中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

37 records (took 0.021 seconds)

    ARRAY ANTENNA AND MAN-MACHINE INTERACTION APPARATUS
    11.
    发明公开
    ARRAY ANTENNA AND MAN-MACHINE INTERACTION APPARATUS 审中-公开

    公开(公告)号：US20240302489A1

    公开(公告)日：2024-09-12

    申请号：US18027749

    申请日：2022-05-30

    Applicant: Beijing BOE Technology Development Co., Ltd. ,  BOE TECHNOLOGY GROUP CO., LTD.

    Inventor： Zongmin LIU ,  Feng QU ,  Biqi LI

    IPC: G01S7/03

    CPC classification number: G01S7/03

    Abstract: An array antenna includes M number of first array elements, N number of second array elements, at least one first link and at least one second link, where M≥2, and/or N≥2, and both of M and N are positive integers; where in a case where M≥2, at least two of the M number of first array elements are connected to corresponding first switch units, respectively; and at least two of the first array elements electrically connected to the first switch units are electrically connected to a same first link; and/or in a case where N≥2, at least two of the N number of second array elements are connected to corresponding second switch units, respectively; and at least two of the second array elements electrically connected to the second switch units are electrically connected to a same second link.

    SIGNAL PROCESSING METHOD, READABLE STORAGE MEDIUM, AND ULTRASONIC IMAGING SYSTEM
    15.
    发明申请
    SIGNAL PROCESSING METHOD, READABLE STORAGE MEDIUM, AND ULTRASONIC IMAGING SYSTEM 有权

    公开(公告)号：US20220313218A1

    公开(公告)日：2022-10-06

    申请号：US17426713

    申请日：2020-10-26

    Applicant: BOE TECHNOLOGY GROUP CO., LTD.

    Inventor： Zongmin LIU ,  Jijing HUANG ,  Mengjun HOU ,  Qiong WU

    IPC: A61B8/08 ,  A61B8/14

    Abstract: A signal processing method for performing processing of logarithmic compression with base k on to-be-processed signal (k being greater than 1), comprising: acquiring value of integer part of a result of logarithmic compression corresponding to the to-be-processed signal; calculating fractional part evaluation parameter Q according to the to-be-processed signal and the value of the integer part, Q=d*kT−N, d being value of the to-be-processed signal and greater than 0, N being the value of the integer part, T being a preset constant; evaluating, according to the fractional part evaluation parameter and a preset correspondence table, value M of a fractional part corresponding to the fractional part evaluation parameter, the correspondence table having different fractional part evaluation parameters and values of the fractional part corresponding to the fractional part evaluation parameters; obtaining the result of logarithmic compression according to value N of the integer part and value M of the fractional part.

    CHIP STRUCTURE, PACKAGING STRUCTURE AND MANUFACTURING METHOD FOR CHIP STRUCTURE
    16.
    发明申请
    CHIP STRUCTURE, PACKAGING STRUCTURE AND MANUFACTURING METHOD FOR CHIP STRUCTURE 有权

    公开(公告)号：US20220139859A1

    公开(公告)日：2022-05-05

    申请号：US17489759

    申请日：2021-09-29

    Applicant: BOE TECHNOLOGY GROUP CO., LTD.

    Inventor： Zongmin LIU ,  Liye DUAN ,  Jijing HUANG ,  Mengjun HOU

    IPC: H01L23/00 ,  H01L23/498 ,  H01L23/66

    Abstract: The present disclosure provides a chip structure, a packaging structure and a manufacturing method for the chip structure. The chip structure includes at least one chip body, each of which includes at least one radio frequency front-end device; the chip structure further includes a redistribution layer stacked on the chip body and at least one pin on the redistribution layer; each radio frequency front-end device corresponds to one pin, which is electrically connected to the radio frequency front-end device through an electrical connector extending through the redistribution layer; an extending direction of the radio frequency front-end device is consistent with an extending direction of the pin corresponding to the radio frequency front-end device; a surface of the pin distal to the redistribution layer is a first plane. In the present disclosure, with the first plane, the chip may be directly and electrically connected to a flexible circuit board.

    REGISTRATION SYSTEM
    17.
    发明申请
    REGISTRATION SYSTEM 有权

    公开(公告)号：US20220137733A1

    公开(公告)日：2022-05-05

    申请号：US17513713

    申请日：2021-10-28

    Applicant: BOE Technology Group Co., Ltd.

    Inventor： Jijing HUANG ,  Zhiming YANG ,  Chuqian ZHONG ,  Zongmin LIU ,  Dawei TANG ,  Qiong WU

    IPC: G06F3/043 ,  G06K9/00 ,  G06F3/0488

    Abstract: A registration system is provided. The registration system includes: a display device, a collection device and an ultrasonic generating device. The display device is configured to display a graphical user interface. The collection device is configured to collect a scene image at the display device to recognize an operation of a user on the graphical user interface. The ultrasonic generating device is configured to emit ultrasonic signals, so that the ultrasonic signals gather to form one or more virtual buttons for operating the graphical user interface.

    HOLOGRAPHIC LEAKY-WAVE ANTENNA AND ELECTRONIC DEVICE
    18.
    发明公开
    HOLOGRAPHIC LEAKY-WAVE ANTENNA AND ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20240291163A1

    公开(公告)日：2024-08-29

    申请号：US18290781

    申请日：2023-02-28

    Applicant: BOE Technology Group Co., Ltd.

    Inventor： Yiqun HU ,  Jia FANG ,  Zongmin LIU ,  Feng QU

    IPC: H01Q13/28 ,  H01Q1/50 ,  H01Q17/00

    CPC classification number: H01Q13/28 ,  H01Q1/50 ,  H01Q17/00

    Abstract: A holographic leaky-wave antenna includes a first waveguide structure, a first dielectric substrate, a radiation layer, and a first reference electrode layer. The first dielectric substrate is arranged on the first waveguide structure and has a first gap with the waveguide structure. The first reference electrode layer is arranged on a side of the first waveguide structure distal to the first dielectric substrate. The radiation layer is arranged on a side of the first dielectric substrate distal to the first waveguide structure, and has a plurality of slit openings therein. The holographic leaky-wave antenna further comprises a plurality of feeding ports configured on the first waveguide structure, and an orthogonal projection of each of the plurality of feeding ports on the first dielectric substrate does not overlap with an orthogonal projection of the first reference electrode layer on the first dielectric substrate.

    DETECTION CHIP AND MANUFACTURING METHOD THEREFOR, AND REACTION SYSTEM
    20.
    发明申请
    DETECTION CHIP AND MANUFACTURING METHOD THEREFOR, AND REACTION SYSTEM 有权

    公开(公告)号：US20220411732A1

    公开(公告)日：2022-12-29

    申请号：US17780251

    申请日：2021-01-14

    Applicant: BOE Technology Group Co., Ltd.

    Inventor： Mengjun HOU ,  Zijian ZHAO ,  Yudan YIN ,  Zongmin LIU ,  Liye DUAN

    IPC: C12M1/34

    Abstract: Disclosed are a detection chip and a manufacturing method therefor, and a reaction system. The detection chip includes: a first substrate (11); a microcavity defining layer (12), which is located on the first substrate (11) and defines a plurality of micro-reaction chambers (120); and a shading structure layer (13), which is located on the first substrate (11) and provided among the plurality of micro-reaction chambers (120). In practical application, the number of target molecules in a reaction system solution in each micro-reaction chamber (120) can be determined by collecting a fluorescence image; and the detection chip is provided with the shading structure layer (13), and the shading structure layer (13) is located on the first substrate (11) and provided among the plurality of micro-reaction chambers (120).

Patent Agency Ranking