公开(公告)号：US20180215925A1

公开(公告)日：2018-08-02

申请号：US15937886

申请日：2018-03-28

Applicant: FUJIFILM CORPORATION

Inventor： Yusuke HATANAKA

IPC: C09D4/06 ,  C09D5/00 ,  C09D7/61

CPC classification number: C09D4/06 ,  B32B27/20 ,  B32B27/30 ,  C08F220/58 ,  C08K3/36 ,  C09D5/00 ,  C09D5/165 ,  C09D5/1668 ,  C09D7/40 ,  C09D7/61 ,  C09D133/26

Abstract: Provided are an antifouling film, which includes silica particles (a), a polymer (b) having an acrylamide structure and at least one substituent selected from the group consisting of —SO3M and —COOM, and a polymer (c) having an acrylamide structure and a hydrocarbon group having 2 to 20 carbon atoms, and a composition for forming an antifouling film, an antifouling film laminate, and a method for manufacturing an antifouling film which are applications of the antifouling film. M represents a hydrogen atom or represents an atom or an atomic group which can become a cation by being dissociated.

公开(公告)号：US20130252443A1

公开(公告)日：2013-09-26

申请号：US13853819

申请日：2013-03-29

Applicant: FUJIFILM CORPORATION

Inventor： Yoshinori HOTTA ,  Yusuke HATANAKA

IPC: H01R12/70 ,  H05K3/36

CPC classification number: H01R12/7082 ,  G01R1/0735 ,  G01R31/2889 ,  H01R12/732 ,  H01R13/2407 ,  H05K3/361 ,  Y10T29/49126

Abstract: An anisotropic conductive member is connected to a rigid circuit board having a first electrode and a flexible circuit board having a second electrode as a land. A plurality of conductive paths penetrate an insulating base material of the anisotropic conductive member. Each conductive path has a first protrusion and a second protrusion on respective first and second surfaces of the insulating base. The height of the second protrusion is equal to or less than double the thickness of the land. The first protrusion contacts a part of the first electrode. The second protrusion contacts part of the land. The base of the anisotropic conductive member is pressed such that the insulating material is not in direct contact with the flexible circuit board. When attaching the boards, a pressure of 300 MPa to 1,000 MPa is applied to the surfaces of the lands to reduce circuit board breakage.

Abstract translation: 各向异性导电构件连接到具有第一电极的刚性电路板和具有第二电极作为平台的柔性电路板。 多个导电路径穿过各向异性导电构件的绝缘基材。 每个导电路径在绝缘基底的相应的第一和第二表面上具有第一突起和第二突起。 第二突起的高度等于或小于平台的厚度的两倍。 第一突起接触第一电极的一部分。 第二个突起接触土地的一部分。 各向异性导电构件的基部被按压，使得绝缘材料不与柔性电路板直接接触。 当安装板时，将300MPa至1,000MPa的压力施加到焊盘的表面以减少电路板断裂。