公开(公告)号：US10730148B2

公开(公告)日：2020-08-04

申请号：US15477608

申请日：2017-04-03

Applicant: FANUC CORPORATION

Inventor： Akinori Ohyama ,  Tatsuya Mochizuki ,  Takashi Izumi ,  Atsushi Mori

IPC: B23K26/60 ,  B23K26/70 ,  B23K26/03 ,  B23K26/04

Abstract: A laser processing device having a function for reducing intensity of a reflected laser beam, without stopping laser oscillation, in order to avoid a malfunction due to the reflected beam. A controller for controlling a laser oscillator has: a laser processing commanding part configured to output a laser processing command; a memory configured to store monitored intensity of the reflected beam and a laser output condition; a pre-processing commanding part configured to command a pre-processing prior to the laser processing command; a comparing part configured to compare the stored intensity of the reflected beam to a first judgment value and/or a second judgment value lower than the first judgment value; an output condition changing part configured to set or change the laser output command of the pre-processing command based on a comparison result; and a pre-processing terminating part configured to terminate the pre-processing based on a predetermined condition.

公开(公告)号：US20200061745A1

公开(公告)日：2020-02-27

申请号：US16540525

申请日：2019-08-14

Applicant: Fanuc Corporation

Inventor： Takashi Izumi

IPC: B23K26/14 ,  B23K26/06

Abstract: A laser processing system that can effectively blow out a material of a workpiece melted by a laser beam by effectively utilizing an assist gas emitted from a nozzle. The laser processing system comprises a nozzle including an emission opening configured to emit a jet of an assist gas along an optical axis of a laser beam, the nozzle being configured to forming a maximum point of velocity of the jet at a position away from the emission opening; a measuring instrument configured to measure the velocity of the jet; and a position acquisition section configured to acquire information representing a position of the maximum point based on output data of the measuring instrument.

公开(公告)号：US10556295B2

公开(公告)日：2020-02-11

申请号：US16105592

申请日：2018-08-20

Applicant: FANUC CORPORATION

Inventor： Takashi Izumi

IPC: B23K26/70 ,  B23K26/064 ,  B23K26/08

Abstract: A laser machining device includes a contamination determining part that determines contamination of an external optical system before laser machining; the contamination determining part includes a lens contamination determining section that determines contamination of a lens in the external optical system on the basis of a comparison between a first measurement value, which is measured by an energy amount measuring part in a state where the external optical system is not heated, and a second measurement value, which is measured by the energy amount measuring part in a state where the external optical system is heated.

公开(公告)号：US20190160599A1

公开(公告)日：2019-05-30

申请号：US16191615

申请日：2018-11-15

Applicant: FANUC CORPORATION

Inventor： Takashi Izumi

IPC: B23K26/70 ,  B23K26/06 ,  B23K26/067 ,  B23K26/60

Abstract: A laser machining device includes a reflective plate disposed perpendicular to the optical axis of emitting light and having a constant reflectance to the emitting light; a return light measurement unit which measures intensity distribution of return light reflected off the reflective plate and returning to the external optical system via a beam splitter; a storage unit which stores the return light intensity distribution in a normal state as reference data; a preprocessing unit which performs processing of identifying at least one of an optical axis shift, a beam diameter anomaly, a mode anomaly, a ghost, contamination of a protective window, and a focus shift due to thermal lens effect on the basis of comparison between measurement data of the return light intensity distribution and the reference data, before laser machining; and a warning unit which warns of an anomaly in the external optical system in accordance with the preprocessing unit.

公开(公告)号：US20170282301A1

公开(公告)日：2017-10-05

申请号：US15477608

申请日：2017-04-03

Applicant: FANUC CORPORATION

Inventor： Akinori Ohyama ,  Tatsuya Mochizuki ,  Takashi Izumi ,  Atsushi Mori

IPC: B23K26/70 ,  B23K26/04 ,  B23K26/03

Abstract: A laser processing device having a function for reducing intensity of a reflected laser beam, without stopping laser oscillation, in order to avoid a malfunction due to the reflected beam. A controller for controlling a laser oscillator has: a laser processing commanding part configured to output a laser processing command; a memory configured to store monitored intensity of the reflected beam and a laser output condition; a pre-processing commanding part configured to command a pre-processing prior to the laser processing command; a comparing part configured to compare the stored intensity of the reflected beam to a first judgment value and/or a second judgment value lower than the first judgment value; an output condition changing part configured to set or change the laser output command of the pre-processing command based on a comparison result; and a pre-processing terminating part configured to terminate the pre-processing based on a predetermined condition.

公开(公告)号：US20170082587A1

公开(公告)日：2017-03-23

申请号：US15266020

申请日：2016-09-15

Applicant: FANUC CORPORATION

Inventor： Takashi Izumi

IPC: G01N33/00 ,  B23K26/70 ,  B23K26/14 ,  H01S3/00 ,  B23K26/142

CPC classification number: G01N33/0036 ,  B23K26/128 ,  B23K26/142 ,  B23K26/1437 ,  B23K26/707 ,  H01S3/0071

Abstract: A laser processing system herein includes a laser oscillator, a laser optical path that guides laser beam from the laser oscillator to a workpiece, a purge gas supply line for supplying a purge gas into the laser optical path, oxygen sensor and an impure gas sensor which detects an impure gas influencing the propagation of the laser beam that are installed in the laser optical path, and an impure gas sensor output value correction unit. The impure gas sensor output value correction unit corrects an output value of the impure gas sensor based on an output value of the oxygen sensor.

公开(公告)号：US20230390867A1

公开(公告)日：2023-12-07

申请号：US18032233

申请日：2021-10-25

Applicant: Fanuc Corporation

Inventor： Takashi Izumi

IPC: B23K26/21 ,  B23K26/10 ,  B23K26/53 ,  B23K26/06

CPC classification number: B23K26/21 ,  B23K26/10 ,  B23K26/53 ,  B23K26/0643

Abstract: In a method for laser welding of workpieces W1 and W2, a laser beam is generated and a workpiece W1 is irradiated. An irradiation point of the laser beam is swung within a predetermined heating area on the workpiece W1 encompassing a welding location where laser welding is to be executed, heating the mating surface area of the workpieces W1 and W2 corresponding to the heating area to a temperature higher than or equal to the boiling point of the coating material of the workpiece W2 and lower than the melting point of the base material of the workpiece W1, forming a gap between the workpieces W1 and W2 by vaporizing the coating material by the heating, discharging the coating material through the gap to the outside of the mating surface area, and melting and welding together the welding location of the base materials of the workpieces W1 and W2.

公开(公告)号：US11554444B2

公开(公告)日：2023-01-17

申请号：US16820120

申请日：2020-03-16

Applicant: Fanuc Corporation

Inventor： Ryousuke Nakamura ,  Takashi Izumi

IPC: B23K26/14 ,  B23K26/064 ,  B23K26/03 ,  B23K26/04 ,  B23K26/06

Abstract: A laser machine able to effectively satisfy cutting quality required on one side of a cutting spot of a workpiece. The laser machine comprising a machining head configured to emit a laser beam and an assist gas coaxially and non-coaxially; and a data table in which data of a machining condition for cutting a workpiece using the machining head, and a shift amount, by which a center axis of the assist gas is to be shifted from an optical axis of the laser beam in order to make cutting quality on both sides of a cutting line to be different during cutting the workpiece, are stored in associated with each other.

公开(公告)号：US11478876B2

公开(公告)日：2022-10-25

申请号：US16539352

申请日：2019-08-13

Applicant: Fanuc Corporation

Inventor： Takashi Izumi

IPC: B23K26/14 ,  B23K26/02 ,  B23K26/08 ,  B23K26/70 ,  B23K26/354 ,  B23K26/142

Abstract: A laser processing system that can effectively blow out a material of a workpiece melted by a laser beam by effectively utilizing an assist gas emitted from a nozzle. The laser processing system comprising a nozzle including an emission opening configured to emit a jet of an assist gas along an optical axis of a laser beam, the nozzle being configured to form a maximum point of velocity of the jet at a position away from the emission opening; a measuring instrument configured to measure a sound generated by the jet impinging on an object; and a position acquisition section configured to acquire information representing the position of the maximum point based on output data of the measuring instrument.

公开(公告)号：US10761037B2

公开(公告)日：2020-09-01

申请号：US16194654

申请日：2018-11-19

Applicant: FANUC CORPORATION

Inventor： Takashi Izumi

IPC: G01N21/956 ,  B23K26/03 ,  B23K26/06 ,  B23K26/70 ,  G01N21/94 ,  G01M11/02 ,  G01N21/958 ,  G01N21/55

Abstract: A laser processing device includes a beam splitter disposed between a focusing lens and a protective window, a return light measurement unit configured to measure intensity distribution of a return light reflected from a workpiece and returning to an external optical system via the beam splitter, a storage unit configured to store at least one of normal pattern data representing the intensity distribution of the return light when the protective window is in normal condition and abnormal pattern data representing the intensity distribution of the return light when the protective window is contaminated, a processing unit configured to perform a process of detecting contamination of the protective window during laser processing based on measurement data about the return light and at least one of the normal pattern data and the abnormal pattern data, and a warning unit configured to warn of contamination of the protective window in accordance with the process.