Abstract:
A breast augmentation device made from flexible rubber, having a breast-shaped front part and a hollow, rounded rear part for covering over the breast, wherein the rear part has a plurality of elongated grooves with vent holes and a plurality of elongated ribs, each elongated groove having at least one end perpendicularly connected to the periphery of the orifice of the hollow, rounded rear part, each elongated rib having a center portion and two opposite ends extended from the center portion and perpendicularly connected to the periphery of the orifice, the height of each elongated rib reducing gradually from the respective center portion toward the respective opposite ends.
Abstract:
An LED light module free of jumper wires has a substrate and multiple LED chips. The substrate has a positive side circuit, a negative side circuit, multiple first chip connection portions and multiple second connection portions. The first and second chip connection portions are respectively connected to the positive and negative side circuits, and are juxtaposedly and alternately arranged on the substrate so that a width between each first chip connection portion and a corresponding second chip connection portion is smaller than a width of each LED chip. Each LED chip can be directly mounted on corresponding first and second chip connection portions to electrically connect to the positive and negative side circuits. Accordingly, jumper wires for connecting the LED chips and the positive and negative side circuits can be removed to avoid broken jumper wires occurring when the LED light module is shipped or assembled.
Abstract:
An optical proximity correction method is described. A photomask pattern including multiple line patterns arranged in an end-to-end manner is provided. An initial correction step is conducted to add an end pattern at each of the two ends of each line pattern. Then, a fine correction step is conducted to correct the line patterns and the end patterns. Each end pattern is an asymmetric pattern, and the two end patterns between two adjacent line patterns are in a mirror-symmetric or point-symmetric arrangement.
Abstract:
A phase shift mask includes a light transparent substrate; an opaque material layer coated on the main surface of the light transparent substrate, wherein the opaque material layer has an window opening exposing a light transparent area of the light transparent substrate; a cruciform first phase shifting region of the exposed light transparent area; and a second phase shifting region of the exposed light transparent area except the cruciform first phase shifting region. Light passing through the cruciform first phase shifting region has a phase shift of 180 degrees relative to light passing through the d second phase shifting region.
Abstract:
An optical proximity correction method that uses additional corner serifs or hammerhead pattern to correct and avoid pull up of ends in a main pattern. These corner serifs are set such that the main pattern is corrected with only a slight line-end width expansion and line-end approaching the original design in length. Since the optical proximity correction method is able to correct the main pattern so that the end approaches the original design after a photo-exposure, any misalignment that may lead to uncompleted contact or an open of metallic interconnects can be avoided. Furthermore, the slightly expanded end permits a higher process window in the fabrication of metallic interconnects.
Abstract:
A phase shift mask for photolithography used in fabricating integrated circuits is disclosed. The mask comprises a transparent plate and a first opaque film formed on said transparent plate, which has a first pattern defining a main feature region. The first pattern is then imaged onto a photoresist layer coated on a wafer for the integrated circuits. The present invention further comprises at least one phase shift region formed on said transparent plate to correspond to an active region of the wafer, in which the phase shift region is used to improve optical scattering effect of the first pattern through the active region while performing the photolithography. Moreover, the present invention comprises at least one second opaque film formed on said transparent plate to correspond to a non-active region of the wafer, in which each has at least one second pattern used to improve optical scattering effect of the first pattern through the non-active region while performing the photolithography. The second pattern is located alongside and separated from the first pattern of the opaque film, and wherein the second pattern is then imaged onto the wafer with the phase shift region and the first pattern.
Abstract:
A half-tone phase shift mask is formed from the composite structure of a mask substrate and a half-tone phase shifting layer. The half-tone phase shifting layer induces a 180° phase shift to light passing through the mask. The half tone phase shifting layer further includes a main pattern having a first width and a first length, and an assist feature having a second width and a second length. The assist feature is parallel to the main pattern and disposed at both sides of the main pattern while being separated therefrom by a distance. Using deep ultraviolet light as the exposure source, a wafer scale of the first width is about 0.1-0.15 &mgr;m, a wafer scale of the second width is about 0.055-0.09 &mgr;m and the distance between the main pattern and the assist feature is about 0.22-0.27 &mgr;m.
Abstract:
A reticle having an assist feature between semi-dense lines is described. The reticle has two adjacent, substantially parallel, and substantially equally spaced line segments of which each representing a portion of a main feature having a line width, between two adjacent line segments of the group having a gap space, wherein the gap-space/line-width ratio is equal to about 3-6.5. Between the two adjacent line segments, at least one inside assist feature is located. At the outside edges of the extreme left-hand and right-hand line segments, two outside assist features are located, respectively, wherein each of the two assist features has a first width and is spaced apart from the nearest line segment by a distance.
Abstract:
A method of automatically forming a rim PSM is provided. A first pattern comprising a conventional original pattern as a blinding layer and assist features around the conventional circuit pattern is designed. A portion of a Cr film and a portion of a phase shifting layer under the Cr film are removed with the first pattern. The removed portion of the Cr film and the removed portion of the phase shifting layer are positioned on the assist feature. A second pattern comprising the conventional circuit pattern and a half of the assist features is designed. A portion of the Cr film in positions other than on the second pattern is removed. The convention circuit pattern formed at the mask medium is defined as the blinding layer. The area of the assist features only comprise a quartz substrate that light can pass through. The other areas of the mask medium wherein the phase shifting layer remains is defined as the phase-shifting portion of the PSM.
Abstract:
A method for forming a pattern with both a logic-type and, a memory-type circuit is disclosed. The method includes first providing a wafer which includes a photoresist layer, then covering the photoresist layer with a first mask including an opaque area and a first pattern area. Forming a first pattern on the photoresist layer by a first exposure. Covering the photoresist layer with a second mask after the first mask is removed. Moreover, a second pattern is printed on the photoresist layer by a second exposure. Finally, the second mask is removed. The double-exposure method will enhance the resolution of the pattern defined on the photoresist layer.