公开(公告)号：US20140326001A1

公开(公告)日：2014-11-06

申请号：US14284138

申请日：2014-05-21

Applicant: D-Wave Systems Inc.

Inventor： Gregory Citver ,  Jacob Craig Petroff ,  Sasha Vikram Gunn ,  Edmond Ho Yin Kan

IPC: B01D8/00

CPC classification number: B01D8/00

Abstract: Systems and methods for improving the performance of dilution refrigeration systems include cryocondensation traps employed in the helium circuit of a dilution refrigerator may be modified to improve performance. A cryocondensation trap employs a cryocondensation surface having at least one temperature that preferably matches the temperature at which at least one contaminant freezes into a solid form from a gaseous form. A single trap with at least one continuous cryocondensation surface formed in a generally helical or spiral-like fashion with each region having a different temperature may be employed to trap a specific contaminant or set of contaminants. A single trap with multiple cryocondensation surfaces where each surface has a different temperature may be alternatively employed for the same purpose. To provide a temperature gradient in the cryocondensation trap, at least one region of the cryocondensation trap may be thermally coupled to a cold surface and/or a transfer tube.

Abstract translation: 用于改善稀释制冷系统的性能的系统和方法包括稀释冷冻机的氦回路中使用的冷冻凝结阱可以被改变以提高性能。 低温冷凝阱采用具有至少一个温度的低温冷凝表面，该温度优选地与至少一种污染物从气态形式冻结成固体形式的温度相匹配。 具有至少一个以每个区域具有不同温度形成的大致螺旋状或螺旋状的连续冷凝表面的单个阱可用于捕获特定的污染物或一组污染物。 为了相同的目的，可以替代地使用具有多个冷凝表面的单个阱，其中每个表面具有不同的温度。 为了在冷冻阱中提供温度梯度，低温冷凝阱的至少一个区域可热耦合到冷表面和/或转移管。

公开(公告)号：US10755190B2

公开(公告)日：2020-08-25

申请号：US15382278

申请日：2016-12-16

Applicant: D-Wave Systems Inc.

Inventor： Alexandr M. Tcaciuc ,  Pedro A. de Buen ,  Peter D. Spear ,  Sergey V. Uchaykin ,  Colin C. Enderud ,  Richard D. Neufeld ,  Jeremy P. Hilton ,  J. Craig Petroff ,  Amar B. Kamdar ,  Gregory D. Peregrym ,  Edmond Ho Yin Kan ,  Loren J. Swenson ,  George E. G. Sterling ,  Gregory Citver

IPC: H01F7/06 ,  G06N10/00 ,  H03H3/00 ,  H01F41/04 ,  H01F13/00 ,  H03H7/42 ,  H05K1/02 ,  H01F41/076 ,  H03H1/00 ,  H05K1/16 ,  H01L39/14 ,  H01L39/02

Abstract: An electrical filter includes a dielectric substrate with inner and outer coils about a first region and inner and outer coils about a second region, a portion of cladding removed from wires that form the coils and coupled to electrically conductive traces on the dielectric substrate via a solder joint in a switching region. An apparatus to thermally couple a superconductive device to a metal carrier with a through-hole includes a first clamp and a vacuum pump. A composite magnetic shield for use at superconductive temperatures includes an inner layer with magnetic permeability of at least 50,000; and an outer layer with magnetic saturation field greater than 1.2 T, separated from the inner layer by an intermediate layer of dielectric. An apparatus to dissipate heat from a superconducting processor includes a metal carrier with a recess, a post that extends upwards from a base of the recess and a layer of adhesive on top of the post. Various cryogenic refrigeration systems are described.

公开(公告)号：US20170178018A1

公开(公告)日：2017-06-22

申请号：US15382278

申请日：2016-12-16

Applicant: D-Wave Systems Inc.

Inventor： Alexandr M. Tcaciuc ,  Pedro A. de Buen ,  Peter D. Spear ,  Sergey V. Uchaykin ,  Colin C. Enderud ,  Richard D. Neufeld ,  Jeremy P. Hilton ,  J. Craig Petroff ,  Amar B. Kamdar ,  Gregory D. Peregrym ,  Edmond Ho Yin Kan ,  Loren J. Swenson ,  George E.G. Sterling ,  Gregory Citver

IPC: G06N99/00 ,  H01L39/12 ,  H01L39/24 ,  H05K3/34 ,  H05K9/00 ,  F25B43/00 ,  H01L39/18 ,  H01F41/06 ,  H01F41/04 ,  H01F13/00 ,  F25B9/12 ,  H03H3/00 ,  H05K1/02

CPC classification number: G06N10/00 ,  H01F13/006 ,  H01F41/048 ,  H01F41/076 ,  H01L39/02 ,  H01L39/14 ,  H03H3/00 ,  H03H7/425 ,  H03H2001/005 ,  H05K1/0233 ,  H05K1/0245 ,  H05K1/16 ,  H05K2201/10287

Abstract: An electrical filter includes a dielectric substrate with inner and outer coils about a first region and inner and outer coils about a second region, a portion of cladding removed from wires that form the coils and coupled to electrically conductive traces on the dielectric substrate via a solder joint in a switching region. An apparatus to thermally couple a superconductive device to a metal carrier with a through-hole includes a first clamp and a vacuum pump. A composite magnetic shield for use at superconductive temperatures includes an inner layer with magnetic permeability of at least 50,000; and an outer layer with magnetic saturation field greater than 1.2 T, separated from the inner layer by an intermediate layer of dielectric. An apparatus to dissipate heat from a superconducting processor includes a metal carrier with a recess, a post that extends upwards from a base of the recess and a layer of adhesive on top of the post. Various cryogenic refrigeration systems are described.