Nonvolatile semiconductor memory device
    11.
    发明授权
    Nonvolatile semiconductor memory device 有权
    非易失性半导体存储器件

    公开(公告)号:US08076709B2

    公开(公告)日:2011-12-13

    申请号:US12873679

    申请日:2010-09-01

    IPC分类号: H01L29/792 G11C16/04

    摘要: In a situation where a memory cell includes an ONO film, which comprises a silicon nitride film for charge storage and oxide films positioned above and below the silicon nitride film; a memory gate above the ONO film; a select gate, which is adjacent to a lateral surface of the memory gate via the ONO film; a gate insulator positioned below the select gate; a source region; and a drain region, an erase operation is performed by injecting holes generated by BTBT into the silicon nitride film while applying a positive potential to the source region, applying a negative potential to the memory gate, applying a positive potential to the select gate, and flowing a current from the drain region to the source region, thus improving the characteristics of a nonvolatile semiconductor memory device.

    摘要翻译: 在存储单元包括ONO膜的情况下,其包括用于电荷存储的氮化硅膜和位于氮化硅膜上方和下方的氧化膜; 在ONO电影上方的记忆门; 选择栅极,其经由ONO膜与存储栅的侧表面相邻; 位于选择门下方的栅极绝缘体; 源区; 和漏极区域,通过将BTBT产生的空穴注入氮化硅膜,同时向源极区域施加正电位,向存储栅极施加负电位,向选择栅极施加正电位,进行擦除操作,以及 使电流从漏极区域流向源极区域,从而改善非易失性半导体存储器件的特性。

    Fabrication method and structure of semiconductor non-volatile memory device
    12.
    发明授权
    Fabrication method and structure of semiconductor non-volatile memory device 有权
    半导体非易失性存储器件的制造方法和结构

    公开(公告)号:US07671404B2

    公开(公告)日:2010-03-02

    申请号:US11589095

    申请日:2006-10-30

    IPC分类号: H01L29/94

    摘要: A non-volatile semiconductor memory device with good write/erase characteristics is provided. A selection gate is formed on a p-type well of a semiconductor substrate via a gate insulator, and a memory gate is formed on the p-type well via a laminated film composed of a silicon oxide film, a silicon nitride film, and a silicon oxide film. The memory gate is adjacent to the selection gate via the laminated film. In the regions on both sides of the selection gate and the memory gate in the p-type well, n-type impurity diffusion layers serving as the source and drain are formed. The region controlled by the selection gate and the region controlled by the memory gate located in the channel region between said impurity diffusion layers have the different charge densities of the impurity from each other.

    摘要翻译: 提供具有良好写入/擦除特性的非易失性半导体存储器件。 通过栅极绝缘体在半导体衬底的p型阱上形成选择栅极,并且通过由氧化硅膜,氮化硅膜和氮化硅膜构成的层叠膜在p型阱上形成存储栅极 氧化硅膜。 存储器栅极通过层叠膜与选择栅极相邻。 在p型阱中的选择栅极和存储栅极的两侧的区域中,形成用作源极和漏极的n型杂质扩散层。 由选择栅极控制的区域和由位于所述杂质扩散层之间的沟道区域中的存储栅极控制的区域具有彼此不同的杂质的电荷密度。

    Nonvolatile memory device and semiconductor device
    13.
    发明授权
    Nonvolatile memory device and semiconductor device 有权
    非易失性存储器件和半导体器件

    公开(公告)号:US07529126B2

    公开(公告)日:2009-05-05

    申请号:US11472993

    申请日:2006-06-23

    IPC分类号: G11C11/34 G11C16/04

    CPC分类号: G11C16/10 G11C16/0433

    摘要: Disclosed here is a method for speeding up data writing and reducing power consumption by reducing the variation of the threshold voltage of each of non-volatile memory cells at data writing. When writing data in a memory cell, a voltage of about 8V is applied to the memory gate line, a voltage of about 5V is applied to the source line, a voltage of about 1.5V is applied to the selected gate line respectively. At that time, in the writing circuit, the writing pulse is 0, the writing latch output a High signal, and a NAND-circuit outputs a Low signal. And, a constant current of about 1iA flows in a constant current source transistor and the bit line is discharged by a constant current of about 1iA to flow a current in the memory cell.

    摘要翻译: 这里公开了一种通过在数据写入时减小每个非易失性存储单元的阈值电压的变化来加速数据写入并降低功耗的方法。 当在存储单元中写入数据时,约8V的电压被施加到存储器栅极线,大约5V的电压被施加到源极线,大约1.5V的电压分别施加到所选择的栅极线。 此时,在写入电路中,写入脉冲为0,写入锁存器输出高电平信号,NAND电路输出低电平信号。 并且,在恒定电流源晶体管中流动约1iA的恒定电流,并且通过约1iA的恒定电流放电位线以使存储单元中的电流流动。

    Nonvolatile memory device and semiconductor device
    14.
    发明授权
    Nonvolatile memory device and semiconductor device 有权
    非易失性存储器件和半导体器件

    公开(公告)号:US07085157B2

    公开(公告)日:2006-08-01

    申请号:US10805365

    申请日:2004-03-22

    IPC分类号: G11C11/34 G11C16/04

    CPC分类号: G11C16/10 G11C16/0433

    摘要: A method for speeding up data writing and reducing power consumption by reducing the variation of the threshold voltage of each of non-volatile memory cells at data writing. When writing data in a memory cell, a voltage of about 8V is applied to the memory gate line, a voltage of about 5V is applied to the source line, a voltage of about 1.5V is applied to the selected gate line respectively. At that time, in the writing circuit, the writing pulse is 0, the writing latch output a High signal, and a NAND-circuit outputs a Low signal. And, a constant current of about 1 ìA flows in a constant current source transistor and the bit line is discharged by a constant current of about 1 ìA to flow a current in the memory cell.

    摘要翻译: 一种用于通过在数据写入时减小每个非易失性存储单元的阈值电压的变化来加速数据写入和降低功耗的方法。 当在存储单元中写入数据时,约8V的电压被施加到存储器栅极线,大约5V的电压被施加到源极线,大约1.5V的电压分别施加到所选择的栅极线。 此时,在写入电路中,写入脉冲为0,写入锁存器输出高电平信号,NAND电路输出低电平信号。 并且,在恒定电流源晶体管中流动约1AA的恒定电流,并且通过约1μA的恒定电流放电位线以使存储器单元中的电流流动。

    Nonvolatile Semiconductor Memory Device
    15.
    发明申请
    Nonvolatile Semiconductor Memory Device 有权
    非易失性半导体存储器件

    公开(公告)号:US20100322013A1

    公开(公告)日:2010-12-23

    申请号:US12873679

    申请日:2010-09-01

    IPC分类号: G11C16/04 H01L29/792

    摘要: In a situation where a memory cell includes an ONO film, which comprises a silicon nitride film for charge storage and oxide films positioned above and below the silicon nitride film; a memory gate above the ONO film; a select gate, which is adjacent to a lateral surface of the memory gate via the ONO film; a gate insulator positioned below the select gate; a source region; and a drain region, an erase operation is performed by injecting holes generated by BTBT into the silicon nitride film while applying a positive potential to the source region, applying a negative potential to the memory gate, applying a positive potential to the select gate, and flowing a current from the drain region to the source region, thus improving the characteristics of a nonvolatile semiconductor memory device.

    摘要翻译: 在存储单元包括ONO膜的情况下,其包括用于电荷存储的氮化硅膜和位于氮化硅膜上方和下方的氧化膜; 在ONO电影上方的记忆门; 选择栅极,其经由ONO膜与存储栅的侧表面相邻; 位于选择门下方的栅极绝缘体; 源区; 和漏极区域,通过将BTBT产生的空穴注入氮化硅膜,同时向源极区域施加正电位,向存储栅极施加负电位,向选择栅极施加正电位,进行擦除操作,以及 使电流从漏极区域流向源极区域,从而改善非易失性半导体存储器件的特性。

    Nonvolatile semiconductor memory device with tapered sidewall gate and method of manufacturing the same
    19.
    发明授权
    Nonvolatile semiconductor memory device with tapered sidewall gate and method of manufacturing the same 有权
    具有锥形侧壁栅极的非易失性半导体存储器件及其制造方法

    公开(公告)号:US07235441B2

    公开(公告)日:2007-06-26

    申请号:US10901347

    申请日:2004-07-29

    IPC分类号: H01L21/336

    摘要: In a split gate type nonvolatile memory cell in which a MOS transistor for a nonvolatile memory using a charge storing film and a MOS transistor for selecting it are adjacently formed, the charge storing characteristic is improved and the resistance of the gate electrode is reduced. In order to prevent the thickness reduction at the corner portion of the charge storing film and improve the charge storing characteristic, a taper is formed on the sidewall of the select gate electrode. Also, in order to stably perform a silicide process for reducing the resistance of the self-aligned gate electrode, the sidewall of the select gate electrode is recessed. Alternatively, a discontinuity is formed between the upper portion of the self-aligned gate electrode and the upper portion of the select gate electrode.

    摘要翻译: 在其中使用电荷存储膜的非易失性存储器的MOS晶体管和用于选择它的MOS晶体管相邻形成的分离栅极型非易失性存储单元中,电荷存储特性得到改善,栅电极的电阻降低。 为了防止电荷存储薄膜的拐角部分的厚度减小并且提高电荷存储特性,在选择栅电极的侧壁上形成锥形。 此外,为了稳定地进行用于降低自对准栅电极的电阻的硅化物工艺,选择栅电极的侧壁凹陷。 或者,在自对准栅电极的上部和选择栅电极的上部之间形成不连续。