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    Lead frame and the method to fabricate thereof
    4.
    发明授权
    Lead frame and the method to fabricate thereof 有权

    公开(公告)号：US10256118B2

    公开(公告)日：2019-04-09

    申请号：US15972247

    申请日：2018-05-07

    Applicant: CYNTEC CO., LTD.

    Inventor： Chia Pei Chou ,  Lang-Yi Chiang ,  Jih-Hsu Yeh ,  You Chang Tseng

    IPC: H01L23/495 ,  H01L21/48 ,  H01L23/498

    Abstract: A method to form an electrical component, the method comprising: providing a first lead and a second lead; forming a first conductive pillar and a second conductive pillar on a first portion of the top surface of the first lead and a first portion of the top surface of the second lead, respectively, wherein a second portion of the top surface of the first lead, a second portion of the top surface of the second lead, the first conductive pillar, and the second conductive pillar form a 3D space, wherein at least one device is disposed in said 3D space and electrically connected to the at least one device to the first conductive pillar and the second conductive pillar.

    Leadframe and the method to fabricate thereof
    6.
    发明授权
    Leadframe and the method to fabricate thereof 有权

    公开(公告)号：US09991136B2

    公开(公告)日：2018-06-05

    申请号：US15592190

    申请日：2017-05-10

    Applicant: CYNTEC CO., LTD.

    Inventor： Chia Pei Chou ,  Lang-Yi Chiang ,  Jih-Hsu Yeh ,  You Chang Tseng

    IPC: H05K1/11 ,  H01L21/48 ,  H01L23/495 ,  H01L23/498

    CPC classification number: H01L21/486 ,  H01L23/495 ,  H01L23/4952 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2924/00 ,  H01L2924/0002 ,  Y10T29/49117

    Abstract: The present invention discloses a leadframe in which two conductive pillars with a high aspect ratio and the corresponding two leads of the leadframe form a 3D space for accommodating at least one device. A first lead and a second lead are spaced apart from each other. A first conductive pillar is formed on the first lead by disposing a first via on the first lead, wherein at least one first conductive material is filled inside the first via to form the first conductive pillar. A second conductive pillar is formed on the second lead by disposing a second via on the second lead, wherein at least one second conductive material is filled inside the second via to form the second conductive pillar. The first lead, the second lead, the first conductive pillar, and the second conductive pillar form a 3D space for accommodating at least one device, wherein the at least one device is electrically connected to the first conductive pillar and the second conductive pillar.

    Leadframe and the method to fabricate thereof
    7.
    发明授权
    Leadframe and the method to fabricate thereof 有权

    公开(公告)号：US09691633B2

    公开(公告)日：2017-06-27

    申请号：US14337232

    申请日：2014-07-22

    Applicant: CYNTEC CO., LTD.

    Inventor： Chia Pei Chou ,  Lang-Yi Chiang ,  Jih-Hsu Yeh ,  You Chang Tseng

    IPC: H05K5/02 ,  H05K7/18 ,  H01L21/48 ,  H01L23/495 ,  H01L23/498

    CPC classification number: H01L21/486 ,  H01L23/495 ,  H01L23/4952 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2924/00 ,  H01L2924/0002 ,  Y10T29/49117

    Abstract: The present invention discloses a leadframe in which two conductive pillars with high aspect ratio and the corresponding two leads of the leadframe forms a 3D space for accommodating at least one device. A first lead and a second lead are spaced apart from each other. A first conductive pillar is formed on the first lead by disposing a first via on the first lead, wherein at least one first conductive material is filled inside the first via to form the first conductive pillar. A second conductive pillar is formed on the second lead by disposing a second via on the second lead, wherein at least one second conductive material is filled inside the second via to form the second conductive pillar. The first lead, the second lead, the first conductive pillar, and the second conductive pillar form a 3D space for accommodating at least one device, wherein the at least one device is electrically connected to the first conductive pillar and the second conductive pillar.

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