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    STRENGTHENED GLASS ARTICLES HAVING ETCHED FEATURES AND METHODS OF FORMING THE SAME
    13.
    发明申请
    STRENGTHENED GLASS ARTICLES HAVING ETCHED FEATURES AND METHODS OF FORMING THE SAME 有权
    具有蚀刻特征的强化玻璃制品及其形成方法

    公开(公告)号：US20130273324A1

    公开(公告)日：2013-10-17

    申请号：US13800033

    申请日：2013-03-13

    Applicant: CORNING INCORPORATED

    Inventor： Johannes Moll ,  James Joseph Price ,  Alranzo Boh Ruffin ,  Sergio Tsuda ,  Robert Stephen Wagner ,  James Joseph Watkins

    IPC: C03C23/00

    CPC classification number: C03C23/0025 ,  B41M5/24 ,  B44C1/227 ,  B44C1/228 ,  C03C21/002 ,  Y10T428/24479 ,  Y10T428/24521

    Abstract: Strengthened glass articles having laser etched features, electronic devices, and methods of fabricating etched features in strengthened glass articles are disclosed. In one embodiment, a strengthened glass article includes a first strengthened surface layer and a second strengthened surface layer under a compressive stress and extending from a first surface and a second surface, respectively, of the strengthened glass article to a depth of layer, and a central region between the first strengthened surface layer and the second strengthened surface layer that is under tensile stress. The strengthened glass article further includes at least one etched feature formed by laser ablation within the first surface or the second surface having a depth that is less than the depth of layer and a surface roughness that is greater than a surface roughness of the first surface or second surface outside of the at least one etched feature.

    Abstract translation: 公开了具有激光蚀刻特征的加强玻璃制品，电子装置和在加强玻璃制品中制造蚀刻特征的方法。 在一个实施例中，加强的玻璃制品在压缩应力下包括第一加强表面层和第二增强表面层，并且分别从强化玻璃制品的第一表面和第二表面延伸到层的深度， 第一强化表面层和处于拉伸应力的第二强化表面层之间的中心区域。 所述强化玻璃制品还包括至少一个蚀刻特征，所述蚀刻特征通过在所述第一表面或所述第二表面内的激光烧蚀形成，所述蚀刻特征具有小于所述层的深度的深度和大于所述第一表面的表面粗糙度的表面粗糙度， 在所述至少一个蚀刻特征之外的第二表面。

    GLASS STRUCTURES AND ASSEMBLY OF THE SAME VIA LASER WELDING
    14.
    发明申请
    GLASS STRUCTURES AND ASSEMBLY OF THE SAME VIA LASER WELDING 有权

    公开(公告)号：US20240368019A1

    公开(公告)日：2024-11-07

    申请号：US18646996

    申请日：2024-04-26

    Applicant: CORNING INCORPORATED

    Inventor： Stuart Gray ,  Ying Liu ,  Alranzo Boh Ruffin ,  Craig John Mancusi Ungaro

    IPC: C03B23/203 ,  B23K26/21 ,  B23K26/324 ,  B23K103/00 ,  G02B5/08

    Abstract: Disclosed are various embodiments of glass structures and the assembly of the same by way of laser welding. In one embodiment, the glass structures may comprise a lightweight mirror or other structure. In constructing a lightweight mirror, a core is assembled by creating laser welded joints between individual ones of a plurality of glass parts. At least one laser access opening is cut out in one or more of the glass parts or plates. In the assembling, various pairs of glass parts are positioned to create abutments therebetween. Further, a laser is directed through at least one laser access opening toward at least one of the abutments to create one or more of the laser welded joints.

    METHODS FOR LASER PROCESSING TRANSPARENT WORKPIECES USING PULSED LASER BEAM FOCAL LINES AND VAPOR ETCHING
    16.
    发明申请
    METHODS FOR LASER PROCESSING TRANSPARENT WORKPIECES USING PULSED LASER BEAM FOCAL LINES AND VAPOR ETCHING 有权

    公开(公告)号：US20210283713A1

    公开(公告)日：2021-09-16

    申请号：US17327194

    申请日：2021-05-21

    Applicant: CORNING INCORPORATED

    Inventor： Heather Debra Boek ,  Andreas Simon Gaab ,  Garrett Andrew Piech ,  Alranzo Boh Ruffin ,  Daniel Arthur Sternquist ,  Michael Brian Webb

    IPC: B23K26/00

    Abstract: A method for processing a transparent workpiece includes directing a pulsed laser beam into the transparent workpiece such that a portion of the pulsed laser beam directed into the transparent workpiece generates an induced absorption within the transparent workpiece, thereby forming a damage line within the transparent workpiece, and the portion of the pulsed laser beam directed into the transparent workpiece includes a wavelength λ, a spot size wo, and a Rayleigh range ZR that is greater than F D ⁢ π ⁢ w 0 , 2 λ , where FD is a dimensionless divergence factor comprising a value of 10 or greater. Further, the method for processing the transparent workpiece includes etching the transparent workpiece with an etching vapor to remove at least a portion of the transparent workpiece along the damage line, thereby forming an aperture extending through the at least a portion of the thickness of the transparent workpiece.

    Methods for laser processing transparent workpieces using pulsed laser beam focal lines and vapor etching
    17.
    发明授权
    Methods for laser processing transparent workpieces using pulsed laser beam focal lines and vapor etching 有权

    公开(公告)号：US11052481B2

    公开(公告)日：2021-07-06

    申请号：US16776055

    申请日：2020-01-29

    Applicant: CORNING INCORPORATED

    Inventor： Heather Debra Boek ,  Andreas Simon Gaab ,  Garrett Andrew Piech ,  Alranzo Boh Ruffin ,  Daniel Arthur Sternquist ,  Michael Brian Webb

    IPC: B23K26/00 ,  B23K26/362

    Abstract: A method for processing a transparent workpiece includes directing a pulsed laser beam into the transparent workpiece such that a portion of the pulsed laser beam directed into the transparent workpiece generates an induced absorption within the transparent workpiece, thereby forming a damage line within the transparent workpiece, and the portion of the pulsed laser beam directed into the transparent workpiece includes a wavelength λ, a spot size w0, and a Rayleigh range ZR that is greater than F D ⁢ π ⁢ w 0 2 λ , where FD is a dimensionless divergence factor comprising a value of 10 or greater. Further, the method for processing the transparent workpiece includes etching the transparent workpiece with an etching vapor to remove at least a portion of the transparent workpiece along the damage line, thereby forming an aperture extending through the at least a portion of the thickness of the transparent workpiece.

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