lamp beads in the second direction.

    CURVED SURFACE DISPLAY DEVICE, VEHICLE AND BACKLIGHT ASSEMBLY

    公开(公告)号:US20210191184A1

    公开(公告)日:2021-06-24

    申请号:US17036444

    申请日:2020-09-29

    Abstract: A curved surface display device, a vehicle and a backlight assembly are provided. The curved surface display device includes a display panel, a first middle frame, a backlight assembly and a back plate. The first middle frame is located on a non-display side of the display panel and configured to support the display panel; the backlight assembly is located at a side of the first middle frame away from the display panel and includes an optical film and a second middle frame, the second middle frame is located at a side of the optical film away from the display panel; the back plate is located at a side of the backlight assembly away from the display panel. The back plate includes a bottom plate and a side plate disposed on an edge of the bottom plate, and the second middle frame is connected to the bottom plate.

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