公开(公告)号：US20230059922A1

公开(公告)日：2023-02-23

申请号：US17887669

申请日：2022-08-15

Applicant: Delta Electronics, Inc.

Inventor： Shih-Kang Lin ,  Li-Kuang Tan

IPC: H05K7/20 ,  F04B53/22 ,  F04B53/16

Abstract: A hot-swappable pump unit (HSPU) and a coolant distribution unit (CDU) using the same are disclosed. The HSPU is connected to a loop inlet element, a loop outlet element and a fixed component of CDU along a matching direction. The HSPU includes a housing, a pump, a pump inlet element, a pump outlet element and a fastening component. The pump inlet element is in communication with the pump by passing through a first lateral wall of the housing. The pump outlet element is in communication with the pump by passing through the first lateral wall. The fastening component is arranged on the housing and configured to engage with the fixed component, to drive the hosing to move along the matching direction. Whereby, the pump inlet element and the loop outlet element are matched and connected, and the pump outlet element and the loop inlet element are matched and connected.

公开(公告)号：US11486652B2

公开(公告)日：2022-11-01

申请号：US16513325

申请日：2019-07-16

Applicant: DELTA ELECTRONICS, INC.

Inventor： Yu-Hung Huang ,  Li-Kuang Tan ,  Wei-Fang Wu

IPC: F28D15/04

Abstract: A heat-dissipating device includes a condenser and an evaporator. The condenser includes a shell and a main capillary wick. The shell has a chamber and a through hole communicating with the chamber. The main capillary wick is disposed in the chamber. The evaporator has an evaporating section, a gas conduit and a liquid conduit. The evaporating section has a gas cavity, and the liquid conduit communicating with the chamber and filling with a liquid. The liquid conduit having a hole communicating with the gas cavity is inserted in the gas conduit and the gas cavity. A stepped area is formed between the liquid conduit and the chamber for gathering the liquid flowing into the liquid conduit.

公开(公告)号：US20250024642A1

公开(公告)日：2025-01-16

申请号：US18896001

申请日：2024-09-25

Applicant: Delta Electronics, Inc.

Inventor： Li-Kuang Tan ,  Sung Tsang

IPC: H05K7/20

Abstract: The disclosure relates to an immersion cooling system including a tank, an access opening, a first dielectric liquid, a working object and a condensing unit. The tank has a space and a cover. The cover is detachably disposed on the tank to close or open the space selectively. The access opening is in communication with the space of the tank. The first dielectric liquid is accommodated within the space to form a liquid surface. The liquid surface and the access opening are disposed adjacent to each other. The working object is immersed in the first dielectric liquid. The condensing unit is arranged in the space above the liquid surface. When a cooling operation is performed, the access opening is closed, the first dielectric liquid is kept in the space, and the heat generated from the working object is dissipated through the first dielectric liquid and the condensing unit.

公开(公告)号：US11971219B2

公开(公告)日：2024-04-30

申请号：US17695333

申请日：2022-03-15

Applicant: DELTA ELECTRONICS, INC.

Inventor： Li-Kuang Tan ,  Shih-Kang Lin

IPC: F28D15/02 ,  F21V29/74 ,  F21Y115/10 ,  F28D15/04 ,  F28D21/00 ,  F28F3/06 ,  F28F9/007 ,  H01L23/367 ,  H01L23/427 ,  H01L33/64

CPC classification number: F28D15/0275 ,  F28D15/0233 ,  F28D15/04 ,  F28F3/06 ,  H01L23/427 ,  H01L33/64 ,  F21V29/74 ,  F21Y2115/10 ,  F28D2021/0028 ,  F28F9/0075 ,  F28F2275/08 ,  H01L23/3672

Abstract: A heat dissipation device includes at least a temperature plate and a cooling fin assembly. The temperature plate includes a plate body and a supporter. The plate body includes a vacuum chamber and a first external surface. The plate body is bent to form at least a bent portion with the first external surface being a compressive side, and the supporter is disposed at the bent portion. The supporter is disposed inside the vacuum chamber and connected to an inner wall of the vacuum chamber. The cooling fin assembly is disposed on the first external surface.

公开(公告)号：US11543188B2

公开(公告)日：2023-01-03

申请号：US16742203

申请日：2020-01-14

Applicant: DELTA ELECTRONICS, INC.

Inventor： Li-Kuang Tan ,  Shih-Kang Lin ,  Kuo-Ying Lee ,  Ting-Yuan Wu ,  Chao-Wen Lu

IPC: F28D15/02 ,  F28D15/04 ,  H05K7/20 ,  F28D21/00

Abstract: A temperature plate device includes a plate body and a bent structure. The plate body includes a first plate and a second plate. A chamber is defined by the first plate and the second plate. The first plate has a first step section. The second plate has a second step section corresponding to the first step section. The bent structure is connected to and traverses the first step section between the first step section and the second step section.

公开(公告)号：US20220338376A1

公开(公告)日：2022-10-20

申请号：US17476267

申请日：2021-09-15

Applicant: Delta Electronics, Inc.

Inventor： Li-Kuang Tan ,  Sung Tsang

IPC: H05K7/20

Abstract: The disclosure relates to an immersion cooling system including a tank, an access opening, a first dielectric liquid, a working object and a condensing unit. The tank has a space and a cover. The cover is detachably disposed on the tank to close or open the space selectively. The access opening is in communication with the space of the tank. The first dielectric liquid is accommodated within the space to form a liquid surface. The liquid surface and the access opening are disposed adjacent to each other. The working object is immersed in the first dielectric liquid. The condensing unit is arranged in the space above the liquid surface. When a cooling operation is performed, the access opening is closed, the first dielectric liquid is kept in the space, and the heat generated from the working object is dissipated through the first dielectric liquid and the condensing unit.