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    Strengthened glass articles having etched features and methods of forming the same
    1.
    发明授权
    Strengthened glass articles having etched features and methods of forming the same 有权

    公开(公告)号：US11001523B2

    公开(公告)日：2021-05-11

    申请号：US15906225

    申请日：2018-02-27

    Applicant: CORNING INCORPORATED

    Inventor： Johannes Moll ,  James Joseph Price ,  Alranzo Boh Ruffin ,  Sergio Tsuda ,  Robert Stephen Wagner ,  James Joseph Watkins

    IPC: C03C23/00 ,  C03C21/00 ,  B44C1/22 ,  B41M5/24

    Abstract: Strengthened glass articles having laser etched features, electronic devices, and methods of fabricating etched features in strengthened glass articles are disclosed. In one embodiment, a strengthened glass article includes a first strengthened surface layer and a second strengthened surface layer under a compressive stress and extending from a first surface and a second surface, respectively, of the strengthened glass article to a depth of layer, and a central region between the first strengthened surface layer and the second strengthened surface layer that is under tensile stress. The strengthened glass article further includes at least one etched feature formed by laser ablation within the first surface or the second surface having a depth that is less than the depth of layer and a surface roughness that is greater than a surface roughness of the first surface or second surface outside of the at least one etched feature.

    LASER CUTTING OF THERMALLY TEMPERED SUBSTRATES
    2.
    发明申请
    LASER CUTTING OF THERMALLY TEMPERED SUBSTRATES 审中-公开

    公开(公告)号：US20190177203A1

    公开(公告)日：2019-06-13

    申请号：US16276909

    申请日：2019-02-15

    Applicant: Corning Incorporated

    Inventor： Moussa N'Gom ,  Garrett Andrew Piech ,  James Joseph Watkins ,  Kristopher Allen Wieland ,  Chad Michael Wilcox

    IPC: C03B33/02 ,  B23K26/359 ,  B23K26/402 ,  B23K26/53 ,  B23K26/38 ,  B23K26/0622

    Abstract: Systems and methods for laser-cutting thermally tempered substrates are disclosed. In one embodiment, a method of separating a thermally tempered substrate includes directing a laser beam focal line such that at least a portion of the laser beam focal line is within a bulk of the thermally tempered substrate. The focused pulsed laser beam is pulsed to form a sequence of pulse bursts comprising one or more sub-pulses. The laser beam focal line produces a damage track within the bulk of the tempered substrate along the laser beam focal line. Relative motion is provided between the focused pulsed laser beam and the tempered substrate such that the pulsed laser beam forms a sequence of damage tracks within the tempered substrate. Individual damage tracks of the sequence of damage tracks are separated by a lateral spacing, and one or more microcracks connect adjacent damage tracks of the sequence of damage tracks.

    Method and apparatus for yielding high edge strength in cutting of flexible thin glass
    5.
    发明授权
    Method and apparatus for yielding high edge strength in cutting of flexible thin glass 有权

    公开(公告)号：US10144668B2

    公开(公告)日：2018-12-04

    申请号：US15504947

    申请日：2015-08-13

    Applicant: CORNING INCORPORATED

    Inventor： Andrew Stephen Altman ,  Todd Benson Fleming ,  Anping Liu ,  James Joseph Watkins

    IPC: C03B33/04 ,  C03B33/09

    Abstract: Methods and apparatus for cutting a glass sheet along a cutting line into a desired shape. A laser source is configured to apply a laser beam to a beam location on the cutting line of the glass sheet. A source of cooling fluid is configured to apply a cooling fluid to a cooling band on the glass sheet to reduce a temperature of the glass sheet along the cooling path while elevating the temperature of the glass sheet at the beam location with the laser beam. The source of cooling fluid is configured to apply the cooling path as a cooling ring to circumscribe the beam location on the cutting line with the cooling band circumferentially spaced from the beam location while the cooling path and the beam location move simultaneously together in order to propagate a fracture in the glass sheet along the cutting line.

    METHOD AND APPARATUS FOR YIELDING HIGH EDGE STRENGTH IN CUTTING OF FLEXIBLE THIN GLASS
    8.
    发明申请
    METHOD AND APPARATUS FOR YIELDING HIGH EDGE STRENGTH IN CUTTING OF FLEXIBLE THIN GLASS 审中-公开

    公开(公告)号：US20170275197A1

    公开(公告)日：2017-09-28

    申请号：US15504947

    申请日：2015-08-13

    Applicant: CORNING INCORPORATED

    Inventor： Andrew Stephen Altman ,  Todd Benson Fleming ,  Anping Liu ,  James Joseph Watkins

    IPC: C03B33/04 ,  C03B33/09

    CPC classification number: C03B33/04 ,  C03B33/091 ,  Y02P40/57

    Abstract: Cutting a desired final shape in a glass sheet, wherein the glass sheet is about 0.3 mm or less in thickness by applying a laser beam to the glass and continuously moving the laser relative to the glass along the cutting line. The laser is of a circular shape, and cooling fluid is applied simultaneously with the application of the laser, such that the cooling fluid at least reduces the temperature of the glass in order to propagate a fracture in the glass. The method includes controlling at least one of: (i) an energy density of the laser, (ii) a velocity of the laser relative to the glass along the cutting line, (iii) a fluid flow of the cooling fluid, and (iv) a minimum radius of curvature of the cutting line, such that a B10 edge strength of a cut edge of the glass is at least about 300 MPa.

    LASER CUTTING OF THERMALLY TEMPERED SUBSTRATES
    9.
    发明申请
    LASER CUTTING OF THERMALLY TEMPERED SUBSTRATES 审中-公开
    激光切割温度基板

    公开(公告)号：US20160200621A1

    公开(公告)日：2016-07-14

    申请号：US14993236

    申请日：2016-01-12

    Applicant: Corning Incorporated

    Inventor： Moussa N'Gom ,  Garrett Andrew Piech ,  James Joseph Watkins ,  Kristopher Allen Wieland ,  Chad Michael Wilcox

    IPC: C03B33/02 ,  B23K26/402 ,  B23K26/38

    CPC classification number: C03B33/0222 ,  B23K26/0622 ,  B23K26/359 ,  B23K26/53 ,  B23K2103/54 ,  Y02P40/57

    Abstract: Systems and methods for laser-cutting thermally tempered substrates are disclosed. In one embodiment, a method of separating a thermally tempered substrate includes directing a laser beam focal line such that at least a portion of the laser beam focal line is within a bulk of the thermally tempered substrate. The focused pulsed laser beam is pulsed to form a sequence of pulse bursts comprising one or more sub-pulses. The laser beam focal line produces a damage track within the bulk of the tempered substrate along the laser beam focal line. Relative motion is provided between the focused pulsed laser beam and the tempered substrate such that the pulsed laser beam forms a sequence of damage tracks within the tempered substrate. Individual damage tracks of the sequence of damage tracks are separated by a lateral spacing, and one or more microcracks connect adjacent damage tracks of the sequence of damage tracks.

    Abstract translation: 公开了用于激光切割热回火衬底的系统和方法。 在一个实施例中，分离热回火衬底的方法包括引导激光束焦线，使得激光束焦线的至少一部分在热回火衬底的主体内。 聚焦的脉冲激光束被脉冲以形成包括一个或多个子脉冲的脉冲串序列。 激光束焦线沿着激光束焦线在回火基板的主体内产生损伤轨迹。 在聚焦的脉冲激光束和回火衬底之间提供相对运动，使得脉冲激光束在回火衬底内形成一系列损伤轨迹。 损伤轨迹序列的单个损伤轨迹由横向间隔分开，并且一个或多个微裂纹连接损坏轨迹序列的相邻损伤轨迹。

    Mechanically forming crack initiation defects in thin glass substrates using an abrasive surface
    10.
    发明授权
    Mechanically forming crack initiation defects in thin glass substrates using an abrasive surface 有权

    公开(公告)号：US10301211B2

    公开(公告)日：2019-05-28

    申请号：US15524703

    申请日：2015-11-05

    Applicant: CORNING INCORPORATED

    Inventor： Donald Orrin Bigelow ,  Robertson Dewhurst Booth ,  James Joseph Watkins

    IPC: C03B33/03 ,  C03B33/09 ,  C03B33/10 ,  C03B33/023

    Abstract: A method for forming an initiation defect in a glass substrate to facilitate separating the glass substrate into a plurality of substrates is provided. The method includes providing the glass substrate and contacting a broad surface of the glass substrate with an abrasive surface thereby forming a field of initiation defects in the broad surface of the glass substrate. The field of initiation defects has a width of at least about three millimeters between outermost initiation defects. At least one initiation defect is heated with a laser source. The at least one initiation defect is cooled with a cooling fluid such that a crack initiates from the at least one initiation defect, the crack extending through a thickness of the glass substrate and propagating across the glass substrate to separate the glass substrate into the plurality of substrates.

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