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1.发明授权公开(公告)号：US10950769B2
公开(公告)日：2021-03-16
申请号：US15432146
申请日：2017-02-14
Applicant: Cree, Inc.
Inventor： Michael John Bergmann , Colin Kelly Blakely , Arthur Fong-Yuen Pun , Jesse Colin Reiherzer
IPC: H01L33/62 , B23K1/00 , H01L33/64 , B23K35/26 , B23K35/30 , C22C13/00 , C22C19/03 , H01L25/075 , H01L33/36 , H01L33/48 , H01L33/38 , H01L33/20
Abstract: A Light Emitting Diode (LED) component includes a lead frame and an LED that is electrically connected to the lead frame without wire bonds, using a solder layer. The lead frame includes a metal anode pad, a metal cathode pad and a plastic cup. The LED die includes LED die anode and cathode contacts with a solder layer on them. The metal anode pad, metal cathode pad, plastic cup and/or the solder layer are configured to facilitate the direct die attach of the LED die to the lead frame without wire bonds. Related fabrication methods are also described.
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公开(公告)号：US20210057390A1
公开(公告)日：2021-02-25
申请号：US17092939
申请日：2020-11-09
Applicant: Cree, Inc.
Inventor： Troy Gould , Colin Kelly Blakely , Jesse Colin Reiherzer , Joseph G. Clark
Abstract: Light emitting diode (LED) devices and methods. An example apparatus can include a substrate, one or more LEDs, light-transmissive encapsulation material, and a reflective material covering a portion of the encapsulation material to form a defined opening. The opening allows light emitted from an LED to pass through in a prescribed manner. In some embodiments, the apparatus can be subsequently treated to modify the surface having the opening. In other embodiments, the reflective material can be disposed on a lateral surface of the encapsulation material to reflect light in a desired direction.
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公开(公告)号：US10797204B2
公开(公告)日：2020-10-06
申请号：US14292244
申请日：2014-05-30
Applicant: Cree, Inc.
Inventor： Jesse Colin Reiherzer , Erin R. F. Welch , Sung Chul Joo
Abstract: Submount based light emitter components and related methods are disclosed. In some aspects, light emitter components include a reflective ceramic submount, at least one light emitter chip disposed over a first surface of the submount, a layer of optical conversion material disposed over portions of each of the at least one light emitter chip and the first surface of the submount, and a lens disposed over the layer of optical conversion material. The layer of optical conversion material and the lens define separate and discrete layers over the at least one light emitter chip and submount.
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公开(公告)号：US10431568B2
公开(公告)日：2019-10-01
申请号：US15264547
申请日：2016-09-13
Applicant: Cree, Inc.
Inventor： Troy Gould , Colin Kelly Blakely , Kyle Damborsky , Jesse Colin Reiherzer
Abstract: Light emitting diode (LED) devices, components and systems are provided. LED devices include a submount with a plurality of LEDs disposed thereon. The LEDs mounted on a submount can be spaced apart at predetermined dimensions to control the gaps between each of the plurality of LEDs. By controlling the gaps between LEDs the optical output from the LED device can be optimized, including improving emission and/or color uniformity, minimizing or eliminating deadspots in the light emission, and/or minimizing or eliminating an optical cross. A phosphor layer can be disposed on the plurality of LEDs and between the LEDs in the gaps therebetween.
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公开(公告)号：US10074635B2
公开(公告)日：2018-09-11
申请号：US14802655
申请日：2015-07-17
Applicant: Cree, Inc.
Inventor： Nishant Tiwari , Colin Kelly Blakely , Jesse Colin Reiherzer , Mark Edmond , Arthur Fong-Yuen Pun , Michael Bergmann
CPC classification number: H01L25/0753 , H01L25/50 , H01L33/486 , H01L33/507 , H01L33/52 , H01L33/62 , H01L2224/48137 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0066
Abstract: Solid state light emitter devices and methods are provided. A solid state light emitter device can include a submount having an upper surface and a bottom surface. At least first pair and a second pair of electrically conductive contacts can be disposed on the bottom surface of the submount. The first pair of contacts can be electrically independent from the second pair of contacts. The device can further include multiple light emitters provided on the upper surface of the submount. The multiple light emitters can be configured into at least a first light emitter zone that is electrically independent from a second light emitter zone upon electrical communication to a respective pair of contacts.
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Patent Agency Ranking
公开(公告)号：US20150345714A1
公开(公告)日：2015-12-03
申请号：US14292244
申请日：2014-05-30
Applicant: Cree, Inc.
Inventor： Jesse Colin Reiherzer , Erin R. F. Welch , Sung Chul Joo
Abstract: Submount based light emitter components and related methods are disclosed. In some aspects, light emitter components include a reflective ceramic submount, at least one light emitter chip disposed over a first surface of the submount, a layer of optical conversion material disposed over portions of each of the at least one light emitter chip and the first surface of the submount, and a lens disposed over the layer of optical conversion material. The layer of optical conversion material and the lens define separate and discrete layers over the at least one light emitter chip and submount.
Abstract translation: 公开了基于底座的光发射器部件和相关方法。 在一些方面，光发射器部件包括反射陶瓷基座，设置在基座的第一表面上的至少一个光发射器芯片，设置在所述至少一个发光芯片中的每一个的部分上的光学转换材料层和第一 底座的表面和设置在光学转换材料层上的透镜。 光学转换材料层和透镜在至少一个光发射器芯片和底座上限定分离的和离散的层。
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公开(公告)号：US09194567B2
公开(公告)日：2015-11-24
申请号：US14189500
申请日：2014-02-25
Applicant: Cree, Inc.
Inventor： Christopher P. Hussell , Jesse Colin Reiherzer , Jeffrey Carl Britt , Praneet Athalye , Peter Scott Andrews
IPC: H01L33/40 , F21V21/00 , H05B37/02 , F21V7/00 , F21V11/00 , F21V15/01 , H01L25/075 , F21K99/00 , H01L25/16 , H01L33/52
CPC classification number: F21V21/00 , F21K9/60 , F21V7/00 , F21V11/00 , F21V15/01 , H01L25/0753 , H01L25/167 , H01L33/52 , H01L2224/48091 , H01L2224/48137 , H01L2924/01322 , H01L2924/12032 , H01L2924/1305 , H05B37/02 , H01L2924/00014 , H01L2924/00
Abstract: High voltage array light emitting devices and fixtures are disclosed. In one embodiment a light emitting device can include a submount, a light emission area disposed over the submount and a retention material adapted to be dispensed about the light emission area. The light emitting device can be operable at high voltages which are greater than approximately 40 volts (V). In one aspect, the retention material can be least partially disposed within the light emission area such that the retention material physically separates a first section of the light emission area from a second section of the light emission area.
Abstract translation: 公开了高压阵列发光器件和灯具。 在一个实施例中，发光器件可以包括底座，设置在底座上的发光区域和适于围绕发光区域分配的保持材料。 发光器件可以在大于大约40伏（V）的高电压下工作。 在一个方面，保持材料可以最少部分地设置在发光区域内，使得保持材料将发光区域的第一部分与发光区域的第二部分物理分离。
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公开(公告)号：US08878204B2
公开(公告)日：2014-11-04
申请号：US13829962
申请日：2013-03-14
Applicant: Cree, Inc.
Inventor： Jesse Colin Reiherzer , Christopher P. Hussell , Erin Welch
IPC: H01L33/48 , H01L25/075 , H01L33/60 , F21Y111/00 , H01L33/62
CPC classification number: H01L33/486 , F21Y2107/00 , F21Y2115/10 , H01L25/0753 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2924/00014
Abstract: Submount based light emitter components and methods are provided herein. In one aspect, a submount based light emitter component can include a primary submount, a secondary submount, and at least one light emitter chip. The at least one light emitter chip can be disposed over the primary submount and electrically connected to the secondary submount.
Abstract translation: 本文提供了基于底座的光发射器部件和方法。 在一个方面，基于基座的光发射器部件可以包括主基座，辅助基座和至少一个光发射器芯片。 所述至少一个光发射器芯片可以设置在主基座上并电连接到次级底座。
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公开(公告)号：US20140240974A1
公开(公告)日：2014-08-28
申请号：US14189500
申请日：2014-02-25
Applicant: Cree, Inc.
Inventor： Christopher P. Hussell , Jesse Colin Reiherzer , Jeffrey Carl Britt , Praneet Athalye , Peter Scott Andrews
CPC classification number: F21V21/00 , F21K9/60 , F21V7/00 , F21V11/00 , F21V15/01 , H01L25/0753 , H01L25/167 , H01L33/52 , H01L2224/48091 , H01L2224/48137 , H01L2924/01322 , H01L2924/12032 , H01L2924/1305 , H05B37/02 , H01L2924/00014 , H01L2924/00
Abstract: High voltage array light emitting devices and fixtures are disclosed. In one embodiment a light emitting device can include a submount, a light emission area disposed over the submount and a retention material adapted to be dispensed about the light emission area. The light emitting device can be operable at high voltages which are greater than approximately 40 volts (V). In one aspect, the retention material can be least partially disposed within the light emission area such that the retention material physically separates a first section of the light emission area from a second section of the light emission area.
Abstract translation: 公开了高压阵列发光器件和灯具。 在一个实施例中，发光器件可以包括底座，设置在底座上的发光区域和适于围绕发光区域分配的保持材料。 发光器件可以在大于大约40伏（V）的高电压下工作。 在一个方面，保持材料可以最少部分地设置在发光区域内，使得保持材料将发光区域的第一部分与发光区域的第二部分物理分离。
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公开(公告)号：US20130328070A1
公开(公告)日：2013-12-12
申请号：US13828895
申请日：2013-03-14
Applicant: CREE, INC.
Inventor： Christopher P. Hussell , Jesse Colin Reiherzer , Erin Welch
IPC: H01L33/62
CPC classification number: H01L33/62 , H01L25/0753 , H01L33/60 , H01L33/641 , H01L2224/48091 , H01L2224/48137 , H01L2933/0033 , H05K3/244 , H05K2201/0341 , H05K2201/099 , H05K2201/10106 , H05K2201/2054 , H05K2203/073 , H05K2203/1461 , H01L2924/00014
Abstract: Light emitting devices and substrates are provided with improved plating. In one embodiment, a light emitting device can include a submount and one or more light emitting diodes (LED) chips disposed over the submount. In one embodiment, the submount can include a copper (Cu) substrate, a first metallic layer of material that is highly reflective disposed over the Cu substrate for increased brightness of the device, and a second metallic layer disposed between the Cu substrate and the first metallic layer for forming a barrier therebetween.
Abstract translation: 发光器件和衬底具有改进的电镀。 在一个实施例中，发光器件可以包括底座和设置在所述底座上方的一个或多个发光二极管（LED）芯片。 在一个实施例中，底座可以包括铜（Cu）衬底，高度反射性地设置在Cu衬底上的用于增加器件亮度的第一金属材料层，以及设置在Cu衬底和第一衬底之间的第二金属层 用于在其间形成屏障的金属层。
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