摘要:
The present disclosure relates to an inertia measurement module for an unmanned aircraft, which comprises a housing assembly, a sensing assembly and a vibration damper. The vibration damper comprises a first vibration-attenuation cushion; and the sensing assembly comprises a first circuit board, a second circuit board and a flexible signal line for connecting the first circuit board and the second circuit board. An inertia sensor is fixed on the second circuit board, and the first circuit board is fixed on the housing assembly. The inertia measurement module further comprises a weight block, and the second circuit board, the weight block, the first vibration-attenuation cushion and the first circuit board are bonded together. The present disclosure greatly reduces the influence of the operational vibration frequency of the unmanned aircraft on the inertia sensor and improves the measurement stability of the inertia sensor.
摘要:
System and method can support a measurement module on a movable object. The measurement module includes a first circuit board with one or more sensors. Additionally, the measurement module includes a weight block assembly, wherein the weight block assembly is configured to have a mass that keeps an inherent frequency of the measurement module away from an operation frequency of the movable object. Furthermore, said first circuit board can be disposed in an inner chamber within the weight block assembly.
摘要:
In order to provide a technology capable of suppressing degradation of measurement accuracy ale to fluctuation of detection sensitivity of an MEMS by suppressing fluctuation in natural frequency of the MEMS caused by a stress, first, fixed portions 3a to 3d are displaced outward in a y-direction of a semiconductor substrate 2 by deformation of the semiconductor substrate 2. Since a movable body 5 is disposed in a state of floating above the semiconductor substrate 2, it is not affected and displaced by the deformation of the semiconductor substrate 2. Therefore, a tensile stress (+σ1) occurs in the beam 4a and a compressive stress (σ2) occurs in the beam 4b. At this time, in terms of a spring system made by combining the beam 4a and the beam 4b, increase in spring constant due to the tensile stress acting on the beam 4a and decrease in spring constant due to the compressive stress acting on the beam 4b are offset against each other.
摘要:
A physical quantity sensor includes: a substrate; a movable body including, with a first axis as a boundary, a first movable electrode portion disposed in a first region, a second movable electrode portion disposed in a second region, and a damping adjusting portion disposed in at least one of the first region and the second region; beam portions supporting the movable body; a first fixed electrode portion; and a second fixed electrode portion. A first through-hole is disposed in the damping adjusting portion. Second through-holes are disposed in the movable electrode portions. The area of a region where the first movable electrode portion overlaps with the first fixed electrode portion is the same as the area of a region where the second movable electrode portion overlaps with the second fixed electrode portion. The width of the first through-hole is greater than the widths of the second through-holes.
摘要:
An inertial sensor includes a first sensor element, which is damped against vibrations from an interface of the inertial sensor by a damping element. The first sensor element is configured to detect a first measured variable in a first frequency band, and the damping element is configured to dampen vibrations at least in the first frequency band. The inertial sensor further includes a second sensor element, which is mechanically coupled to the interface. The second sensor element is configured to detect a second measured variable in a second frequency band.
摘要:
A vibration damper for a sensor unit comprises an elastic damping element including a central plate, a plurality of damping fingers joined at a first end to the central plate, and a plurality of fastening surfaces. At least two fastening surfaces of the plurality of fastening surfaces are disposed at a distance from each other in a first spatial direction. The damping element is flexurally elastically soft along the first spatial direction and is formed with a higher stiffness in a main extension plane defined perpendicular to the first spatial direction. A layer of adhesive is applied to each of the at least two fastening surfaces which are configured to be subjected to shear stress as a result of vibrations in the main extension plane.
摘要:
The first buffer portion provides a first base portion and a first outer wall provided on a peripheral edge of the first base portion. The second buffer portion provides a second base portion which provides a mounting surface outside to a measurement target, and a second outer wall provided on a peripheral edge of the second base portion. The buffer body provides the first base portion and a top surface of the second outer wall abutting against each other. A housing portion for the sensor portion is provided inside. A holding portion which holds the sensor portion is provided at least at a part of the top surface of at least one of the first buffer portion and the second buffer portion. The sensor portion is held by the holding portion.
摘要:
A damping device for a micromechanical sensor device, having at least one first intermediate layer having at least two sections, a second section being situated around a first section, a lateral distance being provided between the first and the second section, and an elastic device being provided between the first section and the second section as an integral part of the first intermediate layer.
摘要:
An electrostatic device for damping a mechanical vibration movement of a moving object, the moving object being made of an electrically conductive material, the movement of the moving object having at least one parasitic vibration mode of frequency fp to be damped, the device comprising an electrode ELE forming, with the moving object, a gap of capacitance C voltage-biased with a DC voltage V0 by a biasing circuit, the biasing circuit comprising, electrically connected in series with the electrode ELE: a load resistance R; possibly an inductance L; a parasitic capacitance Cp, characterized in that the biasing circuit further includes an electronic compensating device DEC having an impedance Zeq, which comprises a capacitance component Ceq, a resistance component Req, and possibly an inductance component Leq.
摘要:
A tuned damped absorber arrangement is used to attenuate the response of an encoder. A vibration problem occurs on rotary axis heads which are used in machining operations. When using long slender tools, a vibration can be created which causes the encoder to lose its position. The device uses a tuned damped absorber that is attached to the input shaft of the encoder to dampen unwanted vibration.