公开(公告)号：US20150259195A1

公开(公告)日：2015-09-17

申请号：US14643531

申请日：2015-03-10

Applicant: Chiung-Cheng Lo ,  Yu-Fu Kang ,  Ning-Yuan Wang ,  Chiung-Wen Lin

Inventor： Chiung-Cheng Lo ,  Yu-Fu Kang ,  Ning-Yuan Wang ,  Chiung-Wen Lin

IPC: B81B7/00 ,  B81C1/00 ,  B81C3/00 ,  B81B7/02

CPC classification number: H01L25/00 ,  B81C1/00238 ,  B81C2203/0792 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The invention provides a micro-electro-mechanical system (MEMS) module, which includes a MEMS die stacked on an electronic circuit die. The electronic circuit die includes a substrate, the substrate including at least one through-silicon via (TSV) penetrating through the substrate; and at least one electronic circuit. The electronic circuit includes a circuit region, and a signal transmission layer directly connecting the TSV. At least one wire is connected between a middle part of the MEMS die and the TSV. There is no signal communication at the interfacing location where the MEMS die is stacked on and bonded with the electronic circuit die.

Abstract translation: 本发明提供了一种微电子机械系统（MEMS）模块，其包括堆叠在电子电路管芯上的MEMS管芯。 所述电子电路管芯包括衬底，所述衬底包括贯穿所述衬底的至少一个穿硅通孔（TSV）; 和至少一个电子电路。 电子电路包括电路区域和直接连接TSV的信号传输层。 至少一根导线连接在MEMS管芯的中间部分和TSV之间。 在MEMS管芯堆叠在其上并与电子电路管芯接合的接口位置处没有信号通信。

公开(公告)号：US09702889B2

公开(公告)日：2017-07-11

申请号：US14742393

申请日：2015-06-17

Applicant: Shih-Chieh Lin ,  Chiung-Cheng Lo

Inventor： Shih-Chieh Lin ,  Chiung-Cheng Lo

IPC: G01P15/08 ,  G01C19/56 ,  G01P1/00 ,  G01P15/125 ,  G01P15/18

CPC classification number: G01P1/003 ,  G01P15/125 ,  G01P15/18 ,  G01P2015/0814 ,  G01P2015/0822 ,  G01P2015/0871

Abstract: The present invention discloses a MEMS device. The MEMS device includes a substrate, a proof mass, a frame spring and an anchor. The proof mass is connected to the substrate through the frame spring and the anchor. The proof mass includes a proof mass body, a proof mass frame surrounding the proof mass body, a linking element connecting the proof mass body to the proof mass frame, and a stopper between the proof mass body and the proof mass frame in a displacement direction to limit the displacement of the proof mass body. The stopper is connected to the proof mass frame as a part of the proof mass and contributes to the mass quantity of the proof mass.

公开(公告)号：US20150293141A1

公开(公告)日：2015-10-15

申请号：US14681991

申请日：2015-04-08

Applicant: Chia-Yu Wu ,  Chiung-Wen Lin ,  Chiung-Cheng Lo

Inventor： Chia-Yu Wu ,  Chiung-Wen Lin ,  Chiung-Cheng Lo

IPC: G01P15/08 ,  G01P15/135 ,  G01P15/125

CPC classification number: G01P15/125 ,  G01P2015/0834

Abstract: The present invention discloses a micro-electro-mechanical system (MEMS) device. The MEMS device includes: a substrate; a proof mass which defines an internal space inside and forms at least two capacitors with the substrate; at least two anchors connected to the substrate and respectively located in the capacitor areas of the capacitors from a cross-sectional view; at least one linkage truss located in the hollow structure, wherein the linkage truss is directly connected to the anchors or indirectly connected to the anchors through buffer springs; and multiple rotation springs located in the hollow structure, wherein the rotation springs are connected between the proof mass and the linkage truss, such that the proof mass can rotate along an axis formed by the rotation springs. There is no coupling mass which does not form a movable electrode in the connection between the proof mass and the substrate.

Abstract translation: 本发明公开了一种微机电系统（MEMS）装置。 MEMS器件包括：衬底; 限定内部的内部空间并与衬底形成至少两个电容器的校验物质; 从横截面图分别连接到基板并且分别位于电容器的电容器区域中的至少两个锚点; 位于所述中空结构中的至少一个连杆桁架，其中所述连杆桁架直接连接到所述锚固件或通过缓冲弹簧间接连接到所述锚固件; 以及位于所述中空结构中的多个旋转弹簧，其中所述旋转弹簧连接在所述检测质量块和所述连杆桁架之间，使得所述检测质量块可以沿着由所述旋转弹簧形成的轴线旋转。 没有在检测质量体和基体之间的连接中不形成可动电极的耦合质量。