公开(公告)号：US20210292228A1

公开(公告)日：2021-09-23

申请号：US17198600

申请日：2021-03-11

Applicant: CORNING INCORPORATED

Inventor： John Steele Abbott, JR. ,  Tonia Havewala Fletcher ,  Sinue Gomez-Mower ,  Kenneth Edward Hrdina ,  Daniel Arthur Sternquist

IPC: C03C21/00

Abstract: Embodiments described herein are directed to compositions, systems, and processes for strengthening glass articles, which also minimize the concentration of decomposition products in the molten salt baths used in ion exchange processes to extend salt bath life and maintain the chemical durability of strengthened glass articles over time. The salt bath compositions may generally include from 90 wt. % to 99.9 wt. % of one or more alkali or metal salts and from 0.1 wt. % to 10 wt. % of silicic acid aggregates based on the total weight of the salt bath composition.

公开(公告)号：US20160190185A1

公开(公告)日：2016-06-30

申请号：US15061635

申请日：2016-03-04

Applicant: Corning Incorporated

Inventor： Jeanne Spadinger Cavuoti ,  Donald Arthur Clark ,  Sean Matthew Garner ,  Gregory Scott Glaesemann ,  Jun Hou ,  Jum Sik Kim ,  Toshihiko Ono ,  Daniel Arthur Sternquist

IPC: H01L27/12 ,  C03C15/02 ,  H01L21/02

CPC classification number: C03C15/02 ,  G02F1/1333 ,  H01L21/02019 ,  H01L27/1262 ,  H01L33/58 ,  Y10T428/1095

Abstract: Disclosed are controlled chemical etching processes used to modify the geometry of surface flaws in thin glass substrates and glass substrate assemblies formed therefrom, and in particular glass substrates suitable for the manufacture of active matrix displays that are essentially free of alkali metal oxides such as Na2O, K2O and Li2O.

公开(公告)号：US20210283713A1

公开(公告)日：2021-09-16

申请号：US17327194

申请日：2021-05-21

Applicant: CORNING INCORPORATED

Inventor： Heather Debra Boek ,  Andreas Simon Gaab ,  Garrett Andrew Piech ,  Alranzo Boh Ruffin ,  Daniel Arthur Sternquist ,  Michael Brian Webb

IPC: B23K26/00

Abstract: A method for processing a transparent workpiece includes directing a pulsed laser beam into the transparent workpiece such that a portion of the pulsed laser beam directed into the transparent workpiece generates an induced absorption within the transparent workpiece, thereby forming a damage line within the transparent workpiece, and the portion of the pulsed laser beam directed into the transparent workpiece includes a wavelength λ, a spot size wo, and a Rayleigh range ZR that is greater than F D ⁢ π ⁢ w 0 , 2 λ , where FD is a dimensionless divergence factor comprising a value of 10 or greater. Further, the method for processing the transparent workpiece includes etching the transparent workpiece with an etching vapor to remove at least a portion of the transparent workpiece along the damage line, thereby forming an aperture extending through the at least a portion of the thickness of the transparent workpiece.

公开(公告)号：US11052481B2

公开(公告)日：2021-07-06

申请号：US16776055

申请日：2020-01-29

Applicant: CORNING INCORPORATED

Inventor： Heather Debra Boek ,  Andreas Simon Gaab ,  Garrett Andrew Piech ,  Alranzo Boh Ruffin ,  Daniel Arthur Sternquist ,  Michael Brian Webb

IPC: B23K26/00 ,  B23K26/362

Abstract: A method for processing a transparent workpiece includes directing a pulsed laser beam into the transparent workpiece such that a portion of the pulsed laser beam directed into the transparent workpiece generates an induced absorption within the transparent workpiece, thereby forming a damage line within the transparent workpiece, and the portion of the pulsed laser beam directed into the transparent workpiece includes a wavelength λ, a spot size w0, and a Rayleigh range ZR that is greater than F D ⁢ π ⁢ w 0 2 λ , where FD is a dimensionless divergence factor comprising a value of 10 or greater. Further, the method for processing the transparent workpiece includes etching the transparent workpiece with an etching vapor to remove at least a portion of the transparent workpiece along the damage line, thereby forming an aperture extending through the at least a portion of the thickness of the transparent workpiece.

公开(公告)号：US20200254557A1

公开(公告)日：2020-08-13

申请号：US16776055

申请日：2020-01-29

Applicant: CORNING INCORPORATED

Inventor： Heather Debra Boek ,  Andreas Simon Gaab ,  Garrett Andrew Piech ,  Alranzo Boh Ruffin ,  Daniel Arthur Sternquist ,  Michael Brian Webb

IPC: B23K26/00

Abstract: A method for processing a transparent workpiece includes directing a pulsed laser beam into the transparent workpiece such that a portion of the pulsed laser beam directed into the transparent workpiece generates an induced absorption within the transparent workpiece, thereby forming a damage line within the transparent workpiece, and the portion of the pulsed laser beam directed into the transparent workpiece includes a wavelength λ, a spot size w0, and a Rayleigh range ZR that is greater than F D  π  w 0 2 λ , where FD is a dimensionless divergence factor comprising a value of 10 or greater. Further, the method for processing the transparent workpiece includes etching the transparent workpiece with an etching vapor to remove at least a portion of the transparent workpiece along the damage line, thereby forming an aperture extending through the at least a portion of the thickness of the transparent workpiece.

公开(公告)号：US09926225B2

公开(公告)日：2018-03-27

申请号：US14363147

申请日：2012-12-10

Applicant: CORNING INCORPORATED

Inventor： Yunfeng Gu ,  Jun Hou ,  Timothy James Orcutt ,  Daniel Arthur Sternquist ,  Jeffery Scott Stone

IPC: C03C15/02 ,  C09K13/08 ,  C09K13/04

CPC classification number: C03C15/02 ,  C09K13/04 ,  C09K13/08

Abstract: Described herein are aqueous acidic glass etching solutions or media comprising HF and H2SO4, wherein HF is present in concentrations not exceeding about 1.3M. The etching solutions are used to treat glass articles such as thin glass sheets at above-ambient temperatures to etch slight thicknesses of surface glass therefrom, the etching solutions exhibiting improved stability against dissolved glass precipitation and rapid glass removal rates at slightly elevated temperatures.

公开(公告)号：US20140339194A1

公开(公告)日：2014-11-20

申请号：US14363147

申请日：2012-12-10

Applicant: CORNING INCORPORATED

Inventor： Yunfeng Gu ,  Jun Hou ,  Timothy James Orcutt ,  Daniel Arthur Sternquist ,  Jeffery Scott Stone

IPC: C03C15/02 ,  C09K13/08

CPC classification number: C03C15/02 ,  C09K13/04 ,  C09K13/08

Abstract: Described herein are aqueous acidic glass etching solutions or media comprising HF and H2SO4, wherein HF is present in concentrations not exceeding about 1.3M. The etching solutions are used to treat glass articles such as thin glass sheets at above-ambient temperatures to etch slight thicknesses of surface glass therefrom, the etching solutions exhibiting improved stability against dissolved glass precipitation and rapid glass removal rates at slightly elevated temperatures.

Abstract translation: 本文描述的是含水的酸性玻璃蚀刻溶液或包含HF和H 2 SO 4的介质，其中HF的浓度不超过约1.3M。 蚀刻溶液用于在高于环境温度下处理玻璃制品例如薄玻璃板以从其中蚀刻表面玻璃的轻微厚度，所述蚀刻溶液在稍微升高的温度下表现出对溶解的玻璃沉淀的稳定性和快速的玻璃去除速率。