公开(公告)号：US20230221278A1

公开(公告)日：2023-07-13

申请号：US18122192

申请日：2023-03-16

申请人： CORNING INCORPORATED

发明人： Robert Alan Bellman ,  Jeffrey Stapleton King ,  Scott Christopher Pollard

IPC分类号： G01N27/413 ,  C03C27/10 ,  C03C17/06 ,  C03C23/00 ,  C03C15/00

CPC分类号： G01N27/413 ,  C03C27/10 ,  C03C17/06 ,  C03C23/0025 ,  C03C15/00 ,  C03C2217/254

摘要： A method of forming a glass electrochemical sensor is described. In some embodiments, the method may include forming a plurality of electrical through glass vias (TGVs) in an electrode substrate; filling each of the plurality of electrical TGVs with an electrode material; forming a plurality of contact TGVs in the electrode substrate; filling each of the plurality of contact TGVs with a conductive material; patterning the conductive material to connect the electrical TGVs with the contact TGVs; forming a cavity in a first glass layer; and bonding a first side of the first glass layer to the electrode substrate.

公开(公告)号：US11201109B2

公开(公告)日：2021-12-14

申请号：US16776663

申请日：2020-01-30

申请人： CORNING INCORPORATED

发明人： Mandakini Kanungo ,  Prantik Mazumder ,  Chukwudi Azubuike Okoro ,  Ah-Young Park ,  Scott Christopher Pollard ,  Rajesh Vaddi

IPC分类号： H01L23/15 ,  H01L23/48 ,  H01L23/492 ,  H01L23/498 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  C23C14/18 ,  C23C18/38 ,  C23C28/02 ,  H01L21/768 ,  C03C17/06 ,  C03C3/06 ,  C03C15/00 ,  C03C23/00 ,  H05K3/38 ,  C25D7/12 ,  C03C3/076 ,  H01L21/48 ,  H01L23/00 ,  H05K3/00 ,  H05K3/42

摘要： According to various embodiments described herein, an article comprises a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and a via extending through the substrate from the first major surface to the second major surface over an axial length in an axial direction. The article further comprises a helium hermetic adhesion layer disposed on the interior surface; and a metal connector disposed within the via, wherein the metal connector is adhered to the helium hermetic adhesion layer. The metal connector coats the interior surface of the via along the axial length of the via to define a first cavity from the first major surface to a first cavity length, the metal connector comprising a coating thickness of less than 12 μm at the first major surface. Additionally, the metal connector coats the interior surface of the via along the axial length of the via to define a second cavity from the second major surface to a second cavity length, the metal connector comprising a coating thickness of less than 12 μm at the second major surface and fully fills the via between the first cavity and the second cavity.

公开(公告)号：US11152294B2

公开(公告)日：2021-10-19

申请号：US16376467

申请日：2019-04-05

申请人： Corning Incorporated

发明人： Tian Huang ,  Mandakini Kanungo ,  Ekaterina Aleksandrovna Kuksenkova ,  Prantik Mazumder ,  Chad Byron Moore ,  Chukwudi Azubuike Okoro ,  Ah-Young Park ,  Scott Christopher Pollard ,  Rajesh Vaddi

IPC分类号： H01L23/15 ,  H01L23/48 ,  H01L23/492 ,  H01L23/498 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  C03C15/00 ,  C23C18/38 ,  H01L21/768 ,  H05K3/38 ,  C23C14/18 ,  C23C28/02 ,  C03C17/06 ,  C03C3/06 ,  C03C23/00 ,  C03C17/00 ,  H05K3/42 ,  C25D7/12 ,  C03C3/076 ,  H01L21/48 ,  H01L23/00 ,  H05K3/00

摘要： An article includes a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and at least one via extending through the substrate from the first major surface to the second major surface over an axial length in an axial dimension. The article also includes a metal connector disposed within the via that hermetically seals the via. The article has a helium hermeticity of less than or equal to 1.0×10−8 atm-cc/s after 1000 thermal shock cycles, each of the thermal shock cycle comprises cooling the article to a temperature of −40° C. and heating the article to a temperature of 125° C., and the article has a helium hermeticity of less than or equal to 1.0×10−8 atm-cc/s after 100 hours of HAST at a temperature of 130° C. and a relative humidity of 85%.

公开(公告)号：US20210407896A1

公开(公告)日：2021-12-30

申请号：US17470519

申请日：2021-09-09

申请人： CORNING INCORPORATED

发明人： Mandakini Kanungo ,  Prantik Mazumder ,  Chukwudi Azubuike Okoro ,  Ah-Young Park ,  Scott Christopher Pollard ,  Rajesh Vaddi

IPC分类号： H01L23/498 ,  H05K1/02 ,  C23C14/18 ,  C23C18/38 ,  C23C28/02 ,  H05K1/03 ,  H05K1/11 ,  H01L21/768 ,  H01L23/15 ,  C03C17/06 ,  H01L23/48 ,  C03C3/06 ,  C03C15/00 ,  C03C23/00 ,  H05K3/38

摘要： According to various embodiments described herein, an article comprises a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and a via extending through the substrate from the first major surface to the second major surface over an axial length in an axial direction. The article further comprises a helium hermetic adhesion layer disposed on the interior surface; and a metal connector disposed within the via, wherein the metal connector is adhered to the helium hermetic adhesion layer. The metal connector coats the interior surface of the via along the axial length of the via to define a first cavity from the first major surface to a first cavity length, the metal connector comprising a coating thickness of less than 12 μm at the first major surface. Additionally, the metal connector coats the interior surface of the via along the axial length of the via to define a second cavity from the second major surface to a second cavity length, the metal connector comprising a coating thickness of less than 12 μm at the second major surface and fully fills the via between the first cavity and the second cavity.

公开(公告)号：US20190313524A1

公开(公告)日：2019-10-10

申请号：US16376467

申请日：2019-04-05

申请人： Corning Incorporated

发明人： Tian Huang ,  Mandakini Kanungo ,  Ekaterina Kuksenkova ,  Prantik Mazumder ,  Chad Byron Moore ,  Chukwudi Azubuike Okoro ,  Ah-Young Park ,  Scott Christopher Pollard ,  Rajesh Vaddi

IPC分类号： H05K1/02 ,  C23C14/18 ,  C23C18/38 ,  C23C28/02 ,  H05K1/11 ,  H05K1/03

摘要： An article includes a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and at least one via extending through the substrate from the first major surface to the second major surface over an axial length in an axial dimension. The article also includes a metal connector disposed within the via that hermetically seals the via. The article has a helium hermeticity of less than or equal to 1.0×10−8 atm-cc/s after 1000 thermal shock cycles, each of the thermal shock cycle comprises cooling the article to a temperature of −40° C. and heating the article to a temperature of 125° C., and the article has a helium hermeticity of less than or equal to 1.0×10−8 atm-cc/s after 100 hours of HAST at a temperature of 130° C. and a relative humidity of 85%.

公开(公告)号：US09917045B2

公开(公告)日：2018-03-13

申请号：US15287163

申请日：2016-10-06

申请人： CORNING INCORPORATED

发明人： Satish Chandra Chaparala ,  Scott Christopher Pollard

IPC分类号： H01L21/00 ,  H01L23/498 ,  H01L23/15 ,  H01L23/00 ,  H05K1/02 ,  H05K1/18 ,  H01L21/48 ,  H01L25/065

CPC分类号： H01L23/49833 ,  H01L21/4857 ,  H01L23/15 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/17 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15788 ,  H05K1/0201 ,  H05K1/181 ,  H05K2201/068 ,  H01L2924/00

摘要： Methods and apparatus are provide for an interposer for interconnecting one or more semiconductor chips with an organic substrate in a semiconductor package, the interposer including: a first glass substrate having first and second opposing major surfaces, the first glass substrate having a first coefficient of thermal expansion (CTE1); a second glass substrate having first and second opposing major surfaces, the second glass substrate having a second coefficient of thermal expansion (CTE2); and an interface disposed between the first and second glass substrates and joining the second major surface of the first glass substrate to the first major surface of the second glass substrate, where CTE1 is less than CTE2, the first major surface of the first glass substrate operates to engage the one or more semiconductor chips, and the second major surface of the second glass substrate operates to engage the organic substrate.

公开(公告)号：US20170025341A1

公开(公告)日：2017-01-26

申请号：US15287163

申请日：2016-10-06

申请人： CORNING INCORPORATED

发明人： Satish Chandra Chaparala ,  Scott Christopher Pollard

IPC分类号： H01L23/498 ,  H01L21/48 ,  H01L25/065

CPC分类号： H01L23/49833 ,  H01L21/4857 ,  H01L23/15 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/17 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15788 ,  H05K1/0201 ,  H05K1/181 ,  H05K2201/068 ,  H01L2924/00

摘要： Methods and apparatus are provide for an interposer for interconnecting one or more semiconductor chips with an organic substrate in a semiconductor package, the interposer including: a first glass substrate having first and second opposing major surfaces, the first glass substrate having a first coefficient of thermal expansion (CTE1); a second glass substrate having first and second opposing major surfaces, the second glass substrate having a second coefficient of thermal expansion (CTE2); and an interface disposed between the first and second glass substrates and joining the second major surface of the first glass substrate to the first major surface of the second glass substrate, where CTE1 is less than CTE2, the first major surface of the first glass substrate operates to engage the one or more semiconductor chips, and the second major surface of the second glass substrate operates to engage the organic substrate.

摘要翻译： 提供了用于将一个或多个半导体芯片与半导体封装中的有机衬底互连的插入件的方法和装置，所述插入器包括：具有第一和第二相对主表面的第一玻璃衬底，所述第一玻璃衬底具有第一热导率 扩展（CTE1）; 具有第一和第二相对主表面的第二玻璃基板，所述第二玻璃基板具有第二热膨胀系数（CTE2）; 以及设置在第一和第二玻璃基板之间并且将第一玻璃基板的第二主表面接合到第二玻璃基板的第一主表面的接口，其中CTE1小于CTE2，第一玻璃基板的第一主表面操作 以接合一个或多个半导体芯片，并且第二玻璃基板的第二主表面操作以接合有机基板。

公开(公告)号：US12131985B2

公开(公告)日：2024-10-29

申请号：US17470519

申请日：2021-09-09

申请人： CORNING INCORPORATED

发明人： Mandakini Kanungo ,  Prantik Mazumder ,  Chukwudi Azubuike Okoro ,  Ah-Young Park ,  Scott Christopher Pollard ,  Rajesh Vaddi

IPC分类号： C25D3/38 ,  C03C3/06 ,  C03C15/00 ,  C03C17/06 ,  C03C17/10 ,  C03C23/00 ,  C23C14/18 ,  C23C18/38 ,  C23C28/02 ,  H01L21/48 ,  H01L21/768 ,  H01L23/15 ,  H01L23/48 ,  H01L23/498 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/38 ,  C03C3/076 ,  C25D7/12 ,  H01L23/00 ,  H01L23/492 ,  H05K3/00 ,  H05K3/42

CPC分类号： H01L23/49827 ,  C03C3/06 ,  C03C15/00 ,  C03C17/06 ,  C03C17/10 ,  C03C23/0025 ,  C23C14/18 ,  C23C18/38 ,  C23C28/02 ,  H01L21/76877 ,  H01L23/15 ,  H01L23/481 ,  H01L23/49838 ,  H05K1/0271 ,  H05K1/0306 ,  H05K1/115 ,  H05K3/388 ,  C03C3/076 ,  C03C2218/115 ,  C25D3/38 ,  C25D7/123 ,  H01L21/486 ,  H01L23/4924 ,  H01L23/49866 ,  H01L23/564 ,  H05K3/002 ,  H05K3/0029 ,  H05K3/0055 ,  H05K3/423 ,  H05K3/425 ,  H05K3/428 ,  H05K2201/068 ,  H05K2201/09545 ,  H05K2201/09563 ,  H05K2201/09609 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2201/0989 ,  H05K2201/10378 ,  H05K2203/1194 ,  H05K2203/1361 ,  H05K2203/143 ,  H05K2203/1438 ,  H05K2203/162 ,  Y10T428/24273 ,  Y10T428/24479 ,  Y10T428/24851 ,  Y10T428/24917 ,  Y10T428/24926

摘要： According to various embodiments described herein, an article comprises a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and a via extending through the substrate from the first major surface to the second major surface over an axial length in an axial direction. The article further comprises a helium hermetic adhesion layer disposed on the interior surface; and a metal connector disposed within the via, wherein the metal connector is adhered to the helium hermetic adhesion layer. The metal connector coats the interior surface of the via along the axial length of the via to define a first cavity from the first major surface to a first cavity length, the metal connector comprising a coating thickness of less than 12 μm at the first major surface. Additionally, the metal connector coats the interior surface of the via along the axial length of the via to define a second cavity from the second major surface to a second cavity length, the metal connector comprising a coating thickness of less than 12 μm at the second major surface and fully fills the via between the first cavity and the second cavity.

公开(公告)号：US11709397B2

公开(公告)日：2023-07-25

申请号：US17292790

申请日：2019-11-05

申请人： Corning Incorporated

发明人： Kirk Richard Allen ,  Fedor Dmitrievich Kiselev ,  Dmitri Vladislavovich Kuksenkov ,  Christopher Michael Lynn ,  Pamela Arlene Maurey ,  Xiang-Dong Mi ,  Scott Christopher Pollard ,  Nikolay Timofeyevich Timofeev ,  Andrii Varanytsia

IPC分类号： G02F1/13357 ,  G02F1/1335

CPC分类号： G02F1/133606 ,  G02F1/133524 ,  G02F1/133605

摘要： A backlight includes a substrate, a plurality of light sources, a reflective layer, a light guide plate, a pattern of light extractors, a plurality of patterned reflectors, and a diffusive layer. The plurality of light sources are proximate the substrate. The reflective layer is on the substrate. The light guide plate is proximate the plurality of light sources. The pattern of light extractors is on the light guide plate. The plurality of patterned reflectors are on the light guide plate. Each patterned reflector is aligned with a corresponding light source. The diffusive layer is on the light guide plate.

公开(公告)号：US11630076B2

公开(公告)日：2023-04-18

申请号：US16608500

申请日：2018-04-27

申请人： CORNING INCORPORATED

发明人： Robert Alan Bellman ,  Jeffrey Stapleton King ,  Scott Christopher Pollard

IPC分类号： C03B33/02 ,  G01N27/404 ,  G01N27/406 ,  C03C27/10 ,  C03C17/06

摘要： A method of forming a glass electrochemical sensor is described. In some embodiments, the method may include forming a plurality of electrical through glass vias (TGVs) in an electrode substrate; filling each of the plurality of electrical TGVs with an electrode material; forming a plurality of contact TGVs in the electrode substrate; filling each of the plurality of contact TGVs with a conductive material; patterning the conductive material to connect the electrical TGVs with the contact TGVs; forming a cavity in a first glass layer; and bonding a first side of the first glass layer to the electrode substrate.