公开(公告)号：US20230096081A1

公开(公告)日：2023-03-30

申请号：US18053993

申请日：2022-11-09

Applicant: Cisco Technology, Inc.

Inventor： Dominic F. SIRIANI ,  Jock T. BOVINGTON ,  Matthew J. TRAVERSO

IPC: H01S5/22 ,  H01S5/02 ,  H01S5/028

Abstract: An optical apparatus comprises a semiconductor substrate and a slab-coupled optical waveguide (SCOW) emitter disposed on the semiconductor substrate. The SCOW emitter comprises an optical waveguide comprising: a first region doped with a first conductivity type; a second region doped with a different, second conductivity type; and an optically active region disposed between the first region and the second region. The optically active region comprises a plurality of quantum dots.

公开(公告)号：US20220278022A1

公开(公告)日：2022-09-01

申请号：US17663072

申请日：2022-05-12

Applicant: Cisco Technology, Inc.

Inventor： Ashley J.M. ERICKSON ,  Matthew J. TRAVERSO ,  Sandeep RAZDAN ,  Joyce J. M. PETERNEL ,  Aparna R. PRASAD

IPC: H01L23/473 ,  H01L21/48 ,  H01L21/683 ,  H01L23/00 ,  H01L21/78 ,  H01L23/544

Abstract: An opto-electronic package is described. The opto-electronic package is manufactured using a fan out wafer level packaging to produce dies/frames which include connection features. Additional structures such as heat exchanged structures are joined to a connection component and affixed to packages, using the connection features, to provide structural support and heat exchange to heat generating components in the package, among other functions.

公开(公告)号：US20220187537A1

公开(公告)日：2022-06-16

申请号：US17653195

申请日：2022-03-02

Applicant: Cisco Technology, Inc.

Inventor： Matthew J. TRAVERSO ,  Jock T. BOVINGTON ,  Ashley J.M. ERICKSON

IPC: G02B6/13 ,  G02B6/12 ,  G02B6/42 ,  G02B6/30

Abstract: Solder reflow compatible connections between optical components are provided by use of reflow compatible epoxies to bond optical components and remain bonded between the optical components at temperatures of at least 260 degrees Celsius for at least five minutes. In some embodiments, the reflow compatible epoxy is index matched to the optical channels in the optical components and is disposed in the light path therebetween. In some embodiments, a light path is defined between the optical channels through at least a portion of an air gap between the optical components.

公开(公告)号：US20210305128A1

公开(公告)日：2021-09-30

申请号：US16836825

申请日：2020-03-31

Applicant: Cisco Technology, Inc.

Inventor： Ashley J.M. ERICKSON ,  Matthew J. TRAVERSO ,  Sandeep RAZDAN ,  Joyce J.M. PETERNEL ,  Aparna R. PRASAD

IPC: H01L23/473 ,  H01L21/48 ,  H01L21/683 ,  H01L23/00 ,  H01L21/78 ,  H01L23/544

Abstract: An opto-electronic package is described. The opto-electronic package is manufactured using a fan out wafer level packaging to produce dies/frames which include connection features. Additional structures such as heat exchanged structures are joined to a connection component and affixed to packages, using the connection features, to provide structural support and heat exchange to heat generating components in the package, among other functions.

公开(公告)号：US20200241207A1

公开(公告)日：2020-07-30

申请号：US16260622

申请日：2019-01-29

Applicant: Cisco Technology, Inc.

Inventor： Sandeep RAZDAN ,  Ashley J. MAKER ,  Jock T. BOVINGTON ,  Matthew J. TRAVERSO

IPC: G02B6/30

Abstract: Using laser patterning for an optical assembly, optical features are written into photonic elements at the end of a manufacturing sequence in order to prevent errors and damages to the optical features. The optical assembly is manufactured by affixing a photonic element to a substrate which includes one or more optical features and mapping one or more optical features for the photonic element. The optical features are then written into the fixed photonic element using laser patterning and the optical assembly is completed by connecting components, such as optical fibers, to the photonic element.

公开(公告)号：US20240272382A1

公开(公告)日：2024-08-15

申请号：US18166972

申请日：2023-02-09

Applicant: Cisco Technology, Inc.

Inventor： Jock T. BOVINGTON ,  Matthew J. TRAVERSO ,  Marco MAZZINI

IPC: G02B6/42

CPC classification number: G02B6/4246 ,  G02B6/4203

Abstract: Embodiments herein describe a pluggable module that includes a ROADM implemented in a photonic integrated circuit (PIC). By implementing the ROADM in a PIC, the ROADM can be placed on smaller, pluggable modules (e.g., a Small Form-factor Pluggable (SFP) which can be a hot-pluggable network interface module).

公开(公告)号：US20230244035A1

公开(公告)日：2023-08-03

申请号：US18296665

申请日：2023-04-06

Applicant: Cisco Technology, Inc.

Inventor： Ashley J.M. ERICKSON ,  Matthew J. TRAVERSO

IPC: G02B6/24 ,  G02B6/35 ,  G02B6/26 ,  G02B6/28 ,  G02B6/12

CPC classification number: G02B6/24 ,  G02B6/3528 ,  G02B6/264 ,  G02B6/2804 ,  G02B6/2821 ,  G02B6/12 ,  G02B6/12002 ,  G02B6/12004 ,  G02B23/08

Abstract: Periscope assemblies are provided which have a light path that travels in a first plane along the first waveguide, a second plane along the second waveguide that is parallel to the first plane, and along a third plane along the third waveguide that intersects the first plane and the second plane. In some examples the periscope assembly includes first and second carriers comprising respective first and second waveguides and defining respective first and second cavities in which a third carrier comprising a third waveguide is disposed and optionally includes an optical component. In some examples, the cavities are defined in one or more carriers on a mating surface, on a side opposite to the mating surface, or on a side perpendicular to a mating surface.

公开(公告)号：US20230161098A1

公开(公告)日：2023-05-25

申请号：US18158198

申请日：2023-01-23

Applicant: Cisco Technology, Inc.

Inventor： Jock T. BOVINGTON ,  Matthew J. TRAVERSO ,  Mark C. NOWELL

IPC: F21V8/00 ,  G02B6/38 ,  G02B6/42 ,  G02B6/12

CPC classification number: G02B6/0083 ,  G02B6/3863 ,  G02B6/4249 ,  G02B6/12

Abstract: Aspects include a pluggable optical device and related optical system. The pluggable optical device comprises a housing, a printed circuit board (PCB) within the housing, and one or more blind mate optical connectors attached to the PCB along a first end of the PCB. The pluggable optical device further comprises one or more electrical contacts of the PCB near the first end, one or more external optical connectors arranged near a second end of the PCB opposite the first end, and one or more optical components attached to the PCB and included in optical paths extending between the one or more external optical connectors and the one or more blind mate optical connectors.

公开(公告)号：US20230060862A1

公开(公告)日：2023-03-02

申请号：US17445914

申请日：2021-08-25

Applicant: Cisco Technology, Inc.

Inventor： Vipulkumar K. PATEL ,  Matthew J. TRAVERSO ,  Sandeep RAZDAN ,  Aparna R. PRASAD

IPC: G02B6/42

Abstract: Embodiments herein describe an optical system that includes a photonic integrated circuit (PIC) bonded to a package containing an electrical integrated circuit (EIC). However, this bond can prevent an edge coupler from optically aligning an optical fiber to an edge of the PIC in order to transfer optical signals. To provide room for the edge coupler, the PIC is arranged to overhang the package containing the EIC so that the package does not interfere with the ability of the edge coupler to align with the side or edge of the PIC. In this manner, an optical fiber can be optically aligned (e.g., butt coupled) to the edge of the PIC rather than having to use a grating coupler or some other less efficient optical coupling in order to transfer optical signals between the PIC and the optical fiber.

公开(公告)号：US20210058161A1

公开(公告)日：2021-02-25

申请号：US16933837

申请日：2020-07-20

Applicant: Cisco Technology, Inc.

Inventor： Marco MAZZINI ,  Christopher R.S. FLUDGER ,  Alberto CERVASIO ,  Matthew J. TRAVERSO

IPC: H04B10/524 ,  H04L25/49 ,  H04J14/02 ,  H04B1/04 ,  H04B10/2513 ,  H04B10/516 ,  H04B10/54 ,  H04B10/2507

Abstract: The present disclosure provides signal management with unequal eye spacing by: determining a dispersion slope of a channel between a transmitter and a receiver based on a temperature of the transmitter and a wavelength used by the transmitter to transmit signals over the channel; determining maximum and minimum powers for transmission over the channel; assigning a plurality of rails to a corresponding plurality of power levels, wherein amplitude differences between adjacent rails of the plurality of rails are based on the dispersion slope and produce a first eye pattern with a first Ratio of Level Mismatch (RLM) less than one; encoding, by the transmitter, data onto a conditioned signal according to the plurality of rails; and transmitting the conditioned signal over the channel, so that the conditioned signal demonstrates a second eye pattern with a second RLM greater than the first RLM when received at the receiver.