公开(公告)号：US09691633B2

公开(公告)日：2017-06-27

申请号：US14337232

申请日：2014-07-22

Applicant: CYNTEC CO., LTD.

Inventor： Chia Pei Chou ,  Lang-Yi Chiang ,  Jih-Hsu Yeh ,  You Chang Tseng

IPC: H05K5/02 ,  H05K7/18 ,  H01L21/48 ,  H01L23/495 ,  H01L23/498

CPC classification number: H01L21/486 ,  H01L23/495 ,  H01L23/4952 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2924/00 ,  H01L2924/0002 ,  Y10T29/49117

Abstract: The present invention discloses a leadframe in which two conductive pillars with high aspect ratio and the corresponding two leads of the leadframe forms a 3D space for accommodating at least one device. A first lead and a second lead are spaced apart from each other. A first conductive pillar is formed on the first lead by disposing a first via on the first lead, wherein at least one first conductive material is filled inside the first via to form the first conductive pillar. A second conductive pillar is formed on the second lead by disposing a second via on the second lead, wherein at least one second conductive material is filled inside the second via to form the second conductive pillar. The first lead, the second lead, the first conductive pillar, and the second conductive pillar form a 3D space for accommodating at least one device, wherein the at least one device is electrically connected to the first conductive pillar and the second conductive pillar.

公开(公告)号：US20130335186A1

公开(公告)日：2013-12-19

申请号：US13868993

申请日：2013-04-23

Applicant: Cyntec Co., Ltd.

Inventor： Wei-Chien Chang ,  Chia-Chi Wu ,  Lang-Yi Chiang ,  Tsung-Chan Wu ,  Jih-Hsu Yeh

IPC: H01F5/00 ,  H01F41/04

CPC classification number: H01F27/2804 ,  H01F5/003 ,  H01F5/02 ,  H01F27/292 ,  H01F41/04 ,  H01F2017/048 ,  H01F2027/2809 ,  Y10T29/49002 ,  Y10T29/4902 ,  Y10T29/49071 ,  Y10T29/49073 ,  Y10T29/49075

Abstract: An electromagnetic component includes a coil portion with a multi-layer stack structure, a molded body encapsulating the coil portion, and two electrodes respectively coupled to two terminals of the coil portion. The coil portion is fabricated using plating, laminating and/or pressing manufacturing techniques.

公开(公告)号：US20130300529A1

公开(公告)日：2013-11-14

申请号：US13868995

申请日：2013-04-23

Applicant: CYNTEC CO., LTD.

Inventor： Wei-Chien Chang ,  Chia-Chi Wu ,  Lang-Yi Chiang ,  Tsung-Chan Wu ,  Jih-Hsu Yeh

IPC: H01F5/02

CPC classification number: H01F27/2804 ,  H01F5/003 ,  H01F5/02 ,  H01F27/292 ,  H01F41/04 ,  H01F2017/048 ,  H01F2027/2809 ,  Y10T29/49002 ,  Y10T29/4902 ,  Y10T29/49071 ,  Y10T29/49073 ,  Y10T29/49075

Abstract: An electromagnetic component including a multi-layer, spiral coil structure embedded in a molded body is disclosed. Each layer of the coil structure makes approximately one and a quarter turns of a winding. Each layer of the coil structure has a loose middle segment, two slim end segments overlapping each other with a spacing therebetween, and tapered neck segments respectively connecting the loose middle segment with the two slim end segments.