公开(公告)号：US20130292160A1

公开(公告)日：2013-11-07

申请号：US13939801

申请日：2013-07-11

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor： Yong Suk YANG ,  In-Kyu YOU ,  Jae Bon KOO ,  Yong-Young NOH

IPC: H01L21/48 ,  H05K1/09 ,  H05K1/03 ,  H05K1/02

CPC classification number: H01L21/4814 ,  H01L21/4867 ,  H01L23/49822 ,  H01L2924/0002 ,  H05K1/0277 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/0313 ,  H05K1/09 ,  H05K3/105 ,  H05K3/125 ,  H05K3/4069 ,  H05K2203/1105 ,  H05K2203/125 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

Abstract: Provided are a multi-layer interconnection structure and a manufacturing method thereof. The multi-layer interconnection structure includes a substrate; a first wiring on the substrate; an interlayer insulation layer on the first wiring; a second wiring on the interlayer insulation layer; and a via contact including at least one conductive filament penetrating through the interlayer insulation layer between the second wiring and the first wiring to be electrically connected to the first wiring and the second wiring.

Abstract translation: 提供一种多层互连结构及其制造方法。 多层互连结构包括基板; 在基板上的第一布线; 第一布线上的层间绝缘层; 层间绝缘层上的第二布线; 以及通孔接触，其包括穿过所述第二布线和所述第一布线之间的所述层间绝缘层的至少一个导电丝，以电连接到所述第一布线和所述第二布线。

公开(公告)号：US20210055246A1

公开(公告)日：2021-02-25

申请号：US16684214

申请日：2019-11-14

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor： Woo Seok YANG ,  Sunghoon HONG ,  Yong Suk YANG ,  Bonjin KOO

IPC: G01N27/22 ,  H01G4/008 ,  H01G4/14 ,  H01G4/40 ,  H01Q1/22 ,  G06K19/07

Abstract: Provided is a humidity sensor including a support body, an RFID chip, an antenna, and a capacitor on the support body, a top cover sheet on the RFID chip and the antenna, and a hydrophobic material pattern on the capacitor, wherein the capacitor is exposed by the top cover sheet, the hydrophobic material pattern has a network shape including a plurality of holes, and an electrostatic capacitance of the capacitor changes according to humidity.

公开(公告)号：US20200180223A1

公开(公告)日：2020-06-11

申请号：US16788413

申请日：2020-02-12

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor： Ji-Young OH ,  Yong Suk YANG ,  Kyung Hyun KIM ,  Kyu Sung LEE

IPC: B29C64/209 ,  B29C64/241 ,  B29C64/165 ,  B29C64/171 ,  B33Y10/00 ,  B33Y30/00 ,  B29C64/106

Abstract: Disclosed are a system for and a method of manufacturing a three-dimensional (3D) structure. The method may include injecting a fluid with a first pressure toward a surface of a first output layer to form a softening layer in the first output layer, injecting the fluid with a second pressure toward the softening layer to form an uneven structure in the softening layer, the second pressure being higher than the first pressure, and forming a second output layer on the softening layer with the uneven structure.

公开(公告)号：US20180045856A1

公开(公告)日：2018-02-15

申请号：US15671922

申请日：2017-08-08

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE ,  KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION

Inventor： Sunghoon HONG ,  Heon LEE ,  Yong Suk YANG ,  In-Kyu YOU ,  Soo-Jung KIM ,  Hak-Jong CHOI

IPC: G02B1/00

CPC classification number: G02B1/007

Abstract: A metamaterial structure may include a first nanoparticle and a second nanoparticle containing a different material from the first nanoparticle. The first and second nanoparticles may be provided to be adjacent to each other and to be in an electrically-coupled state.

公开(公告)号：US20160298215A1

公开(公告)日：2016-10-13

申请号：US15094643

申请日：2016-04-08

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE ,  Daelim Chemical Co., Ltd.

Inventor： Yong Suk YANG ,  Hong Hyun SHIN ,  In-Kyu YOU ,  Sunghoon HONG

IPC: C22C28/00 ,  B22D21/00 ,  C22C13/00 ,  C22C1/02 ,  C22C13/02 ,  B22F1/00 ,  B22F1/02 ,  B22D23/00 ,  C22C12/00

Abstract: Provided is a metal material for 3D printing, the metal material including an alloy that includes a eutectic metal, and a metal particle, wherein the melting point of the alloy is about 100° C. to about 300° C., and the melting point of the metal particle exceeds about 300° C.

Abstract translation: 提供了一种用于3D印刷的金属材料，金属材料包括包含共晶金属的合金和金属颗粒，其中合金的熔点为约100℃至约300℃，熔点 的金属颗粒超过约300℃

公开(公告)号：US20140205747A1

公开(公告)日：2014-07-24

申请号：US14225745

申请日：2014-03-26

Applicant: Electronics and Telecommunications Research Institute

Inventor： Yong Suk YANG ,  In-Kyu YOU ,  Jae Bon KOO ,  Su Jae LEE ,  Taeyoub KIM ,  Soon-Won JUNG ,  Kang-Jun BAEG

IPC: H01B13/06 ,  H01B13/00

CPC classification number: H01B13/06 ,  H01B3/421 ,  H01B7/0838 ,  H01B7/0861 ,  H01B13/0013

Abstract: A flexible flat cable which includes wire cores, insulation coating layers surrounding the wire cores, shield coating layers surrounding the insulation coating layers, an upper insulation plate layer formed on the shield coating layers, a lower insulation plate layer formed under the shield coating layers and opposite to the upper insulation plate layer, and a shield plate layer formed under the lower insulation plate layer.

Abstract translation: 一种柔性扁平电缆，包括线芯，围绕线芯的绝缘涂层，围绕绝缘涂层的屏蔽涂层，形成在屏蔽涂层上的上绝缘板层，形成在屏蔽涂层下面的下绝缘板层，以及 与上绝缘板层相对，以及形成在下绝缘板层下方的屏蔽板层。