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17 条记录 (耗时 0.03 秒)

    Polyaluminum chloride and aluminum chlorohydrate, processes and compositions: high-basicity and ultra high-basicity products
    12.
    发明授权
    Polyaluminum chloride and aluminum chlorohydrate, processes and compositions: high-basicity and ultra high-basicity products 有权
    聚氯化铝和氯化铝水合物，工艺和组成：高碱度和超高碱度的产品

    公开(公告)号：US07846318B2

    公开(公告)日：2010-12-07

    申请号：US11619483

    申请日：2007-01-03

    申请人： William E. Pratt ,  Joseph J. Stevens ,  Peter G. Symons

    发明人： William E. Pratt ,  Joseph J. Stevens ,  Peter G. Symons

    IPC分类号： C25D5/34 ,  C25B1/24 ,  B01D61/00 ,  C01B17/45 ,  C01B17/46

    CPC分类号： C01F7/56 ,  A61K8/26 ,  A61Q15/00 ,  B01D61/44 ,  C01B9/02 ,  C01G23/02 ,  C01G25/04 ,  C01G49/10

    摘要： The invention relates generally to processes for the production of high-basicity and ultra-high basicity polyaluminum chlorides including aluminum chlorohydrate. The processes can produce products of a wide range of basicities and are particularly useful in producing high basicity products. The process can produce a wide range of solution concentrations and are particularly useful in producing high solution concentrations. The processes described generate high purity products, which are free of by-product salt(s). The processes described herein can also be utilized to produce enhanced efficacy polyaluminum chlorides including aluminum chlorohydrate. When compared to conventional processes for manufacturing these compounds the processes disclosed herein are unique in so far as the disclosed processes do not require aluminum metal as a starting material. The products of the processes are suitable in applications including water purification, catalysts, and antiperspirants. In addition, the invention is directed to the products prepared by the processes described herein.

    摘要翻译： 本发明一般涉及生产包括氯化铝水合物在内的高碱度和超高碱性聚氯化铝的方法。 该工艺可生产各种碱性产品，特别适用于生产高碱度产品。 该方法可产生大范围的溶液浓度，特别适用于生产高溶液浓度。 所述方法产生不含副产物盐的高纯度产物。 本文所述的方法也可用于产生包括氯化铝水合物的增强效力的聚氯化铝。 与用于制造这些化合物的常规方法相比，本文公开的方法是独特的，只要所公开的方法不需要铝金属作为起始材料即可。 该方法的产品适用于包括水净化，催化剂和止汗剂在内的应用。 此外，本发明涉及通过本文所述方法制备的产品。

    Method and associated apparatus for tilting a substrate upon entry for metal deposition
    13.
    发明授权
    Method and associated apparatus for tilting a substrate upon entry for metal deposition 失效
    用于在进入金属沉积时使衬底倾斜的方法和相关设备

    公开(公告)号：US06582578B1

    公开(公告)日：2003-06-24

    申请号：US09678947

    申请日：2000-10-03

    申请人： Yezdi N. Dordi ,  Joseph J. Stevens ,  Michael N. Sugarman

    发明人： Yezdi N. Dordi ,  Joseph J. Stevens ,  Michael N. Sugarman

    IPC分类号： C25D500

    CPC分类号： H01L21/67167 ,  C25D7/123 ,  C25D17/001 ,  C25D21/00 ,  C25D21/04 ,  H01L21/2885 ,  H01L21/67028 ,  H01L21/67051 ,  H01L21/6723 ,  H05K3/241

    摘要： An electro-chemical plating system is described. A method is performed by the electro-chemical plating system in which a seed layer formed on a substrate is immersed into an electrolyte solution. In one aspect, a substrate is immersed in the electrochemical plating system by tilting the substrate as it enters the electrolyte solution to limit the trapping or formation of air bubbles in the electrolyte solution between the substrate and the substrate holder. In another aspect, an apparatus is provided for electroplating that comprises a cell, a substrate holder, and an actuator. The actuator can displace the substrate holder assembly in the x and z directions and also tilt the substrate. In another aspect, a method is provided of driving a meniscus formed by electrolyte solution across a surface of a substrate. The method comprises enhancing the interaction between the electrolyte solution meniscus and the surface as the substrate is immersed into the electrolyte solution.

    摘要翻译： 描述了电化学电镀系统。 通过将形成在基板上的籽晶层浸渍在电解液中的电化学电镀系统进行。 一方面，当基板进入电解质溶液时，通过使基板倾斜以限制基板和基板支架之间的电解液中的气泡的捕获或形成，将基板浸入电化学电镀系统中。 在另一方面，提供一种用于电镀的设备，其包括电池，衬底保持器和致动器。 致动器可以在x和z方向上移动基板保持器组件，并且还使基板倾斜。 在另一方面，提供一种驱动由电解质溶液形成的弯液面跨越衬底的表面的方法。 该方法包括当基底浸入电解质溶液时增强电解液溶液弯液面与表面之间的相互作用。

    Two piece anti-stick clamp ring
    14.
    发明授权
    Two piece anti-stick clamp ring 失效
    两片防卡钳环

    公开(公告)号：US5632873A

    公开(公告)日：1997-05-27

    申请号：US446396

    申请日：1995-05-22

    申请人： Joseph J. Stevens ,  Roy J. Edwards ,  Avi Tepman

    发明人： Joseph J. Stevens ,  Roy J. Edwards ,  Avi Tepman

    IPC分类号： C23C14/50 ,  C23C16/458 ,  H01L21/687 ,  C23C14/34 ,  B05C13/00 ,  C23C16/04

    CPC分类号： H01L21/68721 ,  C23C14/50 ,  C23C16/4585

    摘要： A chamber for depositing a film layer on a substrate includes a support member on which the substrate is positioned for processing in the chamber, and a ring assembly suspended in the chamber on a chamber shield. The ring assembly comprises first and second rings, the second ring being disposed intermediate the first ring and the substrate. The support member is positionable in the chamber to receive a substrate thereon, and further positionable to pass the substrate through the shield and thereby lift the ring assembly off the shield. After deposition is complete, the support member retracts through the shield, to reposition the outer ring on the shield. The inner ring continues to move downwardly with the substrate support member a short distance before it is repositioned on the shield. In the event that a deposition material layer has formed between the substrate and the outer ring, the inner ring includes a plurality of tabs thereon which contact the substrate to force it out of the ring assembly as the inner ring continues downwardly after the outer ring has been positioned on the shield.

    摘要翻译： 用于在衬底上沉积膜层的室包括支撑构件，衬底位于该支撑构件上用于在室中进行处理，以及环形组件，其悬挂在腔室屏蔽中的腔室中。 环组件包括第一和第二环，第二环设置在第一环和衬底之间。 支撑构件可定位在腔室中以在其上接收衬底，并且可进一步定位以使衬底穿过屏蔽件，从而将环组件提离屏蔽。 沉积完成后，支撑构件通过屏蔽件缩回，以将外环重新定位在屏蔽上。 在其被重新定位在护罩上之前，内环继续向下移动，衬底支撑构件短距离。 在衬底和外环之间形成沉积材料层的情况下，内圈包括多个接头，当外环具有内环时内环继续向下，接触衬底以将其压出环组件 被定位在盾牌上。

    Electric contact element for electrochemical deposition system and method
    16.
    发明授权
    Electric contact element for electrochemical deposition system and method 有权
    电接触元件电化学沉积系统及方法

    公开(公告)号：US06613214B2

    公开(公告)日：2003-09-02

    申请号：US09730968

    申请日：2000-12-05

    申请人： Yezdi N. Dordi ,  Joseph J. Stevens

    发明人： Yezdi N. Dordi ,  Joseph J. Stevens

    IPC分类号： C25D502

    CPC分类号： C25D17/001 ,  C25D7/123 ,  C25D17/12 ,  H01L21/2885 ,  H05K3/241

    摘要： An apparatus and associated method for deposition of metal ions contained in an electrolyte solution to form a metal film primarily on a seed layer formed on at least a first side of a substrate. The substrate has a second side that is opposed the first side and an edge joining the first side and the second side. The apparatus comprises a substrate holder system and an electric contact element. The electric contact element physically contacts one of the second side or the edge of the substrate. In one aspect, the substrate is rotated about its vertical axis when the seed layer of substrate is immersed in the electrolyte solution during the metal film deposition. In another aspect, the substrate is not rotated about its vertical axis when the seed layer on the substrate is immersed in the electrolyte solution during the metal film deposition. In different embodiments, the electric contact element contacts the seed layer on the second side of the substrate, a diffusion barrier layer on the second side of the substrate, or the seed layer on the edge of the substrate.

    摘要翻译： 一种用于沉积包含在电解质溶液中的金属离子的装置和相关方法，以主要形成在形成在基底的至少第一侧上的种子层上形成金属膜。 衬底具有与第一侧相对的第二侧和连接第一侧和第二侧的边缘。 该装置包括基板保持器系统和电接触元件。 电接触元件物理地接触基板的第二面或边缘中的一个。 在一个方面，当在金属膜沉积期间将衬底的晶种层浸入电解质溶液中时，衬底围绕其垂直轴线旋转。 在另一方面，当在金属膜沉积期间当衬底上的晶种层浸入电解质溶液中时，衬底不绕其垂直轴旋转。 在不同的实施例中，电接触元件接触衬底的第二侧上的种子层，在衬底的第二侧上的扩散阻挡层或衬底的边缘上的种子层。