Strengthened glass articles having etched features and methods of forming the same

    公开(公告)号:US11001523B2

    公开(公告)日:2021-05-11

    申请号:US15906225

    申请日:2018-02-27

    Abstract: Strengthened glass articles having laser etched features, electronic devices, and methods of fabricating etched features in strengthened glass articles are disclosed. In one embodiment, a strengthened glass article includes a first strengthened surface layer and a second strengthened surface layer under a compressive stress and extending from a first surface and a second surface, respectively, of the strengthened glass article to a depth of layer, and a central region between the first strengthened surface layer and the second strengthened surface layer that is under tensile stress. The strengthened glass article further includes at least one etched feature formed by laser ablation within the first surface or the second surface having a depth that is less than the depth of layer and a surface roughness that is greater than a surface roughness of the first surface or second surface outside of the at least one etched feature.

    METHODS AND OPTICAL ASSEMBLIES FOR HIGH ANGLE LASER PROCESSING OF TRANSPARENT WORKPIECES

    公开(公告)号:US20220073401A1

    公开(公告)日:2022-03-10

    申请号:US17407824

    申请日:2021-08-20

    Abstract: A method for processing a transparent workpiece includes directing a laser beam oriented along a beam pathway through an aspheric optical element and the transparent workpiece. The laser beam impinges the aspheric optical element radially offset from a centerline axis of the aspheric optical element by an offset distance of 30% the 1/e2 diameter of the laser beam or greater. The beam pathway and the transparent workpiece are tilted relative to one another such that the beam pathway has a beam pathway angle of less than 90° relative to an impingement surface at the impingement surface and a portion of the laser beam directed into the transparent workpiece is a laser beam focal line having an internal focal line angle of less than 80° relative to the impingement surface, such that a defect with a defect angle of less than 80° is formed by induced absorption within the transparent workpiece.

    ELECTRICALLY CONDUCTIVE ARTICLES WITH DISCRETE METALLIC SILVER LAYERS AND METHODS FOR MAKING SAME
    6.
    发明申请
    ELECTRICALLY CONDUCTIVE ARTICLES WITH DISCRETE METALLIC SILVER LAYERS AND METHODS FOR MAKING SAME 审中-公开
    具有隔离金属层的电导体文章及其制造方法

    公开(公告)号:US20160322694A1

    公开(公告)日:2016-11-03

    申请号:US15139550

    申请日:2016-04-27

    Abstract: An electrically conductive article that includes a monolithic glass body having a first primary surface; and an electrically conducting element formed in the body. The element includes a discrete layer, or a plurality of discrete layers, of metallic silver. Each layer has a thickness T such that 0.1 μm≦T≦0.5 μm and an electrical resistivity of about 50 nΩ·m to about 2000 nΩ·m. In addition, the element is spaced apart from the first primary surface by a distance D, wherein 0.1 μm≦D≦20 μm. In some aspects, the electrically conducting element and/or the monolithic glass body are configured as an antenna assembly, an optical fiber or a flexible glass substrate.

    Abstract translation: 一种导电制品,其包括具有第一主表面的单片玻璃体; 以及形成在主体中的导电元件。 该元件包括金属银的离散层或多个离散层。 各层的厚度T为0.1μm≤T≤0.5μm,电阻率为约50nΩ·m〜约2000nΩ·m。 此外,元件与第一主表面间隔距离D,其中0.1μm≤D≤20μm。 在一些方面,导电元件和/或单片玻璃体被配置为天线组件,光纤或柔性玻璃基板。

    METHODS FOR LASER PROCESSING TRANSPARENT WORKPIECES USING PULSED LASER BEAM FOCAL LINES AND VAPOR ETCHING

    公开(公告)号:US20200254557A1

    公开(公告)日:2020-08-13

    申请号:US16776055

    申请日:2020-01-29

    Abstract: A method for processing a transparent workpiece includes directing a pulsed laser beam into the transparent workpiece such that a portion of the pulsed laser beam directed into the transparent workpiece generates an induced absorption within the transparent workpiece, thereby forming a damage line within the transparent workpiece, and the portion of the pulsed laser beam directed into the transparent workpiece includes a wavelength λ, a spot size w0, and a Rayleigh range ZR that is greater than F D  π  w 0 2 λ , where FD is a dimensionless divergence factor comprising a value of 10 or greater. Further, the method for processing the transparent workpiece includes etching the transparent workpiece with an etching vapor to remove at least a portion of the transparent workpiece along the damage line, thereby forming an aperture extending through the at least a portion of the thickness of the transparent workpiece.

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