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    STRETCHABLE TRANSPARENT ELECTRODE AND METHOD OF FABRICATING SAME
    5.
    发明申请
    STRETCHABLE TRANSPARENT ELECTRODE AND METHOD OF FABRICATING SAME 审中-公开
    可变透明电极及其制造方法

    公开(公告)号：US20160234930A1

    公开(公告)日：2016-08-11

    申请号：US14869424

    申请日：2015-09-29

    申请人： ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

    发明人： Chan Woo PARK ,  Jae Bon KOO ,  Bock Soon NA ,  Ji-Young OH ,  Sang Seok LEE ,  Soon-Won JUNG

    IPC分类号： H05K1/02 ,  H05K3/10 ,  H05K3/00 ,  H05K1/09 ,  H05K1/03

    CPC分类号： H05K1/0283

    摘要： Provided is a stretchable transparent electrode including a first substrate having an uneven surface, a first conductive film conformally covering the uneven surface of the first substrate to have an uneven top surface, a second conductive film conformally covering the first conductive film to have an uneven top surface, and a second substrate covering the second conductive film, wherein one of the first and second conductive films is a metal film and the other is a graphene film.

    摘要翻译： 本发明提供一种具有不平坦表面的第一基板的可拉伸透明电极，保形地覆盖第一基板的不平坦表面以具有不平坦的顶表面的第一导电膜，保形地覆盖第一导电膜以具有不平坦顶部的第二导电膜 表面和覆盖第二导电膜的第二基板，其中第一和第二导电膜之一是金属膜，另一个是石墨烯膜。

    STRETCHABLE DEVICE AND MANUFACTURING METHOD THEREOF
    6.
    发明申请
    STRETCHABLE DEVICE AND MANUFACTURING METHOD THEREOF 审中-公开
    可扩展设备及其制造方法

    公开(公告)号：US20150173186A1

    公开(公告)日：2015-06-18

    申请号：US14280205

    申请日：2014-05-16

    申请人： Electronics and Telecommunications Research Institute

    发明人： Bock Soon NA ,  Soon-Won JUNG ,  Jae Bon KOO ,  Chan Woo PARK ,  Sang Chul LIM ,  Sang Seok LEE ,  Kyoung Ik CHO ,  Hye Yong CHU

    IPC分类号： H05K1/03 ,  H05K3/10 ,  H05K3/36 ,  H05K3/02

    CPC分类号： H05K1/0283 ,  H05K2201/017 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/10151 ,  Y10T29/49156 ,  Y10T29/49158 ,  Y10T29/49162

    摘要： Provided is a stretchable devices. The stretchable device includes a first stretchable substrate having a first wavy surface that wrinkles in a first direction; first wiring lines extending along the first wavy surface in the first direction; a second stretchable substrate having a second wavy surface that faces the first wavy surface and wrinkles in a second direction intersecting the first direction, wherein the second stretchable substrate is disposed on the first stretchable substrate; second wiring lines extending along the second wavy surface in the second direction; and interlayer insulating layers disposed on the intersections of the first wiring lines and the second wiring lines and disposed between the first wiring lines and the second wiring lines.

    摘要翻译： 提供了一种可拉伸的装置。 该可拉伸装置包括：具有在第一方向上折皱的第一波状表面的第一可拉伸基底; 第一布线沿着第一方向沿第一波浪形表面延伸; 第二可拉伸基板，具有面向第一波状面的第二波状表面，并且沿与第一方向交叉的第二方向起皱纹，其中第二可拉伸基板设置在第一可拉伸基板上; 第二布线沿第二波形表面沿第二方向延伸; 以及层间绝缘层，其设置在第一布线和第二布线的交点上，并布置在第一布线和第二布线之间。

    ELECTRONIC CIRCUIT AND METHOD OF FABRICATING THE SAME
    7.
    发明申请
    ELECTRONIC CIRCUIT AND METHOD OF FABRICATING THE SAME 审中-公开
    电子电路及其制造方法

    公开(公告)号：US20140218872A1

    公开(公告)日：2014-08-07

    申请号：US14089378

    申请日：2013-11-25

    申请人： Electronics and Telecommunications Research Institute

    发明人： Chan Woo PARK ,  Jae Bon KOO ,  Soon-Won JUNG ,  Bock Soon NA ,  Sang Chul LIM ,  Ji-Young OH ,  Hye Yong CHU

    IPC分类号： H05K1/02 ,  H05K3/00

    CPC分类号： H05K1/0283 ,  H05K1/0287 ,  H05K1/185 ,  H05K2201/10151

    摘要： Provided is an electronic circuit. The electronic circuit includes: a substrate including a device region and a wiring region; an electronic device disposed on the device region; and a conductive wire disposed on the wiring region and connected to the electronic device, wherein the substrate has a first side where the electronic device and the conductive wire contact and a second side facing the first side; the first side and the second side of the wiring region have a convex structure; the first side of the device region is flat; and the device region is thicker than the wiring region.

    摘要翻译： 提供电子电路。 电子电路包括：包括器件区域和布线区域的衬底; 设置在所述设备区域上的电子设备; 以及设置在所述布线区域上并连接到所述电子设备的导线，其中所述基板具有所述电子设备和所述导电线接触的第一侧和面向所述第一侧的第二侧; 布线区域的第一面和第二面具有凸形结构; 设备区域的第一侧是平坦的; 并且器件区域比布线区域厚。

    STRETCHABLE ELECTRONIC DEVICE
    8.
    发明公开
    STRETCHABLE ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20230384832A1

    公开(公告)日：2023-11-30

    申请号：US18315247

    申请日：2023-05-10

    申请人： Electronics and Telecommunications Research Institute

    发明人： Jae Bon KOO ,  Ji-Young OH ,  Himchan OH ,  Chan Woo PARK

    IPC分类号： G06F1/16

    CPC分类号： G06F1/1652

    摘要： Provided is a stretchable electronic device. The stretchable electronic device includes: a substrate; a plurality of electronic elements disposed on the substrate; and a line part configured to connect the electronic elements on the substrate and having a curved portion. Here, the line part includes: an insulator; and a plurality of metal lines disposed on the insulator, and the metal lines include: outermost metal lines adjacent to edges of the insulator; and inner metal lines disposed between the outermost metal lines. Also, a first ratio of a first distance between the outermost metal lines and the edges of the insulator to a first width of each of the outermost metal lines is greater than a second ratio of a second distance between the inner metal lines to a second width of each of the inner metal lines.

    ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME
    9.
    发明申请
    ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME 有权
    电子设备及其制造方法

    公开(公告)号：US20150348800A1

    公开(公告)日：2015-12-03

    申请号：US14610410

    申请日：2015-01-30

    申请人： ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

    发明人： Kyoung Ik CHO ,  Jae Bon KOO ,  Chan Woo PARK ,  Bock Soon NA ,  Sang Seok LEE ,  Sang Chul LIM ,  Soon-Won JUNG ,  Hye Yong CHU

    IPC分类号： H01L21/311 ,  H01L29/66 ,  H01L29/786

    CPC分类号： H01L29/78603 ,  H01L21/3105 ,  H01L21/31058 ,  H01L21/31144 ,  H01L27/1218 ,  H01L27/1266 ,  H01L29/66742

    摘要： Provided is a method for fabricating an electronic device, the method including: preparing a carrier substrate including an element region and a wiring region; forming a sacrificial layer on the carrier substrate; forming an electronic element on the sacrificial layer of the element region; forming a first elastic layer having a corrugated surface on the first elastic layer of the wiring region; forming a metal wirings electrically connecting the electronic element thereto, on the first elastic layer of the wiring region; forming a second elastic layer covering the metal wirings, on the first elastic layer; forming a high rigidity pattern filling in a recess of the second elastic layer above the electronic element so as to overlap the electronic element, and having a corrugated surface; forming a third elastic layer on the second elastic layer and the high rigidity pattern; and separating the carrier substrate.

    摘要翻译： 本发明提供一种电子器件的制造方法，该方法包括：制备包括元件区域和布线区域的载体衬底; 在载体基板上形成牺牲层; 在元件区域的牺牲层上形成电子元件; 在布线区域的第一弹性层上形成具有波纹状表面的第一弹性层; 在布线区域的第一弹性层上形成电连接电子元件的金属配线; 在所述第一弹性层上形成覆盖所述金属布线的第二弹性层; 在所述电子元件上方的所述第二弹性层的凹部中形成高刚性图案，以与所述电子元件重叠，并具有波纹状表面; 在第二弹性层上形成第三弹性层和高刚性图案; 并分离载体衬底。