公开(公告)号：US10755190B2

公开(公告)日：2020-08-25

申请号：US15382278

申请日：2016-12-16

申请人： D-Wave Systems Inc.

发明人： Alexandr M. Tcaciuc ,  Pedro A. de Buen ,  Peter D. Spear ,  Sergey V. Uchaykin ,  Colin C. Enderud ,  Richard D. Neufeld ,  Jeremy P. Hilton ,  J. Craig Petroff ,  Amar B. Kamdar ,  Gregory D. Peregrym ,  Edmond Ho Yin Kan ,  Loren J. Swenson ,  George E. G. Sterling ,  Gregory Citver

IPC分类号： H01F7/06 ,  G06N10/00 ,  H03H3/00 ,  H01F41/04 ,  H01F13/00 ,  H03H7/42 ,  H05K1/02 ,  H01F41/076 ,  H03H1/00 ,  H05K1/16 ,  H01L39/14 ,  H01L39/02

摘要： An electrical filter includes a dielectric substrate with inner and outer coils about a first region and inner and outer coils about a second region, a portion of cladding removed from wires that form the coils and coupled to electrically conductive traces on the dielectric substrate via a solder joint in a switching region. An apparatus to thermally couple a superconductive device to a metal carrier with a through-hole includes a first clamp and a vacuum pump. A composite magnetic shield for use at superconductive temperatures includes an inner layer with magnetic permeability of at least 50,000; and an outer layer with magnetic saturation field greater than 1.2 T, separated from the inner layer by an intermediate layer of dielectric. An apparatus to dissipate heat from a superconducting processor includes a metal carrier with a recess, a post that extends upwards from a base of the recess and a layer of adhesive on top of the post. Various cryogenic refrigeration systems are described.