Laser processing device capable of reducing intensity of reflected laser beam

    公开(公告)号:US10730148B2

    公开(公告)日:2020-08-04

    申请号:US15477608

    申请日:2017-04-03

    Abstract: A laser processing device having a function for reducing intensity of a reflected laser beam, without stopping laser oscillation, in order to avoid a malfunction due to the reflected beam. A controller for controlling a laser oscillator has: a laser processing commanding part configured to output a laser processing command; a memory configured to store monitored intensity of the reflected beam and a laser output condition; a pre-processing commanding part configured to command a pre-processing prior to the laser processing command; a comparing part configured to compare the stored intensity of the reflected beam to a first judgment value and/or a second judgment value lower than the first judgment value; an output condition changing part configured to set or change the laser output command of the pre-processing command based on a comparison result; and a pre-processing terminating part configured to terminate the pre-processing based on a predetermined condition.

    LASER PROCESSING DEVICE CAPABLE OF REDUCING INTENSITY OF REFLECTED LASER BEAM

    公开(公告)号:US20170282301A1

    公开(公告)日:2017-10-05

    申请号:US15477608

    申请日:2017-04-03

    Abstract: A laser processing device having a function for reducing intensity of a reflected laser beam, without stopping laser oscillation, in order to avoid a malfunction due to the reflected beam. A controller for controlling a laser oscillator has: a laser processing commanding part configured to output a laser processing command; a memory configured to store monitored intensity of the reflected beam and a laser output condition; a pre-processing commanding part configured to command a pre-processing prior to the laser processing command; a comparing part configured to compare the stored intensity of the reflected beam to a first judgment value and/or a second judgment value lower than the first judgment value; an output condition changing part configured to set or change the laser output command of the pre-processing command based on a comparison result; and a pre-processing terminating part configured to terminate the pre-processing based on a predetermined condition.

    Machining condition setting device and 3D laser machining system

    公开(公告)号:US11167377B2

    公开(公告)日:2021-11-09

    申请号:US16594659

    申请日:2019-10-07

    Abstract: A 3D laser machining system comprises: a move state simulation unit that simulates a move state of a machining head using 3D CAD data about a workpiece containing material information defining thermophysical properties and 3D CAD data about a machining head under a condition of moving the machining head relative to the workpiece while the machining head is maintained at a predetermined angle a predetermined distance along a machining line in virtual space; a thermal fluid simulation unit that conducts non-stationary thermal fluid simulation for obtaining a temperature distribution in a region covering the workpiece to be changed by the move of the machining head outputting a laser beam; and a machining condition setting unit that sets a laser machining condition containing a relative move condition for the machining head and a laser beam output condition before laser machining on the basis of results of the simulations.

    LASER PROCESSING DEVICE HAVING APPROACH FUNCTION OF PROCESSING HEAD

    公开(公告)号:US20170219808A1

    公开(公告)日:2017-08-03

    申请号:US15416609

    申请日:2017-01-26

    Abstract: A laser processing device configured to generally vertically irradiate a laser beam to a workpiece, and having a function for reducing an adverse effect due to a reflected laser beam from the workpiece. The laser processing device includes: a light condensing point moving part configured to move a focal point in an optical axis direction while irradiating the laser beam, by moving at least one of a processing head, an optical component of a light condense optical system, and a workpiece; and a light condensing point distance setting part configured to set a light condensing point distance between the light condensing point and a workpiece surface when the laser beam is started to be irradiated, wherein the light condensing point distance is set so that an amount of the reflected laser beam returned to the processing head through the optical system is not more than an allowable value.

    Laser processing device capable of starting laser processing while reducing reflected laser beam

    公开(公告)号:US10722975B2

    公开(公告)日:2020-07-28

    申请号:US15443292

    申请日:2017-02-27

    Abstract: A laser processing device for efficiently starting laser processing, while eliminating an adverse effect due to a reflected laser beam from a workpiece. The laser processing device detects an intensity of a reflected beam, which is a part of a laser beam irradiated from a laser oscillator and then is reflected by a workpiece surface, continuously increases an intensity of the irradiating laser beam over a predetermined period of time, selects a content of a next process, based on a temporal change in the intensity of the detected reflected beam, and executes the next process subsequent to the laser processing, based on the selected content of the next process.

    Laser processing device having approach function of processing head

    公开(公告)号:US10928615B2

    公开(公告)日:2021-02-23

    申请号:US15416609

    申请日:2017-01-26

    Abstract: A laser processing device configured to generally vertically irradiate a laser beam to a workpiece, and having a function for reducing an adverse effect due to a reflected laser beam from the workpiece. The laser processing device includes: a light condensing point moving part configured to move a focal point in an optical axis direction while irradiating the laser beam, by moving at least one of a processing head, an optical component of a light condense optical system, and a workpiece; and a light condensing point distance setting part configured to set a light condensing point distance between the light condensing point and a workpiece surface when the laser beam is started to be irradiated, wherein the light condensing point distance is set so that an amount of the reflected laser beam returned to the processing head through the optical system is not more than an allowable value.

    LASER PROCESSING DEVICE CAPABLE OF STARTING LASER PROCESSING WHILE REDUCING REFLECTED LASER BEAM

    公开(公告)号:US20170246708A1

    公开(公告)日:2017-08-31

    申请号:US15443292

    申请日:2017-02-27

    Abstract: A laser processing device having a function for efficiently starting laser processing, while eliminating an adverse effect due to a reflected laser beam from a workpiece. The laser processing device has: a reflected beam intensity detecting part for detecting an intensity of a reflected beam, which is a part of a laser beam irradiated from a laser oscillator and then is reflected by a workpiece surface; a beam intensity increasing part for continuously increasing an intensity of the irradiating laser beam over a predetermined period of time; a next process selecting part for selecting a content of a next process, based on a temporal change in the intensity of the detected reflected beam, during the intensity of the irradiating laser beam is increased; and an executing part for executing the next process subsequent to the laser processing, based on the selected content of the next process.

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