Abstract:
An integrated circuit that detects whether a through silicon via has defects or not, at a wafer level. The integrated circuit includes a semiconductor substrate, a through silicon via configured to be formed in the semiconductor substrate to extend to a certain depth from the surface of the semiconductor substrate, an output pad, and a current path providing unit configured to provide a current, flowing between the semiconductor substrate and the through silicon via, to the output pad during a test mode.
Abstract:
A semiconductor device includes a first internal voltage driving unit configured to drive an internal voltage, a second internal voltage driving unit configured to drive the internal voltage in an operation period corresponding to an enable signal, a current amount detection unit configured to detect amount of current supplied by the first internal voltage driving unit, and a current amount comparison unit configured to compare the amount of detected current by the current amount detection unit with amount of a reference current, and determine whether or not to activate the enable signal in response to a comparison result.
Abstract:
A semiconductor device includes an enable unit configured to enable an output terminal, a feedback unit configured to receive an output of the output terminal and output a feedback signal, an amplifying unit configured to amplify a difference between a reference signal and the feedback signal, and a transfer unit configured to transfer an amplified signal of the amplifying unit as an enable control signal of the enable unit, and to have an output resistance value smaller than an output resistance value of the amplifying unit.