公开(公告)号：US20150062915A1

公开(公告)日：2015-03-05

申请号：US14019257

申请日：2013-09-05

Applicant: Cree, Inc.

Inventor： Christopher P. Hussell ,  Jesse Colin Reiherzer ,  Erin R. F. Welch ,  Florin A. Tudorica

IPC: H01L33/10 ,  F21K99/00 ,  F21V7/22

CPC classification number: F21V7/22 ,  F21K9/60 ,  H01L25/0753 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/0274 ,  H05K3/28 ,  H05K2201/09881 ,  H05K2201/10106 ,  H05K2201/2054 ,  H05K2203/0588 ,  H01L2924/00

Abstract: Light emitter devices and methods are provided herein. In some aspects, emitter devices and methods provided herein are for light emitting diode (LED) chips and can include providing a substrate, a conductive trace over the substrate, and at least one or more direct attach LED chip over the substrate. A layer of non-conductive and reflective material is disposed over the surface of wherein the layer of reflective material covers at least 25% or more of a surface of the substrate.

Abstract translation: 本文提供了发光器件和方法。 在一些方面，本文提供的发射器件和方法用于发光二极管（LED）芯片，并且可以包括提供衬底，衬底上的导电迹线以及衬底上的至少一个或多个直接附接LED芯片。 非导电和反射材料层设置在其上的反射材料层覆盖基底表面的至少25％或更多的表面上。