-
公开(公告)号：US20180117618A1
公开(公告)日：2018-05-03
申请号：US15727109
申请日：2017-10-06
发明人： Masayuki UTSUMI , Masahito TANIGAWA
摘要： A surface treating apparatus that suppresses occurrence of defects is provided. A treatment solution is accumulated in a tank 15 through a treatment solution collecting port/air discharging port 13 in a lower portion of a bath 4. An air heated by the treatment solution flows toward an upper portion (portion without the treatment solution) of the tank 15 via the treatment solution collecting port/air discharging port 13 in the lower portion of the bath 4, and is discharged via an exhaust duct 17. In this way, the air that is heated and tends to flow upward in the bath 4 is discharged from the lower portion thereof and is replaced with an external air from the upper portion thereof. Accordingly, the air in the bath 4 can be maintained at a uniform temperature. Thus, the treatment solution that reaches a lower portion of a substrate 54 from an upper portion thereof can be maintained at a uniform temperature. The air is caused to flow toward the lower portion from the upper portion in the bath 4, so that the substrate 54 is pulled downward, and swinging of the substrate 54 can thus be reduced. Therefore, the substrate 54 can be less likely to contact an inlet 44 and an outlet 46.
-
公开(公告)号：US20180087140A1
公开(公告)日：2018-03-29
申请号：US15600928
申请日：2017-05-22
摘要： A device capable of performing surface treatment evenly to an upper portion of a substrate is provided. An upper end of a substrate 54 is sandwiched and held by a clip 52 of a hanger 50. A pipe 56 as a treatment solution releasing section is provided on each side of the substrate 54 that is held by the hanger 50. This pipe 56 is provided with a hole 58 from which the treatment solution is released obliquely upward. The released treatment solution flows down on a surface of the substrate 54, reaches a lower portion thereof, is circulated by a pump 60, and is released from the pipe 56 again.
-
13.发明申请公开(公告)号：US20180023197A1
公开(公告)日：2018-01-25
申请号：US15549471
申请日：2016-01-25
CPC分类号： C23C18/2066 , C23C18/2086 , C23C18/22 , C23C18/38 , H05K3/18 , H05K3/181 , H05K3/381 , H05K2203/0776 , H05K2203/0793
摘要： The ampholytic surfactants show the nature of anionic surfactants in an alkaline region and the nature of cationic surfactants in an acidic region. As described below, the pretreatment solution of the present invention may preferably indicate alkalinity of pH 8.5 or higher, and therefore, it exhibits the nature of cationic surfactants by the use of ampholytic surfactants. As the ampholytic surfactants, those disclosed in JP 2011-228517 A can be used.
-
14.发明申请PRETREATMENT AGENT FOR ELECTROLESS PLATING, AND PRETREATMENT AND PRODUCTION OF PRINTED WIRING BOARD USING SAME 有权用于电镀的预处理剂，使用相同的印刷电路板的预处理和生产公开(公告)号：US20150072070A1
公开(公告)日：2015-03-12
申请号：US14478332
申请日：2014-09-05
CPC分类号： H05K3/381 , C23C18/16 , C23C18/1653 , C23C18/2086 , C23C18/22 , C23C18/30 , C23C18/38 , H05K3/181 , H05K2203/0776 , H05K2203/0783 , H05K2203/0789
摘要： A pretreatment agent for electroless plating is provided, which includes: a fluorine compound; a surfactant; and at least one solvent selected from ethylene-based glycol butyl ethers of formula: C4H9—(OC2H4)m—OH where m is an integer of 1 to 4, and propylene-based glycol butyl ethers of formula: C4H9—(OC3H6)n—OH where n is an integer of 1 to 4. Also provided are a method for pretreating a substrate to be used for a printed wiring board, and a process for producing a printed wiring board, both of which include using a pretreatment agent for electroless plating as described above.
摘要翻译： 提供了一种用于化学镀的预处理剂，其包括：氟化合物; 表面活性剂; 和至少一种溶剂，其选自式为C 4 H 9 - （OC 2 H 4）m -OH的乙烯基乙二醇丁醚，其中m为1至4的整数，以及式C 4 H 9 - （OC 3 H 6）n的丙烯基二醇丁基醚 -OH，其中n是1至4的整数。还提供了用于预处理用于印刷线路板的基板的方法以及印刷线路板的制造方法，其中包括使用无电化学处理剂 如上所述。
-
-
-
搜索结果
14 条记录 (耗时 0.015 秒)
