公开(公告)号：US20230406749A1

公开(公告)日：2023-12-21

申请号：US18234619

申请日：2023-08-16

Applicant: CORNING INCORPORATED

Inventor： Chukwudi Azubuike Okoro

IPC: C03B25/02 ,  C03C17/06 ,  C03C3/06 ,  C03C10/00

CPC classification number: C03B25/025 ,  C03C17/06 ,  C03C3/06 ,  C03C10/0009 ,  C03C2204/00 ,  C03C2217/253 ,  C03C2203/52

Abstract: A process for heating a glass or glass ceramic article with copper-metallized through holes includes heating the article from a first temperature to a second temperature. The first temperature is greater than or equal to 200° C. and less than or equal to 300° C., and the second temperature is greater than or equal to 350° C. and less than or equal to 450° C. An average heating rate during the heating of the article from the first temperature to the second temperature is greater than 0.0° C./min and less than 8.7° C./min. An article includes a glass or glass ceramic substrate having at least one through hole penetrating the substrate in a thickness direction; and copper present in the at least one through hole. The article does not comprise radial cracks.

公开(公告)号：US20230207385A1

公开(公告)日：2023-06-29

申请号：US17928363

申请日：2021-06-14

Applicant: CORNING INCORPORATED

Inventor： Patrick Scott Leslie ,  Chukwudi Azubuike Okoro

IPC: H01L21/768 ,  B23K26/0622 ,  B23K26/06 ,  B23K26/386 ,  H01L21/48 ,  H01L23/498

CPC classification number: H01L21/76825 ,  B23K26/386 ,  B23K26/0624 ,  B23K26/0648 ,  H01L21/486 ,  H01L23/49827 ,  B23K2101/40

Abstract: Systems, devices, and techniques for creating blind annular vias for metallized vias are described. For example, a vortex beam may be applied to an optically transmissive substrate, where the vortex beam may modify a portion of the substrate in an annular shape. The annular shape may extend from a surface of the substrate to a depth that is less than a thickness of the substrate, and the annular shape may have an annular width (e.g., a ring width) that is the same for various diameters of the annular shape. A blind annular via may be formed by etching the modified portion of the substrate, where the blind annular via may include a pillar comprising the same material as the surrounding substrate. In addition, a metallized annular via may be created by filling the blind annular via with a conductive material, and removing a portion of the substrate opposite the surface.

公开(公告)号：US20210407896A1

公开(公告)日：2021-12-30

申请号：US17470519

申请日：2021-09-09

Applicant: CORNING INCORPORATED

Inventor： Mandakini Kanungo ,  Prantik Mazumder ,  Chukwudi Azubuike Okoro ,  Ah-Young Park ,  Scott Christopher Pollard ,  Rajesh Vaddi

IPC: H01L23/498 ,  H05K1/02 ,  C23C14/18 ,  C23C18/38 ,  C23C28/02 ,  H05K1/03 ,  H05K1/11 ,  H01L21/768 ,  H01L23/15 ,  C03C17/06 ,  H01L23/48 ,  C03C3/06 ,  C03C15/00 ,  C03C23/00 ,  H05K3/38

Abstract: According to various embodiments described herein, an article comprises a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and a via extending through the substrate from the first major surface to the second major surface over an axial length in an axial direction. The article further comprises a helium hermetic adhesion layer disposed on the interior surface; and a metal connector disposed within the via, wherein the metal connector is adhered to the helium hermetic adhesion layer. The metal connector coats the interior surface of the via along the axial length of the via to define a first cavity from the first major surface to a first cavity length, the metal connector comprising a coating thickness of less than 12 μm at the first major surface. Additionally, the metal connector coats the interior surface of the via along the axial length of the via to define a second cavity from the second major surface to a second cavity length, the metal connector comprising a coating thickness of less than 12 μm at the second major surface and fully fills the via between the first cavity and the second cavity.

公开(公告)号：US20190313524A1

公开(公告)日：2019-10-10

申请号：US16376467

申请日：2019-04-05

Applicant: Corning Incorporated

Inventor： Tian Huang ,  Mandakini Kanungo ,  Ekaterina Kuksenkova ,  Prantik Mazumder ,  Chad Byron Moore ,  Chukwudi Azubuike Okoro ,  Ah-Young Park ,  Scott Christopher Pollard ,  Rajesh Vaddi

IPC: H05K1/02 ,  C23C14/18 ,  C23C18/38 ,  C23C28/02 ,  H05K1/11 ,  H05K1/03

Abstract: An article includes a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and at least one via extending through the substrate from the first major surface to the second major surface over an axial length in an axial dimension. The article also includes a metal connector disposed within the via that hermetically seals the via. The article has a helium hermeticity of less than or equal to 1.0×10−8 atm-cc/s after 1000 thermal shock cycles, each of the thermal shock cycle comprises cooling the article to a temperature of −40° C. and heating the article to a temperature of 125° C., and the article has a helium hermeticity of less than or equal to 1.0×10−8 atm-cc/s after 100 hours of HAST at a temperature of 130° C. and a relative humidity of 85%.