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公开(公告)号：US10439114B2
公开(公告)日：2019-10-08
申请号：US15453594
申请日：2017-03-08
申请人： Cree, Inc.
摘要： Light emitting diode (LED) devices, components and systems are provided. Improved substrates for LEDs and LED devices are provided, with one or more dielectric layers over a reflective layer sufficient to minimize or eliminate damage of the dielectric layer(s). More stable and efficient LED devices can be produced using such improved substrates. LED devices, and methods of making the same, are also provided wherein LED chips are embedded in fill material to attach the LEDs to a substrate and increase light reflectivity.
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公开(公告)号：US20190074417A1
公开(公告)日：2019-03-07
申请号：US15694591
申请日：2017-09-01
申请人： Cree, Inc.
IPC分类号： H01L33/60 , H01L23/00 , H01L25/075
CPC分类号： H01L33/60 , H01L24/48 , H01L25/0753 , H01L33/0095 , H01L33/505 , H01L33/56 , H01L33/62 , H01L2224/48137 , H01L2924/12041 , H01L2933/0033 , H01L2933/005 , H01L2933/0058
摘要： Light emitting diode components and devices with a wall of reflective material and having improved performance and beam angle, are provided. Reflective material provided with light emitting diode devices is configured to optimize light reflectivity by altering the composition, thickness, placement and/or angle thereof. Methods of making and assembly light emitting diode components and devices with reflective materials and improved performance, are also provided.
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3.发明申请LIGHT EMITTING DIODE DEVICES AND METHODS WITH REFLECTIVE MATERIAL FOR INCREASED LIGHT OUTPUT 审中-公开具有反射材料的发光二极管器件和方法用于增加光输出公开(公告)号：US20150062915A1
公开(公告)日：2015-03-05
申请号：US14019257
申请日：2013-09-05
申请人： Cree, Inc.
CPC分类号： F21V7/22 , F21K9/60 , H01L25/0753 , H01L33/60 , H01L33/62 , H01L2924/0002 , H05K1/0274 , H05K3/28 , H05K2201/09881 , H05K2201/10106 , H05K2201/2054 , H05K2203/0588 , H01L2924/00
摘要： Light emitter devices and methods are provided herein. In some aspects, emitter devices and methods provided herein are for light emitting diode (LED) chips and can include providing a substrate, a conductive trace over the substrate, and at least one or more direct attach LED chip over the substrate. A layer of non-conductive and reflective material is disposed over the surface of wherein the layer of reflective material covers at least 25% or more of a surface of the substrate.
摘要翻译： 本文提供了发光器件和方法。 在一些方面，本文提供的发射器件和方法用于发光二极管（LED）芯片，并且可以包括提供衬底，衬底上的导电迹线以及衬底上的至少一个或多个直接附接LED芯片。 非导电和反射材料层设置在其上的反射材料层覆盖基底表面的至少25％或更多的表面上。
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公开(公告)号：US20130334548A1
公开(公告)日：2013-12-19
申请号：US13908597
申请日：2013-06-03
申请人： CREE, INC.
IPC分类号： H01L33/60
CPC分类号： H01L33/60 , H01L25/0753 , H01L25/167 , H01L33/52 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2224/83192 , H01L2224/92247 , H01L2924/01322 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Light emitting devices and methods are disclosed. In one embodiment a light emitting device can include a submount and a plurality of light emitting diodes (LEDs) disposed over the submount. At least a portion of the submount can include a reflective layer at least partially disposed below a solder mask. One or more layers within the submount may include one or more holes, a rough surface texture, or combinations thereof to improve adhesion within the device. The device can further include a retention material dispensed about the plurality of LEDs. Devices and methods are disclosed for improved solder mask adhesion.
摘要翻译： 公开了发光器件和方法。 在一个实施例中，发光器件可以包括设置在所述底座上的基座和多个发光二极管（LED）。 底座的至少一部分可以包括至少部分地布置在焊接掩模下方的反射层。 底座内的一个或多个层可以包括一个或多个孔，粗糙的表面纹理或其组合以改善装置内的粘附。 该装置还可以包括分配在多个LED周围的保留材料。 公开了用于改善焊接掩模附着力的装置和方法。
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公开(公告)号：US10797204B2
公开(公告)日：2020-10-06
申请号：US14292244
申请日：2014-05-30
申请人： Cree, Inc.
摘要： Submount based light emitter components and related methods are disclosed. In some aspects, light emitter components include a reflective ceramic submount, at least one light emitter chip disposed over a first surface of the submount, a layer of optical conversion material disposed over portions of each of the at least one light emitter chip and the first surface of the submount, and a lens disposed over the layer of optical conversion material. The layer of optical conversion material and the lens define separate and discrete layers over the at least one light emitter chip and submount.
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公开(公告)号：US10361349B2
公开(公告)日：2019-07-23
申请号：US15694591
申请日：2017-09-01
申请人： Cree, Inc.
摘要： Light emitting diode components and devices with a wall of reflective material and having improved performance and beam angle, are provided. Reflective material provided with light emitting diode devices is configured to optimize light reflectivity by altering the composition, thickness, placement and/or angle thereof. Methods of making and assembly light emitting diode components and devices with reflective materials and improved performance, are also provided.
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公开(公告)号：US09431590B2
公开(公告)日：2016-08-30
申请号：US14216146
申请日：2014-03-17
申请人： Cree, Inc.
IPC分类号： H01L29/22 , H01L33/58 , H01L33/48 , H01L27/15 , F21K99/00 , H01L33/56 , F21Y101/02 , F21Y105/00 , F21Y111/00
CPC分类号： H01L33/58 , F21K9/00 , F21K9/23 , F21K9/68 , F21Y2101/00 , F21Y2107/10 , F21Y2107/30 , F21Y2107/50 , F21Y2115/10 , H01L27/153 , H01L33/486 , H01L33/56 , Y10T29/41
摘要： Light emitter devices, such as light emitting diode (LED) devices and related methods are disclosed. A light emitter device includes a ceramic based substrate, at least one LED chip disposed on the substrate, and a filling material. The ceramic substrate can include one or more surface features. The filling material can be disposed over and/or within a portion of the one or more surface features. Surface features can include one or more pedestals, trenches, holes, indentions, depressions, waves, and/or convexly or concavely curved surfaces. Surface features can improve optics of the LED device, for example, improving brightness, reflection, and/or light extraction associated with the device. Related methods are disclosed.
摘要翻译： 公开了诸如发光二极管（LED）装置和相关方法的发光器件。 光发射器件包括基于陶瓷的衬底，设置在衬底上的至少一个LED芯片和填充材料。 陶瓷基板可以包括一个或多个表面特征。 填充材料可以设置在一个或多个表面特征的上方和/或其一部分内。 表面特征可以包括一个或多个基座，沟槽，孔，凹陷，凹陷，波浪和/或凸形或凹入曲面。 表面特征可以改善LED器件的光学元件，例如改善与器件相关联的亮度，反射和/或光提取。 公开了相关方法。
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公开(公告)号：US20150345714A1
公开(公告)日：2015-12-03
申请号：US14292244
申请日：2014-05-30
申请人： Cree, Inc.
摘要： Submount based light emitter components and related methods are disclosed. In some aspects, light emitter components include a reflective ceramic submount, at least one light emitter chip disposed over a first surface of the submount, a layer of optical conversion material disposed over portions of each of the at least one light emitter chip and the first surface of the submount, and a lens disposed over the layer of optical conversion material. The layer of optical conversion material and the lens define separate and discrete layers over the at least one light emitter chip and submount.
摘要翻译： 公开了基于底座的光发射器部件和相关方法。 在一些方面，光发射器部件包括反射陶瓷基座，设置在基座的第一表面上的至少一个光发射器芯片，设置在所述至少一个发光芯片中的每一个的部分上的光学转换材料层和第一 底座的表面和设置在光学转换材料层上的透镜。 光学转换材料层和透镜在至少一个光发射器芯片和底座上限定分离的和离散的层。
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公开(公告)号：US10804251B2
公开(公告)日：2020-10-13
申请号：US15359517
申请日：2016-11-22
申请人： Cree, Inc.
摘要： Devices, components and methods containing one or more light emitter devices, such as light emitting diodes (LEDs) or LED chips, are disclosed. In one aspect, a light emitter device component can include a metallic substrate with a mirrored surface, one or more light emitter devices mounted directly or indirectly on the mirrored surface, and one or more electrical components mounted on the top surface and electrically coupled to the one or more light emitter devices, wherein the one or more electrical components can be spaced from the mirrored metal substrate by one or more non-metallic layers. Components disclosed herein can result in improved thermal management and light output.
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